TW200726968A - An apparatus and method of inspecting the surface of a wafer - Google Patents

An apparatus and method of inspecting the surface of a wafer

Info

Publication number
TW200726968A
TW200726968A TW095122898A TW95122898A TW200726968A TW 200726968 A TW200726968 A TW 200726968A TW 095122898 A TW095122898 A TW 095122898A TW 95122898 A TW95122898 A TW 95122898A TW 200726968 A TW200726968 A TW 200726968A
Authority
TW
Taiwan
Prior art keywords
wafer
inspecting
imaged
narrow
relates
Prior art date
Application number
TW095122898A
Other languages
English (en)
Inventor
Wolfgang Sulik
Michael Heiden
Original Assignee
Vistec Semiconductor Sys Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vistec Semiconductor Sys Gmbh filed Critical Vistec Semiconductor Sys Gmbh
Publication of TW200726968A publication Critical patent/TW200726968A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
TW095122898A 2005-08-09 2006-06-26 An apparatus and method of inspecting the surface of a wafer TW200726968A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005038034A DE102005038034B3 (de) 2005-08-09 2005-08-09 Vorrichtung und Verfahren zur Inspektion der Oberfläche eines Wafers

Publications (1)

Publication Number Publication Date
TW200726968A true TW200726968A (en) 2007-07-16

Family

ID=37436283

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122898A TW200726968A (en) 2005-08-09 2006-06-26 An apparatus and method of inspecting the surface of a wafer

Country Status (6)

Country Link
US (1) US7545489B2 (zh)
EP (1) EP1752760A1 (zh)
JP (1) JP2007049127A (zh)
CN (1) CN1920540A (zh)
DE (1) DE102005038034B3 (zh)
TW (1) TW200726968A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2004400A (en) * 2009-04-09 2010-10-12 Asml Holding Nv Tunable wavelength illumination system.
DE102009044151B4 (de) 2009-05-19 2012-03-29 Kla-Tencor Mie Gmbh Vorrichtung zur optischen Waferinspektion
US20110165497A1 (en) * 2010-01-06 2011-07-07 Gm Global Technology Operations, Inc. Method for Mitigating Fuel Cell Chemical Degradation
CN102023168B (zh) * 2010-11-08 2013-04-17 北京大学深圳研究生院 半导体晶圆表面的芯片检测方法及系统
TWI598580B (zh) * 2013-05-03 2017-09-11 政美應用股份有限公司 Led晶圓檢測裝置及其方法
CN115312417B (zh) * 2022-10-11 2023-02-03 合肥新晶集成电路有限公司 Ocd的测量方法以及其测量装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291269A (en) * 1991-12-06 1994-03-01 Hughes Aircraft Company Apparatus and method for performing thin film layer thickness metrology on a thin film layer having shape deformations and local slope variations
WO1996039619A1 (en) * 1995-06-06 1996-12-12 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen
US6870616B2 (en) * 1998-06-30 2005-03-22 Jjl Technologies Llc Spectrometer apparatus for determining an optical characteristic of an object or material having one or more sensors for determining a physical position or non-color property
US6956644B2 (en) * 1997-09-19 2005-10-18 Kla-Tencor Technologies Corporation Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination
US5953115A (en) * 1997-10-28 1999-09-14 International Business Machines Corporation Method and apparatus for imaging surface topography of a wafer
US5982497A (en) * 1998-07-09 1999-11-09 Optical Insights, Llc Multi-spectral two-dimensional imaging spectrometer
US6917433B2 (en) * 2000-09-20 2005-07-12 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process
US6864971B2 (en) * 2001-03-27 2005-03-08 Isoa, Inc. System and method for performing optical inspection utilizing diffracted light
US6570650B1 (en) * 2001-06-21 2003-05-27 Kla-Tenor Corporation Apparatus and methods for reducing thin film color variation in optical inspection of semiconductor devices and other surfaces
US6847443B1 (en) * 2002-01-17 2005-01-25 Rudolph Technologies, Inc. System and method for multi-wavelength, narrow-bandwidth detection of surface defects
US6700664B1 (en) * 2002-08-15 2004-03-02 Jds Uniphase Corporation Optical channel monitoring device
EP1595131A4 (en) * 2003-02-10 2008-11-26 Univ Virginia SYSTEM AND METHOD FOR REMOTELY DETECTING AND / OR ANALYZING THE SPECTRAL PROPERTIES OF TARGETS AND / OR CHEMICAL SPECIES FOR DETECTION AND IDENTIFICATION THEREOF
DE10330003B4 (de) * 2003-07-03 2007-03-08 Leica Microsystems Semiconductor Gmbh Vorrichtung, Verfahren und Computerprogramm zur Wafer-Inspektion
US6961126B2 (en) * 2003-10-23 2005-11-01 Honeywell International Inc. Optical wavelength splitter
US7242478B1 (en) * 2003-12-05 2007-07-10 Surface Optics Corporation Spatially corrected full-cubed hyperspectral imager
US7345764B2 (en) * 2005-02-07 2008-03-18 Vladimir Bulovic Apparatus and method for a slim format spectrometer

Also Published As

Publication number Publication date
EP1752760A1 (de) 2007-02-14
US20070052954A1 (en) 2007-03-08
DE102005038034B3 (de) 2007-05-10
JP2007049127A (ja) 2007-02-22
US7545489B2 (en) 2009-06-09
CN1920540A (zh) 2007-02-28

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