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Application filed by Advanced Micro Fab Equip IncfiledCriticalAdvanced Micro Fab Equip Inc
Priority to TW95103693ApriorityCriticalpatent/TWI292921B/en
Publication of TW200729297ApublicationCriticalpatent/TW200729297A/en
Application grantedgrantedCritical
Publication of TWI292921BpublicationCriticalpatent/TWI292921B/en
A plasma processing apparatus comprising one chamber, the chamber containing at least two processing stations, the processing stations separated by separation wall. On the separation wall there is at least one channel, the width/length ratio of the channel less than 1/3. This invention keeps the gas pressure balanced between the processing stations while preventing the charged particles from interfering with each other, promoting the uniformity of processing conditions in processing stations.
Plasma source utilizing a macro-particle reduction coating and method of using a plasma source utilizing a macro-particle reduction coating for deposition of thin film coatings and modification of surfaces