TW200728519A - Electrochemical plating apparatus and method - Google Patents

Electrochemical plating apparatus and method

Info

Publication number
TW200728519A
TW200728519A TW095101640A TW95101640A TW200728519A TW 200728519 A TW200728519 A TW 200728519A TW 095101640 A TW095101640 A TW 095101640A TW 95101640 A TW95101640 A TW 95101640A TW 200728519 A TW200728519 A TW 200728519A
Authority
TW
Taiwan
Prior art keywords
wafer
electrochemical plating
space
thrust plate
contact ring
Prior art date
Application number
TW095101640A
Other languages
Chinese (zh)
Other versions
TWI290591B (en
Inventor
James Lu
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to TW95101640A priority Critical patent/TWI290591B/en
Publication of TW200728519A publication Critical patent/TW200728519A/en
Application granted granted Critical
Publication of TWI290591B publication Critical patent/TWI290591B/en

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  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

An electrochemical plating apparatus and method are disclosed. The apparatus includes a cathode substrate hold unit for electrically holding a wafer, a electroplating solution storage tank for performing an electrochemical plating process on the wafer, a power supply for electrically connecting to the cathode substrate hold unit and an anode, and a detective unit for detecting a state of the wafer. In the method, the wafer is supplied firstly. Next, the wafer is put on a contact ring. Then, a thrust plate is used to push a backside of the wafer so that the wafre is connected to the contact ring, wherein a space is formed between the wafer and the thrust plate. Next, gas is supplied into the space to reach a set pressure value. Then, the pressure of the space is detected whether the pressure is changed or not to decide whether an electrochemical plating process can be performed or not.
TW95101640A 2006-01-16 2006-01-16 Electrochemical plating apparatus and method TWI290591B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95101640A TWI290591B (en) 2006-01-16 2006-01-16 Electrochemical plating apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95101640A TWI290591B (en) 2006-01-16 2006-01-16 Electrochemical plating apparatus and method

Publications (2)

Publication Number Publication Date
TW200728519A true TW200728519A (en) 2007-08-01
TWI290591B TWI290591B (en) 2007-12-01

Family

ID=39327525

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95101640A TWI290591B (en) 2006-01-16 2006-01-16 Electrochemical plating apparatus and method

Country Status (1)

Country Link
TW (1) TWI290591B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI397614B (en) * 2009-12-22 2013-06-01 Zhen Ding Technology Co Ltd Plating fixture
TWI410531B (en) * 2010-05-07 2013-10-01 Taiwan Semiconductor Mfg Vertical plating equipment and plating method thereof
TWI410532B (en) * 2010-09-01 2013-10-01 Grand Plastic Technology Co Ltd Vertical wafer hole filling electrode plating apparatus

Also Published As

Publication number Publication date
TWI290591B (en) 2007-12-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees