TW200727359A - Method and apparatus for controlling temperature of a substrate - Google Patents
Method and apparatus for controlling temperature of a substrateInfo
- Publication number
- TW200727359A TW200727359A TW095107311A TW95107311A TW200727359A TW 200727359 A TW200727359 A TW 200727359A TW 095107311 A TW095107311 A TW 095107311A TW 95107311 A TW95107311 A TW 95107311A TW 200727359 A TW200727359 A TW 200727359A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- temperature
- etching
- substrate support
- processing chamber
- Prior art date
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65869805P | 2005-03-03 | 2005-03-03 | |
US11/246,012 US8075729B2 (en) | 2004-10-07 | 2005-10-07 | Method and apparatus for controlling temperature of a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200727359A true TW200727359A (en) | 2007-07-16 |
TWI323011B TWI323011B (en) | 2010-04-01 |
Family
ID=39129930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95107311A TWI323011B (en) | 2005-03-03 | 2006-03-03 | Method for etching having a controlled distribution of process results |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2008532324A (zh) |
CN (1) | CN101133682B (zh) |
TW (1) | TWI323011B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011192664A (ja) | 2010-03-11 | 2011-09-29 | Tokyo Electron Ltd | プラズマエッチング方法及びプラズマエッチング装置 |
CN102386077B (zh) * | 2010-09-03 | 2014-05-14 | 中芯国际集成电路制造(上海)有限公司 | 一种制作半导体器件的方法 |
JP7077108B2 (ja) * | 2018-04-05 | 2022-05-30 | 東京エレクトロン株式会社 | 被加工物の処理方法 |
CN112884302B (zh) * | 2021-02-01 | 2024-01-30 | 杭州市电力设计院有限公司 | 一种电力物资管理方法 |
WO2024005047A1 (ja) * | 2022-07-01 | 2024-01-04 | 東京エレクトロン株式会社 | 基板処理装置の制御方法及び基板処理システム |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4237317B2 (ja) * | 1997-12-26 | 2009-03-11 | 株式会社日立製作所 | プラズマ処理装置 |
US6482747B1 (en) * | 1997-12-26 | 2002-11-19 | Hitachi, Ltd. | Plasma treatment method and plasma treatment apparatus |
US6589437B1 (en) * | 1999-03-05 | 2003-07-08 | Applied Materials, Inc. | Active species control with time-modulated plasma |
US20030070620A1 (en) * | 2001-10-15 | 2003-04-17 | Cooperberg David J. | Tunable multi-zone gas injection system |
JP2004247526A (ja) * | 2003-02-14 | 2004-09-02 | Hitachi High-Technologies Corp | プラズマ処理装置及び方法 |
-
2006
- 2006-03-02 CN CN200680006797XA patent/CN101133682B/zh not_active Expired - Fee Related
- 2006-03-02 JP JP2007558240A patent/JP2008532324A/ja active Pending
- 2006-03-03 TW TW95107311A patent/TWI323011B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2008532324A (ja) | 2008-08-14 |
TWI323011B (en) | 2010-04-01 |
CN101133682B (zh) | 2011-07-20 |
CN101133682A (zh) | 2008-02-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |