TW200732272A - Aluminum nitride composite body, and manufacturing method of the same - Google Patents

Aluminum nitride composite body, and manufacturing method of the same

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Publication number
TW200732272A
TW200732272A TW095148142A TW95148142A TW200732272A TW 200732272 A TW200732272 A TW 200732272A TW 095148142 A TW095148142 A TW 095148142A TW 95148142 A TW95148142 A TW 95148142A TW 200732272 A TW200732272 A TW 200732272A
Authority
TW
Taiwan
Prior art keywords
aluminum nitride
manufacturing
same
composite body
nitride composite
Prior art date
Application number
TW095148142A
Other languages
English (en)
Other versions
TWI308908B (en
Inventor
Akiyoshi Hattori
Original Assignee
Ngk Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators Ltd filed Critical Ngk Insulators Ltd
Publication of TW200732272A publication Critical patent/TW200732272A/zh
Application granted granted Critical
Publication of TWI308908B publication Critical patent/TWI308908B/zh

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    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/003Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
    • C04B37/005Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts consisting of glass or ceramic material
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    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
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    • C04B35/58Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Resistance Heating (AREA)
TW095148142A 2005-12-27 2006-12-21 Aluminum nitride composite body, and manufacturing method of the same TWI308908B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US75413705P 2005-12-27 2005-12-27

Publications (2)

Publication Number Publication Date
TW200732272A true TW200732272A (en) 2007-09-01
TWI308908B TWI308908B (en) 2009-04-21

Family

ID=37877048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148142A TWI308908B (en) 2005-12-27 2006-12-21 Aluminum nitride composite body, and manufacturing method of the same

Country Status (6)

Country Link
US (1) US20070144667A1 (zh)
EP (1) EP1803696B1 (zh)
JP (2) JP4921150B2 (zh)
KR (1) KR100847498B1 (zh)
CN (1) CN100506752C (zh)
TW (1) TWI308908B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI811011B (zh) * 2021-10-07 2023-08-01 日商日本碍子股份有限公司 半導體製造裝置用構件

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US20090277388A1 (en) * 2008-05-09 2009-11-12 Applied Materials, Inc. Heater with detachable shaft
US9624137B2 (en) * 2011-11-30 2017-04-18 Component Re-Engineering Company, Inc. Low temperature method for hermetically joining non-diffusing ceramic materials
US9315424B2 (en) * 2011-11-30 2016-04-19 Component Re-Engineering Company, Inc. Multi-layer plate device
US8932690B2 (en) * 2011-11-30 2015-01-13 Component Re-Engineering Company, Inc. Plate and shaft device
CN106536451A (zh) * 2014-07-10 2017-03-22 陶瓷技术有限责任公司 带有凹处的陶瓷的层压的模制体
CN114749754B (zh) * 2022-05-31 2023-07-25 核工业西南物理研究院 一种用于真空钎焊工艺评定的真空钎焊评定试件

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US5209525A (en) * 1990-03-28 1993-05-11 Ngk Insulators, Ltd. Bonded ceramic structure
JPH03279274A (ja) * 1990-03-28 1991-12-10 Ngk Insulators Ltd セラミック接合体
JP2783980B2 (ja) * 1994-09-01 1998-08-06 日本碍子株式会社 接合体およびその製造方法
JP3604888B2 (ja) * 1997-01-30 2004-12-22 日本碍子株式会社 窒化アルミニウム質セラミックス基材の接合体、窒化アルミニウム質セラミックス基材の接合体の製造方法及び接合剤
JP4070752B2 (ja) * 1997-01-30 2008-04-02 日本碍子株式会社 窒化アルミニウム質セラミックス基材の接合剤
JP2001342079A (ja) * 2000-05-30 2001-12-11 Ibiden Co Ltd セラミック接合体
JP3966376B2 (ja) * 2001-09-11 2007-08-29 住友電気工業株式会社 被処理物保持体、処理装置および半導体製造装置用セラミックスサセプタ
WO2003077290A1 (fr) * 2002-03-13 2003-09-18 Sumitomo Electric Industries, Ltd. Support destine a un systeme de production de semi-conducteur
JP3520074B2 (ja) * 2002-03-28 2004-04-19 日本碍子株式会社 セラミックサセプターの取付構造、セラミックサセプターの支持構造およびセラミックサセプターの支持部材
JP3832409B2 (ja) * 2002-09-18 2006-10-11 住友電気工業株式会社 ウエハー保持体及び半導体製造装置
JP4787568B2 (ja) * 2004-11-16 2011-10-05 日本碍子株式会社 接合剤、窒化アルミニウム接合体及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI811011B (zh) * 2021-10-07 2023-08-01 日商日本碍子股份有限公司 半導體製造裝置用構件
US12087610B2 (en) 2021-10-07 2024-09-10 Ngk Insulators, Ltd. Member for semiconductor manufacturing apparatus

Also Published As

Publication number Publication date
JP2012031058A (ja) 2012-02-16
CN1990426A (zh) 2007-07-04
JP2007176792A (ja) 2007-07-12
KR100847498B1 (ko) 2008-07-22
JP5367778B2 (ja) 2013-12-11
TWI308908B (en) 2009-04-21
US20070144667A1 (en) 2007-06-28
CN100506752C (zh) 2009-07-01
EP1803696B1 (en) 2012-10-24
JP4921150B2 (ja) 2012-04-25
EP1803696A1 (en) 2007-07-04
KR20070069030A (ko) 2007-07-02

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