TW200728425A - Adhesive composition and coating film and adhesive sheet using the same - Google Patents
Adhesive composition and coating film and adhesive sheet using the sameInfo
- Publication number
- TW200728425A TW200728425A TW095129925A TW95129925A TW200728425A TW 200728425 A TW200728425 A TW 200728425A TW 095129925 A TW095129925 A TW 095129925A TW 95129925 A TW95129925 A TW 95129925A TW 200728425 A TW200728425 A TW 200728425A
- Authority
- TW
- Taiwan
- Prior art keywords
- coating film
- mass
- composition
- layer
- adhesive
- Prior art date
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The present invention provides a coating film and an adhesive sheet having excellent adhesion and migration properties and an adhesive composition used for the same. The adhesive composition comprises (A) a urethane-modified carboxyl group-containing polyester resin: 100 pts.mass, (B) an epoxy resin: 5-100 pts.mass, (C) a curing agent: 0.1-30 pts.mass and (D) an inorganic filler in 10-60 mass% based on the total mass of components (A)-(C). The coating film comprises an electrical insulation coating film and a layer comprising the composition made of the film layer. The adhesive sheet comprises the layer consist of the composition and a releasing material layer covering the layer comprising the composition.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005237007A JP2007051211A (en) | 2005-08-17 | 2005-08-17 | Adhesive composition and coverlay film and adhesive sheet using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200728425A true TW200728425A (en) | 2007-08-01 |
Family
ID=37915873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095129925A TW200728425A (en) | 2005-08-17 | 2006-08-15 | Adhesive composition and coating film and adhesive sheet using the same |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2007051211A (en) |
TW (1) | TW200728425A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8153709B2 (en) | 2008-12-22 | 2012-04-10 | Iteq Corporation | Halogen-free prepreg and resin for preparing the same |
CN101768327B (en) * | 2009-01-04 | 2012-06-20 | 联茂电子股份有限公司 | Halogen-free bonding film and resin used for same |
CN101768328B (en) * | 2009-01-04 | 2012-11-21 | 联茂电子股份有限公司 | Bonding film and used resin thereof |
TWI684392B (en) * | 2016-01-12 | 2020-02-01 | 日商藤森工業股份有限公司 | Coverlay film, mobile phone and electronic device including the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008144141A (en) * | 2006-11-15 | 2008-06-26 | Shin Etsu Chem Co Ltd | Adhesive sheet |
TWI449745B (en) * | 2008-12-22 | 2014-08-21 | Iteq Corp | Bonding sheet and resin composition for preparing the same |
CN109423252A (en) * | 2017-06-27 | 2019-03-05 | 深圳光启高等理工研究院 | A kind of insulating tape and preparation method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4423513B2 (en) * | 1997-10-20 | 2010-03-03 | 東洋紡績株式会社 | Adhesive resin composition and adhesive film |
JP2001049221A (en) * | 1999-08-05 | 2001-02-20 | Tomoegawa Paper Co Ltd | Adhesive composition for electronic component and adhesive sheet |
CA2423428A1 (en) * | 2000-09-29 | 2002-04-04 | National Starch And Chemical Investment Holding Corporation | Flame-retardant composition |
JP3849789B2 (en) * | 2003-10-20 | 2006-11-22 | 東洋紡績株式会社 | Laminated body |
-
2005
- 2005-08-17 JP JP2005237007A patent/JP2007051211A/en active Pending
-
2006
- 2006-08-15 TW TW095129925A patent/TW200728425A/en unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8153709B2 (en) | 2008-12-22 | 2012-04-10 | Iteq Corporation | Halogen-free prepreg and resin for preparing the same |
CN101768327B (en) * | 2009-01-04 | 2012-06-20 | 联茂电子股份有限公司 | Halogen-free bonding film and resin used for same |
CN101768328B (en) * | 2009-01-04 | 2012-11-21 | 联茂电子股份有限公司 | Bonding film and used resin thereof |
TWI684392B (en) * | 2016-01-12 | 2020-02-01 | 日商藤森工業股份有限公司 | Coverlay film, mobile phone and electronic device including the same |
Also Published As
Publication number | Publication date |
---|---|
JP2007051211A (en) | 2007-03-01 |
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