TW200729359A - Digital still camera module - Google Patents

Digital still camera module

Info

Publication number
TW200729359A
TW200729359A TW095102771A TW95102771A TW200729359A TW 200729359 A TW200729359 A TW 200729359A TW 095102771 A TW095102771 A TW 095102771A TW 95102771 A TW95102771 A TW 95102771A TW 200729359 A TW200729359 A TW 200729359A
Authority
TW
Taiwan
Prior art keywords
chip
substrate
bonding wires
still camera
digital still
Prior art date
Application number
TW095102771A
Other languages
Chinese (zh)
Inventor
Ying-Cheng Wu
Ying-Tang Su
Original Assignee
Altus Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Altus Technology Inc filed Critical Altus Technology Inc
Priority to TW095102771A priority Critical patent/TW200729359A/en
Publication of TW200729359A publication Critical patent/TW200729359A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Abstract

A digital still camera module includes an image sensor package, a lens holder and a lens module. The image sensor package includes a substrate, a plurality of bonding wires, a first chip, an adhesive means, a second chip and a cover. The first chip is secured on the substrate, and electrically connected with the substrate via the bonding wires. The top of adhesive means is higher than the top of the bonding wires connecting the first chip with the substrate. The second chip is mounted on the top of the first chip via the adhesive means. The second chip has a sensitive area thereon, and is electrically connected with the substrate via the bonding wires. The cover is attached on the second chip. The lens holder covers the image sensor chip package. The lens module is received in the lens holder. The lens module includes a barrel and multiple lenses received in the barrel. The lenses of the lens module are corresponding to the sensitive area of the second chip.
TW095102771A 2006-01-25 2006-01-25 Digital still camera module TW200729359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095102771A TW200729359A (en) 2006-01-25 2006-01-25 Digital still camera module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095102771A TW200729359A (en) 2006-01-25 2006-01-25 Digital still camera module

Publications (1)

Publication Number Publication Date
TW200729359A true TW200729359A (en) 2007-08-01

Family

ID=57912981

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102771A TW200729359A (en) 2006-01-25 2006-01-25 Digital still camera module

Country Status (1)

Country Link
TW (1) TW200729359A (en)

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