TW200728425A - Adhesive composition and coating film and adhesive sheet using the same - Google Patents

Adhesive composition and coating film and adhesive sheet using the same

Info

Publication number
TW200728425A
TW200728425A TW095129925A TW95129925A TW200728425A TW 200728425 A TW200728425 A TW 200728425A TW 095129925 A TW095129925 A TW 095129925A TW 95129925 A TW95129925 A TW 95129925A TW 200728425 A TW200728425 A TW 200728425A
Authority
TW
Taiwan
Prior art keywords
coating film
mass
composition
layer
adhesive
Prior art date
Application number
TW095129925A
Other languages
Chinese (zh)
Inventor
Hitoshi Arai
Toru Nakanishi
Shigehiro Hoshida
Tadashi Amano
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200728425A publication Critical patent/TW200728425A/en

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention provides a coating film and an adhesive sheet having excellent adhesion and migration properties and an adhesive composition used for the same. The adhesive composition comprises (A) a urethane-modified carboxyl group-containing polyester resin: 100 pts.mass, (B) an epoxy resin: 5-100 pts.mass, (C) a curing agent: 0.1-30 pts.mass and (D) an inorganic filler in 10-60 mass% based on the total mass of components (A)-(C). The coating film comprises an electrical insulation coating film and a layer comprising the composition made of the film layer. The adhesive sheet comprises the layer consist of the composition and a releasing material layer covering the layer comprising the composition.
TW095129925A 2005-08-17 2006-08-15 Adhesive composition and coating film and adhesive sheet using the same TW200728425A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005237007A JP2007051211A (en) 2005-08-17 2005-08-17 Adhesive composition and coverlay film and adhesive sheet using the same

Publications (1)

Publication Number Publication Date
TW200728425A true TW200728425A (en) 2007-08-01

Family

ID=37915873

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095129925A TW200728425A (en) 2005-08-17 2006-08-15 Adhesive composition and coating film and adhesive sheet using the same

Country Status (2)

Country Link
JP (1) JP2007051211A (en)
TW (1) TW200728425A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8153709B2 (en) 2008-12-22 2012-04-10 Iteq Corporation Halogen-free prepreg and resin for preparing the same
CN101768327B (en) * 2009-01-04 2012-06-20 联茂电子股份有限公司 Halogen-free bonding film and resin used for same
CN101768328B (en) * 2009-01-04 2012-11-21 联茂电子股份有限公司 Bonding film and used resin thereof
TWI684392B (en) * 2016-01-12 2020-02-01 日商藤森工業股份有限公司 Coverlay film, mobile phone and electronic device including the same

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008144141A (en) * 2006-11-15 2008-06-26 Shin Etsu Chem Co Ltd Adhesive sheet
TWI449745B (en) * 2008-12-22 2014-08-21 Iteq Corp Bonding sheet and resin composition for preparing the same
CN109423252A (en) * 2017-06-27 2019-03-05 深圳光启高等理工研究院 A kind of insulating tape and preparation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4423513B2 (en) * 1997-10-20 2010-03-03 東洋紡績株式会社 Adhesive resin composition and adhesive film
JP2001049221A (en) * 1999-08-05 2001-02-20 Tomoegawa Paper Co Ltd Adhesive composition for electronic component and adhesive sheet
CA2423428A1 (en) * 2000-09-29 2002-04-04 National Starch And Chemical Investment Holding Corporation Flame-retardant composition
JP3849789B2 (en) * 2003-10-20 2006-11-22 東洋紡績株式会社 Laminated body

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8153709B2 (en) 2008-12-22 2012-04-10 Iteq Corporation Halogen-free prepreg and resin for preparing the same
CN101768327B (en) * 2009-01-04 2012-06-20 联茂电子股份有限公司 Halogen-free bonding film and resin used for same
CN101768328B (en) * 2009-01-04 2012-11-21 联茂电子股份有限公司 Bonding film and used resin thereof
TWI684392B (en) * 2016-01-12 2020-02-01 日商藤森工業股份有限公司 Coverlay film, mobile phone and electronic device including the same

Also Published As

Publication number Publication date
JP2007051211A (en) 2007-03-01

Similar Documents

Publication Publication Date Title
TW200728425A (en) Adhesive composition and coating film and adhesive sheet using the same
CN106463649B (en) Wrap film
WO2009044732A1 (en) Adhesive composition, circuit connecting material using the same, method for connecting circuit members, and circuit connection structure
WO2008153082A1 (en) Resin composition, embedding material, insulating layer, and semiconductor device
AU2003289943A8 (en) Method for coating an element with glue
EP2070961A4 (en) Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board
TW200833770A (en) Thermally conductive material
MXPA02005182A (en) Roofing underlayment.
WO2005124790A3 (en) High thermal conductivity materials aligned within resins
TW200714663A (en) Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate
DE602006013734D1 (en) Low-voltage conductive adhesive
TW200710187A (en) Adhesive and adhesive sheet
TW200704740A (en) Sheet for thermo-compression bonding
EP1698670A4 (en) Thermosetting resin composition, material for substrate and film for substrate
WO2008052209A3 (en) Polymeric composite adhesive tape
EP2053108A4 (en) Film adhesive, adhesive sheet, and semiconductor device using the same
NO20071972L (en) Adhesive tape for bonding foils in the area of building envelopes and applications thereof
EP1449643A4 (en) Composite molding with adhesive composition layer comprising conjugated diene polymer having cyclic structure, and coating material
WO2008143253A1 (en) Adhesive composition and adhesive film using the same
TW200700524A (en) Adhesive composition for flexible printed wiring board and adhesive film for flexible printed wiring board using it
WO2008123224A1 (en) Photosensitive resin composition
JP2009007424A (en) Adhesive composition, and adhesive sheet and cover lay film using the same
TW200509145A (en) Flat cable covering material, and flat cable
MY119847A (en) Adhesives and circuit materials using said adhesives
WO2009008481A1 (en) Multilayer body, and flat cable and member for electrical wiring each using the multilayer body