TW200722930A - Protective film-forming material and method of photoresist patterning with it - Google Patents

Protective film-forming material and method of photoresist patterning with it

Info

Publication number
TW200722930A
TW200722930A TW095133325A TW95133325A TW200722930A TW 200722930 A TW200722930 A TW 200722930A TW 095133325 A TW095133325 A TW 095133325A TW 95133325 A TW95133325 A TW 95133325A TW 200722930 A TW200722930 A TW 200722930A
Authority
TW
Taiwan
Prior art keywords
protective film
forming material
photoresist patterning
photoresist
formation
Prior art date
Application number
TW095133325A
Other languages
Chinese (zh)
Inventor
Keita Ishiduka
Tomoyuki Hirano
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200722930A publication Critical patent/TW200722930A/en

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means

Abstract

A material for protective film formation, which is a material for the formation of a protective film stacked on a photoresist film on a substrate and contains an alkali-soluble polymer comprising a cyclic hydrocarbon containing a fluorohydroxyalkyl group, and a method for photoresist pattern using the material for protective film formation.
TW095133325A 2005-09-09 2006-09-08 Protective film-forming material and method of photoresist patterning with it TW200722930A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005261629A JP2007072336A (en) 2005-09-09 2005-09-09 Protective film forming material and photoresist pattern forming method using the same

Publications (1)

Publication Number Publication Date
TW200722930A true TW200722930A (en) 2007-06-16

Family

ID=37835880

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133325A TW200722930A (en) 2005-09-09 2006-09-08 Protective film-forming material and method of photoresist patterning with it

Country Status (3)

Country Link
JP (1) JP2007072336A (en)
TW (1) TW200722930A (en)
WO (1) WO2007029765A1 (en)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4265766B2 (en) * 2003-08-25 2009-05-20 東京応化工業株式会社 Resist protective film forming material for immersion exposure process, resist protective film comprising the protective film forming material, and resist pattern forming method using the resist protective film
JP4609878B2 (en) * 2003-10-28 2011-01-12 東京応化工業株式会社 Resist upper layer film forming material and resist pattern forming method using the same
JPWO2005042453A1 (en) * 2003-10-31 2007-11-29 旭硝子株式会社 Fluorine-containing compound, fluorine-containing polymer and production method thereof
JP4407358B2 (en) * 2004-04-14 2010-02-03 旭硝子株式会社 Fluoropolymer and resist composition
WO2006011427A1 (en) * 2004-07-30 2006-02-02 Asahi Glass Company, Limited Fluorine-containing compound, fluorine-containing polymer, resist composition and resist protective film composition

Also Published As

Publication number Publication date
WO2007029765A1 (en) 2007-03-15
JP2007072336A (en) 2007-03-22

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