TW200730074A - Structure and method to increase locking friction for a circuit board - Google Patents

Structure and method to increase locking friction for a circuit board

Info

Publication number
TW200730074A
TW200730074A TW095101596A TW95101596A TW200730074A TW 200730074 A TW200730074 A TW 200730074A TW 095101596 A TW095101596 A TW 095101596A TW 95101596 A TW95101596 A TW 95101596A TW 200730074 A TW200730074 A TW 200730074A
Authority
TW
Taiwan
Prior art keywords
joint surface
circuit board
increase locking
locking friction
friction
Prior art date
Application number
TW095101596A
Other languages
English (en)
Other versions
TWI298616B (zh
Inventor
Chih-Feng Yeh
Original Assignee
Wistron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wistron Corp filed Critical Wistron Corp
Priority to TW095101596A priority Critical patent/TW200730074A/zh
Priority to US11/519,225 priority patent/US20070167082A1/en
Publication of TW200730074A publication Critical patent/TW200730074A/zh
Application granted granted Critical
Publication of TWI298616B publication Critical patent/TWI298616B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
TW095101596A 2006-01-16 2006-01-16 Structure and method to increase locking friction for a circuit board TW200730074A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095101596A TW200730074A (en) 2006-01-16 2006-01-16 Structure and method to increase locking friction for a circuit board
US11/519,225 US20070167082A1 (en) 2006-01-16 2006-09-12 Structure and method for increasing locking friction force on circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095101596A TW200730074A (en) 2006-01-16 2006-01-16 Structure and method to increase locking friction for a circuit board

Publications (2)

Publication Number Publication Date
TW200730074A true TW200730074A (en) 2007-08-01
TWI298616B TWI298616B (zh) 2008-07-01

Family

ID=38328440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101596A TW200730074A (en) 2006-01-16 2006-01-16 Structure and method to increase locking friction for a circuit board

Country Status (2)

Country Link
US (1) US20070167082A1 (zh)
TW (1) TW200730074A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI383207B (zh) * 2008-12-25 2013-01-21 Chunghwa Picture Tubes Ltd 背光模組之電路板固定結構

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008000442A1 (de) * 2008-02-29 2009-09-03 Robert Bosch Gmbh Platinenanordnung

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2747166A (en) * 1954-12-13 1956-05-22 Collins Radio Co Interlocked flexible contact assembly for shaft
US4652971A (en) * 1982-10-18 1987-03-24 Illinois Tool Works Inc. Printed circuit board fastener
JPH05206601A (ja) * 1992-01-28 1993-08-13 Fujitsu Isotec Ltd プリント基板及びそのアース方法
US5414223A (en) * 1994-08-10 1995-05-09 Ast Research, Inc. Solder pad for printed circuit boards
US6295210B1 (en) * 2000-04-07 2001-09-25 Lucent Technologies, Inc. Chassis grounding ring for a printed wiring board mounting aperture
US7227761B2 (en) * 2004-10-13 2007-06-05 Lenovo Singapore Pte, Ltd. Apparatus for resiliently mounting a circuit board within a device housing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI383207B (zh) * 2008-12-25 2013-01-21 Chunghwa Picture Tubes Ltd 背光模組之電路板固定結構

Also Published As

Publication number Publication date
TWI298616B (zh) 2008-07-01
US20070167082A1 (en) 2007-07-19

Similar Documents

Publication Publication Date Title
WO2009043561A3 (de) Leuchtmittel mit magnetischer haftung
MX2007008492A (es) Abrazadera para un aparato de construccion.
TW200742035A (en) Low profile semiconductor package-on-package
TW200709766A (en) Flexible circuit board with heat sink
WO2009074264A3 (en) Solder connection element
NO20024209D0 (no) Mekanisk forbindelse for paneler
WO2009005584A3 (en) Solderable emi gasket and grounding pad
WO2008027167A8 (en) Clad aluminum connector
TW200504819A (en) Room temperature metal direct bonding
WO2008102113A3 (en) Printed circuit boards
WO2010139342A8 (en) Lens and method for manufacturing same
WO2006020592A3 (en) Housing with functional overmold
WO2009054251A1 (ja) 発電装置
MY154125A (en) Metal base circuit board
TW200739772A (en) Contact bonding device
WO2006015685A3 (de) Bauteilanordnung mit optimierter montagefähigkeit
WO2006033894A3 (en) Heat riser
TW200737462A (en) Interconnect structure with stress buffering ability and the manufacturing method thereof
WO2007019014A3 (en) Architectural fabric
WO2006081427A3 (en) Apparatus having a photonic crystal
TW200642174A (en) Board-to-board connector
TW200513678A (en) Joined multi functional optical device
WO2008013652A3 (en) Geometric shaped side bearing pad
TW200730074A (en) Structure and method to increase locking friction for a circuit board
TW200614897A (en) Circuit structure

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees