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Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW95101493ApriorityCriticalpatent/TWI292359B/en
Publication of TW200726572ApublicationCriticalpatent/TW200726572A/en
Application grantedgrantedCritical
Publication of TWI292359BpublicationCriticalpatent/TWI292359B/en
Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices
(AREA)
Mechanical Treatment Of Semiconductor
(AREA)
Abstract
A multi-zone carrier head includes a housing; a retaining ring secured to a lower edge of the housing; a backing plate having a plurality of non-concentric pressure zones defined by a plurality of isolated apertures on the backing plate; wherein the backing plate has a wafer side and a non-wafer side, the wafer side facing a backside of a wafer during a CMP operation; and a plurality of pneumatic bladder for independently controlling pressure exerted in the respective non-concentric pressure zones on the backside of the wafer during the CMP operation.
TW95101493A2006-01-132006-01-13Multi-zone carrier head for chemical mechanical polishing and method thereof
TWI292359B
(en)
Substrate processing apparatus, method for detaching substrate from vacuum-suction table of substrate processing apparatus, and method for setting substrate on vacuum-suction table of substrate processing apparatus