TW200733217A - Method for grinding wafer - Google Patents
Method for grinding waferInfo
- Publication number
- TW200733217A TW200733217A TW095106381A TW95106381A TW200733217A TW 200733217 A TW200733217 A TW 200733217A TW 095106381 A TW095106381 A TW 095106381A TW 95106381 A TW95106381 A TW 95106381A TW 200733217 A TW200733217 A TW 200733217A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- active surface
- protection layer
- grinding
- edge
- Prior art date
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention relates to a method for grinding wafer. The method of the invention comprises: (a) providing a wafer, the wafer having a active surface and a back surface corresponding to the active surface; (b) coating a protection layer on the active surface of the wafer, the protection layer totally covering the active surface and partially covering the edge; and (c) grinding the back surface of the wafer to thin the wafer. By utilizing the protection layer that totally covers the active surface and the partial wafer edge, the problems of wafer crack and wafer contamination can be avoided when the wafer is cut.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95106381A TWI278033B (en) | 2006-02-24 | 2006-02-24 | Method for grinding wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW95106381A TWI278033B (en) | 2006-02-24 | 2006-02-24 | Method for grinding wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI278033B TWI278033B (en) | 2007-04-01 |
TW200733217A true TW200733217A (en) | 2007-09-01 |
Family
ID=38626097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95106381A TWI278033B (en) | 2006-02-24 | 2006-02-24 | Method for grinding wafer |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI278033B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113514300A (en) * | 2021-07-09 | 2021-10-19 | 长鑫存储技术有限公司 | Semiconductor structure processing jig and manufacturing method thereof |
-
2006
- 2006-02-24 TW TW95106381A patent/TWI278033B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113514300A (en) * | 2021-07-09 | 2021-10-19 | 长鑫存储技术有限公司 | Semiconductor structure processing jig and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI278033B (en) | 2007-04-01 |
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