TW200727998A - Recycling method for waste printed circuit board - Google Patents

Recycling method for waste printed circuit board

Info

Publication number
TW200727998A
TW200727998A TW095102342A TW95102342A TW200727998A TW 200727998 A TW200727998 A TW 200727998A TW 095102342 A TW095102342 A TW 095102342A TW 95102342 A TW95102342 A TW 95102342A TW 200727998 A TW200727998 A TW 200727998A
Authority
TW
Taiwan
Prior art keywords
printed circuit
waste printed
circuit board
recycling method
circuit boards
Prior art date
Application number
TW095102342A
Other languages
Chinese (zh)
Other versions
TWI268184B (en
Inventor
Hsieh-Sen Wu
Original Assignee
Hsieh-Sen Wu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hsieh-Sen Wu filed Critical Hsieh-Sen Wu
Priority to TW095102342A priority Critical patent/TWI268184B/en
Priority to CN200610002019A priority patent/CN100592939C/en
Priority to US11/592,974 priority patent/US20070169330A1/en
Priority to EP20060125409 priority patent/EP1811821B1/en
Application granted granted Critical
Publication of TWI268184B publication Critical patent/TWI268184B/en
Priority to SG200700330-4A priority patent/SG134269A1/en
Priority to JP2007009172A priority patent/JP4791978B2/en
Priority to KR1020070006022A priority patent/KR100821792B1/en
Publication of TW200727998A publication Critical patent/TW200727998A/en

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Abstract

This invention relates to a recycling method for waste printed circuit boards. By use of the characters of the printed circuit board, various metals which remain on the circuit boards are separated stepwise in multi-steps with various processes. By this way, brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry, thereby the nature environment is prevented from damage after the waste printed circuit broads.
TW095102342A 2006-01-20 2006-01-20 Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry TWI268184B (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
TW095102342A TWI268184B (en) 2006-01-20 2006-01-20 Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry
CN200610002019A CN100592939C (en) 2006-01-20 2006-01-23 Recovery method of discarded printed circuit boards
US11/592,974 US20070169330A1 (en) 2006-01-20 2006-11-06 Method of recycling wasted printed-circuit-board
EP20060125409 EP1811821B1 (en) 2006-01-20 2006-12-05 Method of recycling waste printed circuit boards
SG200700330-4A SG134269A1 (en) 2006-01-20 2007-01-17 The method of recycling wasted printed-circuit-board
JP2007009172A JP4791978B2 (en) 2006-01-20 2007-01-18 Waste PCB recovery method
KR1020070006022A KR100821792B1 (en) 2006-01-20 2007-01-19 The method of recycling wasted printed- circuit-board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095102342A TWI268184B (en) 2006-01-20 2006-01-20 Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry

Publications (2)

Publication Number Publication Date
TWI268184B TWI268184B (en) 2006-12-11
TW200727998A true TW200727998A (en) 2007-08-01

Family

ID=57912825

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102342A TWI268184B (en) 2006-01-20 2006-01-20 Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry

Country Status (1)

Country Link
TW (1) TWI268184B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9649712B2 (en) 2011-12-15 2017-05-16 Entegris, Inc. Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201041668A (en) * 2009-05-27 2010-12-01 xie-sen Wu Pyrolysis method of recycled substrate of printed circuit board and device thereof
TWI688731B (en) 2018-07-24 2020-03-21 陳宣榮 Waste electronic product processing method and processing device
CN111001642A (en) * 2019-10-17 2020-04-14 佛山市南海保达建筑机械设备有限公司 Treatment method of glass fiber waste board
TWI748797B (en) * 2020-12-14 2021-12-01 迅得機械股份有限公司 Pcb scrap prevention system and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9649712B2 (en) 2011-12-15 2017-05-16 Entegris, Inc. Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment
US9731368B2 (en) 2011-12-15 2017-08-15 Entegris, Inc. Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment

Also Published As

Publication number Publication date
TWI268184B (en) 2006-12-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees