TW200737453A - Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader - Google Patents

Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader

Info

Publication number
TW200737453A
TW200737453A TW095135997A TW95135997A TW200737453A TW 200737453 A TW200737453 A TW 200737453A TW 095135997 A TW095135997 A TW 095135997A TW 95135997 A TW95135997 A TW 95135997A TW 200737453 A TW200737453 A TW 200737453A
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
bonding
heat spreader
heat
semiconductor
Prior art date
Application number
TW095135997A
Other languages
English (en)
Inventor
Toshihisa Sato
Kenji Fukuzono
Masateru Koide
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of TW200737453A publication Critical patent/TW200737453A/zh

Links

Classifications

    • H10W40/70—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W72/01308—
    • H10W72/07311—
    • H10W72/877—
    • H10W72/931—
    • H10W74/15—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW095135997A 2006-03-28 2006-09-28 Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader TW200737453A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006086810A JP2007266150A (ja) 2006-03-28 2006-03-28 熱伝導性接合材、半導体パッケージ、ヒートスプレッダ、半導体チップ、及び半導体チップとヒートスプレッダとを接合する接合方法

Publications (1)

Publication Number Publication Date
TW200737453A true TW200737453A (en) 2007-10-01

Family

ID=38557587

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095135997A TW200737453A (en) 2006-03-28 2006-09-28 Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader

Country Status (3)

Country Link
US (1) US20070228530A1 (zh)
JP (1) JP2007266150A (zh)
TW (1) TW200737453A (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110309481A1 (en) * 2010-06-18 2011-12-22 Rui Huang Integrated circuit packaging system with flip chip mounting and method of manufacture thereof
JP2013115083A (ja) * 2011-11-25 2013-06-10 Fujitsu Semiconductor Ltd 半導体装置及びその製造方法
US9653373B2 (en) 2015-04-09 2017-05-16 Samsung Electronics Co., Ltd. Semiconductor package including heat spreader and method for manufacturing the same
US10770405B2 (en) * 2017-05-31 2020-09-08 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal interface material having different thicknesses in packages
US11410905B2 (en) 2019-03-18 2022-08-09 International Business Machines Corporation Optimized weight heat spreader for an electronic package
US20210028084A1 (en) * 2019-07-22 2021-01-28 Intel Corporation Variable-thickness integrated heat spreader (ihs)
WO2024073430A1 (en) * 2022-09-28 2024-04-04 Cisco Technology, Inc. Heatsink for ring type integrated circuits

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034468A (en) * 1976-09-03 1977-07-12 Ibm Corporation Method for making conduction-cooled circuit package
US4323914A (en) * 1979-02-01 1982-04-06 International Business Machines Corporation Heat transfer structure for integrated circuit package
DE3367149D1 (en) * 1982-12-16 1986-11-27 Hasler Ag Flat bag filled with heat-conducting liquid or paste
US5786635A (en) * 1996-12-16 1998-07-28 International Business Machines Corporation Electronic package with compressible heatsink structure
US6108208A (en) * 1997-12-08 2000-08-22 Unisys Corporation Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules
SE518446C2 (sv) * 1999-06-14 2002-10-08 Ericsson Telefon Ab L M Anordning vid kylning av elektroniska komponenter
US6461891B1 (en) * 1999-09-13 2002-10-08 Intel Corporation Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
US7369411B2 (en) * 2000-02-25 2008-05-06 Thermagon, Inc. Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink
US6614123B2 (en) * 2001-07-31 2003-09-02 Chippac, Inc. Plastic ball grid array package with integral heatsink
TW498516B (en) * 2001-08-08 2002-08-11 Siliconware Precision Industries Co Ltd Manufacturing method for semiconductor package with heat sink
US6504723B1 (en) * 2001-11-15 2003-01-07 Intel Corporation Electronic assembly having solder thermal interface between a die substrate and a heat spreader
US6665186B1 (en) * 2002-10-24 2003-12-16 International Business Machines Corporation Liquid metal thermal interface for an electronic module
US6921975B2 (en) * 2003-04-18 2005-07-26 Freescale Semiconductor, Inc. Circuit device with at least partial packaging, exposed active surface and a voltage reference plane
US7063127B2 (en) * 2003-09-18 2006-06-20 International Business Machines Corporation Method and apparatus for chip-cooling
JP2005136018A (ja) * 2003-10-29 2005-05-26 Denso Corp 半導体装置
US7439617B2 (en) * 2006-06-30 2008-10-21 Intel Corporation Capillary underflow integral heat spreader

Also Published As

Publication number Publication date
JP2007266150A (ja) 2007-10-11
US20070228530A1 (en) 2007-10-04

Similar Documents

Publication Publication Date Title
TW200620602A (en) Heat stud for stacked chip package
TW200709360A (en) Semiconductor die package and method for making the same
TW200635009A (en) Semiconductor packages and methods of manufacturing thereof
SG144124A1 (en) Copper wire bonding on organic solderability preservative materials
SG111226A1 (en) Semiconductor package with heat spreader
TW200943500A (en) Semiconductor package using an active type heat-spreading element
SG109529A1 (en) Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices
TW200733324A (en) Microelectronic package having direct contact heat spreader and method of manufacturing same
WO2009038984A3 (en) Microelectronic package and method of forming same
WO2010051211A3 (en) Pre-molded, clip-bonded multi-die semiconductor package
EP2214203A3 (en) Thermally enhanced semiconductor package
TW200743190A (en) A heat spreader for electrical device
SG125168A1 (en) Multi-leadframe semiconductor package and method of manufacture
WO2010088124A3 (en) Semiconductor device having a diamond substrate heat spreader
TW200744175A (en) Packaged device and methods for forming packaged devices
TW200601468A (en) Method for fabricating semiconductor package
TW200737453A (en) Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader
SG148973A1 (en) Semiconductor device package having pseudo chips
TW200739844A (en) Thermally enhanced semiconductor package and method of producing the same
TW200737376A (en) Chip package and fabricating method thereof
TW200614464A (en) Bottom heat spreader
TW200709456A (en) Semiconductor chip package and application device thereof
TWI369766B (en) Heat slug and semiconductor chip package
TW200610114A (en) Chip package for fixing heat spreader and method for packaging the same
SG122956A1 (en) Semiconductor package system with substrate heat sink