TW200722790A - Detection method for warpage of semiconductor packages - Google Patents

Detection method for warpage of semiconductor packages

Info

Publication number
TW200722790A
TW200722790A TW094143091A TW94143091A TW200722790A TW 200722790 A TW200722790 A TW 200722790A TW 094143091 A TW094143091 A TW 094143091A TW 94143091 A TW94143091 A TW 94143091A TW 200722790 A TW200722790 A TW 200722790A
Authority
TW
Taiwan
Prior art keywords
grating
warpage
semiconductor package
detection method
semiconductor packages
Prior art date
Application number
TW094143091A
Other languages
Chinese (zh)
Other versions
TWI263801B (en
Inventor
Yi-Hong Lin
Original Assignee
Univ Nat Pingtung Sci & Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Nat Pingtung Sci & Tech filed Critical Univ Nat Pingtung Sci & Tech
Priority to TW94143091A priority Critical patent/TWI263801B/en
Application granted granted Critical
Publication of TWI263801B publication Critical patent/TWI263801B/en
Publication of TW200722790A publication Critical patent/TW200722790A/en

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  • Length Measuring Devices By Optical Means (AREA)

Abstract

A detection method for warpage of semiconductor packages comprises the following steps: mounting a reference grating above a position where the semiconductor package is positioned; providing a predetermined light to pass through the reference grating so that a grating shadow is projected on the semiconductor package; capturing an image of a moire phenomenon of the grating shadow caused by the reference grating in a video camera module; moving the reference grating to at least two predetermined phases to capture at least two different images of moire phenomenons; calculating the images to obtain a serial-phase image; and then processing the serial-phase image so as to obtain a reference numeral appearing warpage of the semiconductor package.
TW94143091A 2005-12-07 2005-12-07 Detection method for warpage of semiconductor packages TWI263801B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94143091A TWI263801B (en) 2005-12-07 2005-12-07 Detection method for warpage of semiconductor packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94143091A TWI263801B (en) 2005-12-07 2005-12-07 Detection method for warpage of semiconductor packages

Publications (2)

Publication Number Publication Date
TWI263801B TWI263801B (en) 2006-10-11
TW200722790A true TW200722790A (en) 2007-06-16

Family

ID=37967171

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94143091A TWI263801B (en) 2005-12-07 2005-12-07 Detection method for warpage of semiconductor packages

Country Status (1)

Country Link
TW (1) TWI263801B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414757B (en) * 2010-11-17 2013-11-11 Univ Nat Yunlin Sci & Tech Measuring device and method for generating twist interference by grating modulation phase shift
TWI484136B (en) * 2014-03-26 2015-05-11 Univ Nat Central Optical wafer warpage detection system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI414757B (en) * 2010-11-17 2013-11-11 Univ Nat Yunlin Sci & Tech Measuring device and method for generating twist interference by grating modulation phase shift
TWI484136B (en) * 2014-03-26 2015-05-11 Univ Nat Central Optical wafer warpage detection system

Also Published As

Publication number Publication date
TWI263801B (en) 2006-10-11

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MM4A Annulment or lapse of patent due to non-payment of fees