TW200729383A - Clamping device and method for a curing process - Google Patents

Clamping device and method for a curing process

Info

Publication number
TW200729383A
TW200729383A TW095101564A TW95101564A TW200729383A TW 200729383 A TW200729383 A TW 200729383A TW 095101564 A TW095101564 A TW 095101564A TW 95101564 A TW95101564 A TW 95101564A TW 200729383 A TW200729383 A TW 200729383A
Authority
TW
Taiwan
Prior art keywords
upper plate
clamping device
product
clamping body
curing process
Prior art date
Application number
TW095101564A
Other languages
English (en)
Other versions
TWI273670B (en
Inventor
Chia-Ming Chang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW095101564A priority Critical patent/TWI273670B/zh
Priority to US11/558,771 priority patent/US20070164494A1/en
Application granted granted Critical
Publication of TWI273670B publication Critical patent/TWI273670B/zh
Publication of TW200729383A publication Critical patent/TW200729383A/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B25HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25BTOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B1/00Vices
    • B25B1/06Arrangements for positively actuating jaws
    • B25B1/10Arrangements for positively actuating jaws using screws
    • B25B1/103Arrangements for positively actuating jaws using screws with one screw perpendicular to the jaw faces, e.g. a differential or telescopic screw

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW095101564A 2006-01-16 2006-01-16 Clamping device and method for a curing process TWI273670B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095101564A TWI273670B (en) 2006-01-16 2006-01-16 Clamping device and method for a curing process
US11/558,771 US20070164494A1 (en) 2006-01-16 2006-11-10 Clamping device for a curing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095101564A TWI273670B (en) 2006-01-16 2006-01-16 Clamping device and method for a curing process

Publications (2)

Publication Number Publication Date
TWI273670B TWI273670B (en) 2007-02-11
TW200729383A true TW200729383A (en) 2007-08-01

Family

ID=38262455

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095101564A TWI273670B (en) 2006-01-16 2006-01-16 Clamping device and method for a curing process

Country Status (2)

Country Link
US (1) US20070164494A1 (zh)
TW (1) TWI273670B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101651023B (zh) * 2009-08-12 2011-08-03 银河电气科技有限公司 一种用于卷铁芯变压器线圈出头的装置
TWI827971B (zh) * 2021-09-01 2024-01-01 建佳科技股份有限公司 用於半導體製程的烘烤夾具及其應用設備

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7803662B2 (en) * 2007-09-24 2010-09-28 Freescale Semiconductor, Inc. Warpage control using a package carrier assembly
AT507560B1 (de) * 2008-12-03 2010-06-15 Plasser Bahnbaumasch Franz Schweissaggregat zum verschweissen von schienen
JP5094756B2 (ja) * 2009-01-30 2012-12-12 株式会社三井ハイテック 半導体装置の製造方法及びそれに用いる半導体パッケージの変形矯正装置
KR200456898Y1 (ko) * 2009-05-26 2011-11-24 김태형 링크립 결합 장치
KR200465877Y1 (ko) 2010-12-23 2013-03-18 주식회사 경동나비엔 Pem 연료전지의 스택 체결구조
CN103373035B (zh) * 2012-04-26 2015-07-15 珠海格力电器股份有限公司 家用电器面板组件压紧工装
CN107346754A (zh) * 2016-05-06 2017-11-14 致伸科技股份有限公司 热压及固化装置
RU185620U1 (ru) * 2018-04-26 2018-12-12 Федеральное государственное бюджетное образовательное учреждение высшего образования "Петрозаводский государственный университет" Зажимное устройство для стопки подложек, покрытых слоем компаунда, размещаемой в печи для полимеризации
CN108673365A (zh) * 2018-08-06 2018-10-19 惠州市豪美氏智能电气有限公司 一种工业加工夹具
CN114486426A (zh) * 2021-12-31 2022-05-13 天津天大建设工程科技有限公司 一种芯样补平仪

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1600561A (zh) * 1968-01-26 1970-07-27
GB1381778A (en) * 1972-06-08 1975-01-29 Cableform Ltd Semiconductor clamping means
US4097036A (en) * 1977-05-04 1978-06-27 Bbc Brown, Boveri & Company, Limited Clamping device for a thermally and electrically pressure-contacted semiconductor component in disk-cell construction
US4726754A (en) * 1985-09-23 1988-02-23 Ex-Cell-O Corporation Molding press for reaction injection molding
US5174004A (en) * 1988-01-05 1992-12-29 King & Sons Pty. Ltd. Radiator clamping jig
US4874156A (en) * 1988-01-07 1989-10-17 Abe Goldzweig Hand or foot manipulated self clamping device
IT1229810B (it) * 1988-11-11 1991-09-13 Pirelli Cavi Spa Procedimento ed apparecchiatura per inserire un supporto rigido in un manicotto per giunti di cavi elettrici.
US4915273A (en) * 1989-02-24 1990-04-10 Allen John M Bow and gun holders for offroad vehicles
JPH09168928A (ja) * 1995-10-20 1997-06-30 Fuji Photo Film Co Ltd ワーク位置決め装置
US6953188B2 (en) * 2003-08-08 2005-10-11 Rain Mountain Llc Flexible jaw universal vise
US7048267B2 (en) * 2003-12-05 2006-05-23 3M Innovative Properties Company Adhesively mounted angled clamp device
US7174614B2 (en) * 2004-06-01 2007-02-13 Martz Dwayne A Device for facilitating connection of terminal ends of vehicle track to form closed loop
US7128313B1 (en) * 2006-02-28 2006-10-31 Pliley Larry E Support system of a tabletop vise

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101651023B (zh) * 2009-08-12 2011-08-03 银河电气科技有限公司 一种用于卷铁芯变压器线圈出头的装置
TWI827971B (zh) * 2021-09-01 2024-01-01 建佳科技股份有限公司 用於半導體製程的烘烤夾具及其應用設備

Also Published As

Publication number Publication date
US20070164494A1 (en) 2007-07-19
TWI273670B (en) 2007-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees