TW200733281A - Method and system for recognization - Google Patents

Method and system for recognization

Info

Publication number
TW200733281A
TW200733281A TW095125444A TW95125444A TW200733281A TW 200733281 A TW200733281 A TW 200733281A TW 095125444 A TW095125444 A TW 095125444A TW 95125444 A TW95125444 A TW 95125444A TW 200733281 A TW200733281 A TW 200733281A
Authority
TW
Taiwan
Prior art keywords
pattern
semiconductor substrate
defect
recognization
defect image
Prior art date
Application number
TW095125444A
Other languages
English (en)
Other versions
TWI316278B (en
Inventor
Chen-Ting Lin
Chi-Cheng Jou
Chih-Hung Wu
Chia-Hua Chang
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Publication of TW200733281A publication Critical patent/TW200733281A/zh
Application granted granted Critical
Publication of TWI316278B publication Critical patent/TWI316278B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW095125444A 2006-02-21 2006-07-12 Method and system for recognization TWI316278B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/358,664 US7760930B2 (en) 2006-02-21 2006-02-21 Translation engine of defect pattern recognition

Publications (2)

Publication Number Publication Date
TW200733281A true TW200733281A (en) 2007-09-01
TWI316278B TWI316278B (en) 2009-10-21

Family

ID=38428239

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125444A TWI316278B (en) 2006-02-21 2006-07-12 Method and system for recognization

Country Status (3)

Country Link
US (1) US7760930B2 (zh)
CN (1) CN100562982C (zh)
TW (1) TWI316278B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100750193B1 (ko) * 2006-06-16 2007-08-17 삼성전자주식회사 방향성 결함 분류 방법 및 이를 수행하기 위한 장치
JP2009270976A (ja) * 2008-05-08 2009-11-19 Hitachi High-Technologies Corp 欠陥レビュー方法および欠陥レビュー装置
FR2940449A1 (fr) 2008-12-24 2010-06-25 Snecma Procede de controle non destructif d'une piece mecanique
CN102789999A (zh) * 2012-08-16 2012-11-21 上海华力微电子有限公司 利用图形特征扫描的缺陷检测方法和半导体芯片制造方法
CN104730217B (zh) * 2015-04-16 2016-09-07 京东方科技集团股份有限公司 一种玻璃基板的缺陷分布显示方法及显示装置
US9846929B2 (en) * 2016-03-24 2017-12-19 Hong Kong Applied Science and Technology Research Institute Company Limited Fast density estimation method for defect inspection application
CN117348338B (zh) * 2023-10-08 2024-06-28 中山大学 一种掩模缺陷检测装置及方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4809308A (en) * 1986-02-20 1989-02-28 Irt Corporation Method and apparatus for performing automated circuit board solder quality inspections
JPS63156288A (ja) 1986-12-20 1988-06-29 Fujitsu Ltd パタ−ン検査装置
JP3392573B2 (ja) * 1994-03-31 2003-03-31 株式会社東芝 試料検査装置及び方法
JP4038356B2 (ja) * 2001-04-10 2008-01-23 株式会社日立製作所 欠陥データ解析方法及びその装置並びにレビューシステム
US20030072481A1 (en) * 2001-10-11 2003-04-17 Advanced Micro Devices, Inc. Method for evaluating anomalies in a semiconductor manufacturing process
US7106897B1 (en) * 2002-04-29 2006-09-12 Advanced Micro Devices, Inc. Universal spatial pattern recognition system
JP4479877B2 (ja) 2003-02-20 2010-06-09 谷電機工業株式会社 画像認識による不良検査方法

Also Published As

Publication number Publication date
CN101026113A (zh) 2007-08-29
CN100562982C (zh) 2009-11-25
US7760930B2 (en) 2010-07-20
TWI316278B (en) 2009-10-21
US20070196012A1 (en) 2007-08-23

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