TW200731377A - Method for dicing wafer - Google Patents

Method for dicing wafer

Info

Publication number
TW200731377A
TW200731377A TW095104436A TW95104436A TW200731377A TW 200731377 A TW200731377 A TW 200731377A TW 095104436 A TW095104436 A TW 095104436A TW 95104436 A TW95104436 A TW 95104436A TW 200731377 A TW200731377 A TW 200731377A
Authority
TW
Taiwan
Prior art keywords
wafer
dicing
laser beam
circuit layer
metal circuit
Prior art date
Application number
TW095104436A
Other languages
Chinese (zh)
Inventor
Fu-Tang Chu
Chi-Ping Teng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW095104436A priority Critical patent/TW200731377A/en
Publication of TW200731377A publication Critical patent/TW200731377A/en

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  • Dicing (AREA)

Abstract

A method for dicing a wafer comprises the steps of providing a wafer with metal circuit layer on its top surface, using a first laser beam to dice the wafer from the surface of the metal circuit layer toward the inside of the wafer along a dicing path until a determined depth, shooting a second laser beam into the wafer through the bottom surface of the wafer along the dicing path to remove the material on the focus of the second laser beam and pulling the two sides of the dicing path to have the wafer with the metal circuit layer on its surface separate into a plurality of dies.
TW095104436A 2006-02-09 2006-02-09 Method for dicing wafer TW200731377A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095104436A TW200731377A (en) 2006-02-09 2006-02-09 Method for dicing wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095104436A TW200731377A (en) 2006-02-09 2006-02-09 Method for dicing wafer

Publications (1)

Publication Number Publication Date
TW200731377A true TW200731377A (en) 2007-08-16

Family

ID=57913130

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095104436A TW200731377A (en) 2006-02-09 2006-02-09 Method for dicing wafer

Country Status (1)

Country Link
TW (1) TW200731377A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103177943A (en) * 2011-12-26 2013-06-26 株式会社迪思科 Laser processing method for wafer
CN103358032A (en) * 2013-07-31 2013-10-23 江阴长电先进封装有限公司 Wafer level scribing method for CIS (Cmos image sensor) product
TWI732934B (en) * 2016-10-11 2021-07-11 日商迪思科股份有限公司 Wafer processing method
CN114434327A (en) * 2021-12-20 2022-05-06 彩虹显示器件股份有限公司 Light and thin type fireproof material special-shaped curved surface grinding device and method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103177943A (en) * 2011-12-26 2013-06-26 株式会社迪思科 Laser processing method for wafer
CN103177943B (en) * 2011-12-26 2017-05-17 株式会社迪思科 Laser processing method for wafer
CN103358032A (en) * 2013-07-31 2013-10-23 江阴长电先进封装有限公司 Wafer level scribing method for CIS (Cmos image sensor) product
TWI732934B (en) * 2016-10-11 2021-07-11 日商迪思科股份有限公司 Wafer processing method
CN114434327A (en) * 2021-12-20 2022-05-06 彩虹显示器件股份有限公司 Light and thin type fireproof material special-shaped curved surface grinding device and method

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