TW200737476A - Method for fabricating a flip chip substrate - Google Patents

Method for fabricating a flip chip substrate

Info

Publication number
TW200737476A
TW200737476A TW095110363A TW95110363A TW200737476A TW 200737476 A TW200737476 A TW 200737476A TW 095110363 A TW095110363 A TW 095110363A TW 95110363 A TW95110363 A TW 95110363A TW 200737476 A TW200737476 A TW 200737476A
Authority
TW
Taiwan
Prior art keywords
forming
patterned
layer
fabricating
carrier
Prior art date
Application number
TW095110363A
Other languages
English (en)
Chinese (zh)
Other versions
TWI299898B (enrdf_load_stackoverflow
Inventor
Bo-Wei Chen
Hsien-Shou Wang
Shih-Ping Hsu
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW095110363A priority Critical patent/TW200737476A/zh
Publication of TW200737476A publication Critical patent/TW200737476A/zh
Application granted granted Critical
Publication of TWI299898B publication Critical patent/TWI299898B/zh

Links

Landscapes

  • Wire Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW095110363A 2006-03-24 2006-03-24 Method for fabricating a flip chip substrate TW200737476A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095110363A TW200737476A (en) 2006-03-24 2006-03-24 Method for fabricating a flip chip substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095110363A TW200737476A (en) 2006-03-24 2006-03-24 Method for fabricating a flip chip substrate

Publications (2)

Publication Number Publication Date
TW200737476A true TW200737476A (en) 2007-10-01
TWI299898B TWI299898B (enrdf_load_stackoverflow) 2008-08-11

Family

ID=45069818

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110363A TW200737476A (en) 2006-03-24 2006-03-24 Method for fabricating a flip chip substrate

Country Status (1)

Country Link
TW (1) TW200737476A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106937478A (zh) * 2017-04-13 2017-07-07 戴永岗 在陶瓷基板上制作多层精密线路的产品结构及其制作工艺

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106937478A (zh) * 2017-04-13 2017-07-07 戴永岗 在陶瓷基板上制作多层精密线路的产品结构及其制作工艺
CN106937478B (zh) * 2017-04-13 2023-10-13 戴永岗 在陶瓷基板上制作多层精密线路的产品结构及其制作工艺

Also Published As

Publication number Publication date
TWI299898B (enrdf_load_stackoverflow) 2008-08-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees