TW200733217A - Method for grinding wafer - Google Patents

Method for grinding wafer

Info

Publication number
TW200733217A
TW200733217A TW095106381A TW95106381A TW200733217A TW 200733217 A TW200733217 A TW 200733217A TW 095106381 A TW095106381 A TW 095106381A TW 95106381 A TW95106381 A TW 95106381A TW 200733217 A TW200733217 A TW 200733217A
Authority
TW
Taiwan
Prior art keywords
wafer
active surface
protection layer
grinding
edge
Prior art date
Application number
TW095106381A
Other languages
Chinese (zh)
Other versions
TWI278033B (en
Inventor
Ming-Yu Huang
Ching-Sung Chu
Tsung-Ta Tsai
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW95106381A priority Critical patent/TWI278033B/en
Application granted granted Critical
Publication of TWI278033B publication Critical patent/TWI278033B/en
Publication of TW200733217A publication Critical patent/TW200733217A/en

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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention relates to a method for grinding wafer. The method of the invention comprises: (a) providing a wafer, the wafer having a active surface and a back surface corresponding to the active surface; (b) coating a protection layer on the active surface of the wafer, the protection layer totally covering the active surface and partially covering the edge; and (c) grinding the back surface of the wafer to thin the wafer. By utilizing the protection layer that totally covers the active surface and the partial wafer edge, the problems of wafer crack and wafer contamination can be avoided when the wafer is cut.
TW95106381A 2006-02-24 2006-02-24 Method for grinding wafer TWI278033B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95106381A TWI278033B (en) 2006-02-24 2006-02-24 Method for grinding wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95106381A TWI278033B (en) 2006-02-24 2006-02-24 Method for grinding wafer

Publications (2)

Publication Number Publication Date
TWI278033B TWI278033B (en) 2007-04-01
TW200733217A true TW200733217A (en) 2007-09-01

Family

ID=38626097

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95106381A TWI278033B (en) 2006-02-24 2006-02-24 Method for grinding wafer

Country Status (1)

Country Link
TW (1) TWI278033B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113514300A (en) * 2021-07-09 2021-10-19 长鑫存储技术有限公司 Semiconductor structure processing jig and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113514300A (en) * 2021-07-09 2021-10-19 长鑫存储技术有限公司 Semiconductor structure processing jig and manufacturing method thereof

Also Published As

Publication number Publication date
TWI278033B (en) 2007-04-01

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