TW200737385A - Inspection method of semiconductor doping process - Google Patents
Inspection method of semiconductor doping processInfo
- Publication number
- TW200737385A TW200737385A TW095109641A TW95109641A TW200737385A TW 200737385 A TW200737385 A TW 200737385A TW 095109641 A TW095109641 A TW 095109641A TW 95109641 A TW95109641 A TW 95109641A TW 200737385 A TW200737385 A TW 200737385A
- Authority
- TW
- Taiwan
- Prior art keywords
- doping process
- semiconductor
- semiconductor doping
- inspection method
- precipitation
- Prior art date
Links
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The present invention provides an inspection method of semiconductor doping process, which is applied in inspecting whether there is precipitation of metal cluster or not in the semiconductor doping process. The inspection method comprises the following steps: (A) measure the impedance spectrum of semiconductors by a high-frequency complex impedance analyzer. (B) Pick the logarithm of the real part of the impedance spectrum as the horizontal axis, and pick the logarithm of the imaginary part of the impedance spectrum as the vertical axis, and find the characteristic slope. (C) If the characteristic slope is 0.5, then the semiconductor has only one kind of dielectric delay generated, i.e. there is no precipitation of metal cluster in the semiconductor doping process. Using the method provided by the present invention, it is simple, fast, and reliable to inspect whether there is precipitation of metal nanocluster or not in the semiconductor, so as to distinguish the quality of the semiconductor doping process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95109641A TWI275155B (en) | 2006-03-21 | 2006-03-21 | Inspection method of semiconductor doping process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95109641A TWI275155B (en) | 2006-03-21 | 2006-03-21 | Inspection method of semiconductor doping process |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI275155B TWI275155B (en) | 2007-03-01 |
TW200737385A true TW200737385A (en) | 2007-10-01 |
Family
ID=38624291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95109641A TWI275155B (en) | 2006-03-21 | 2006-03-21 | Inspection method of semiconductor doping process |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI275155B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI649959B (en) * | 2018-01-16 | 2019-02-01 | 東海大學 | Method for analyzing semiconductor components with multiple interfaces |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114720808B (en) * | 2022-06-09 | 2022-09-02 | 国网江西省电力有限公司电力科学研究院 | Nondestructive testing and positioning method for quality of conductor in middle section of cable |
-
2006
- 2006-03-21 TW TW95109641A patent/TWI275155B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI649959B (en) * | 2018-01-16 | 2019-02-01 | 東海大學 | Method for analyzing semiconductor components with multiple interfaces |
Also Published As
Publication number | Publication date |
---|---|
TWI275155B (en) | 2007-03-01 |
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