TWI263801B - Detection method for warpage of semiconductor packages - Google Patents

Detection method for warpage of semiconductor packages Download PDF

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Publication number
TWI263801B
TWI263801B TW94143091A TW94143091A TWI263801B TW I263801 B TWI263801 B TW I263801B TW 94143091 A TW94143091 A TW 94143091A TW 94143091 A TW94143091 A TW 94143091A TW I263801 B TWI263801 B TW I263801B
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Taiwan
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package
value
image
grating
rapid detection
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TW94143091A
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Chinese (zh)
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TW200722790A (en
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Yi-Hong Lin
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Nat Pingtung University Of Sci
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Publication of TW200722790A publication Critical patent/TW200722790A/en

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Abstract

A detection method for warpage of semiconductor packages comprises the following steps: mounting a reference grating above a position where the semiconductor package is positioned; providing a predetermined light to pass through the reference grating so that a grating shadow is projected on the semiconductor package; capturing an image of a moire phenomenon of the grating shadow caused by the reference grating in a video camera module; moving the reference grating to at least two predetermined phases to capture at least two different images of moire phenomenons; calculating the images to obtain a serial-phase image; and then processing the serial-phase image so as to obtain a reference numeral appearing warpage of the semiconductor package.

Description

I2638〇i 九 、發明說明: 【發明所屬之技術領域】 本I明係關於一種封梦辦主 …特制是關於彻特定^ 她曲值之快速檢測方 行相位重f速€彳^^理方法對-待測封裝體進 娜方法。 Λ寺4封裝體之表面翹曲值的檢 【先前技術】 值法’其應_界 適當之光學原理〔例如三角為:針,同時配搭 體表面之微]、絲變化。然〕1^細—待測封裝 :點量測之方式檢_待測封穿體光探針法係藉由逐 '專之採樣間距亦較為微小。因此=,同時加上逐點量 量測時間增加及未能實施全域二=:導致 因光探針法之高精度、長行程的位要 因而相對增域II錢備之成本。,要“之精度 但是= 卜幻該顯奸涉術雖具有㈣較高之量測精度, 構因而Γ賴时射光為光源且需要較高精度之光學機 冓,口而相對增加生產設備成本及檢測環境需求。 再者’料:該敎法相對該麵針法及顯微干涉術 1較低之檢測成本、檢測環境需求及較高之檢測效率, 但=在實際使用上由於習用之疊紋法在相位重建之檢測步 驟所產生之雜訊過多,因而相對延長數學演算方法之運 C:\Linda\PK Pat\PK97TZ docI2638〇i IX, invention description: [Technical field of invention] This I is related to a kind of dreams... The special system is about the specific detection of the curvature of the curve. Pair-to-test package into the method. Inspection of the surface warpage value of the Λ Temple 4 package [Prior Art] The value method _ the appropriate optical principle (for example, the triangle is: the needle, and the surface of the matching body is micro), the wire changes. However, 1^fine-package to be tested: the method of measuring the point measurement _ the method of detecting the light-piercing method of the plug-in is also relatively small. Therefore, = plus point-by-point measurement time increase and failure to implement the global two =: leading to the high precision, long-stroke position of the optical probe method, thus increasing the cost of the domain II. It is necessary to "accurate but the illusion of the sorcerer has a higher measurement accuracy, so the structure of the light is a light source and requires a higher precision optical machine, and the cost of the production equipment is relatively increased. Detecting environmental requirements. In addition, the material is relatively low in detection cost, detection environment requirement and high detection efficiency compared with the needle method and micro-interference 1 , but = in practice, due to the use of conventional embossing The method generates too much noise in the detection step of phase reconstruction, thus relatively extending the mathematical calculation method C:\Linda\PK Pat\PK97TZ doc

05/12/07/10:20 AM ——5〜 !263801 ^日守間,以致相對降低檢測效率。因此,且 一步改良上述制難縣面翹曲值之_ =有必要進 有鑑於此’本發明改良上述之缺點,〜 之疊紋法結合特定之影像處理方法,以快速去=用上述 中所產生之雜訊’因此能相對提升檢測效率及:::= 【發明内容】 本發縣要目的储供—種縣财她 =測方法,其係將-參考光栅相對-待測龍體 =個特疋她,以擷取數個陰影疊紋,供計算該待 確性之功效。 升檢測效率及檢測精 $ ^發明*要目的係提供_種縣縣她 速檢測方法,其係利用影像區隔、影像前處理〔例如二= =法、細線化法〕、圖像物體辨識及決策反應等影像i理 測封裝體進行相位重建,使得本發明具有減少 運异貝料1及提升檢測效率之功效。 本發明另-目的係提供一種封裝體表面起曲值之快 速檢測方法,其係—时光源經由光纖將至-遠心 〔tel_riC〕鏡頭’以提供一類似平行光,使得本發明 具有降低設備成本之功效。 、本發明再—目的係提供-種封裝體表面翹曲值之快 速檢測方法’其係利用至少i電材料控制一參考光拇之 相移距離’使件本發明具有提升相移距離精度及檢測精度 C:\Linda\Pk· Pat\PK9772 doc05/12/07/10:20 AM ——5~ !263801 ^The day guard, so as to reduce the detection efficiency. Therefore, it is necessary to improve the above-mentioned warpage value of the difficult county. It is necessary to improve the above disadvantages in view of the fact that the present invention improves the above-mentioned disadvantages, and the embossing method is combined with a specific image processing method to quickly go to the above-mentioned medium. The generated noise "can relatively improve the detection efficiency and:::= [Summary of the content] The county is responsible for the purpose of storage and supply - the county taxation = test method, which will be - reference grating relative - to be tested dragon body = Specially, she took a few shadow overlays to calculate the effect of the confirmation.升 detection efficiency and detection fine ^ ^ invention * to provide the purpose of providing _ kinds of county and county speed detection method, which uses image segmentation, image pre-processing (such as two = = method, thin line method), image object recognition and The decision-reaction and other image i-measurement package phase reconstruction, so that the invention has the effect of reducing the transportation of different materials and improving the detection efficiency. Another object of the present invention is to provide a rapid detection method for the surface curvature value of a package, which is to provide a similar parallel light through a fiber to a telecentric lens (tel_riC), so that the invention has the cost of reducing equipment. efficacy. The present invention further provides a method for rapidly detecting the warpage value of a package body, which uses at least an i-electric material to control the phase shift distance of a reference light thumb. The invention has improved phase shift distance accuracy and detection. Accuracy C:\Linda\Pk· Pat\PK9772 doc

〇5/12/〇7/1〇:2〇 AM —6 — -1263801 之功效。 根據本發明之封裝财面翹曲值之快速檢測方法, 其包含步驟:將—參考输設置於-制縣體上方;利 線通_參考光柵,以便在該待測縣體表面形成 =陰影光柵;利用一影像擷取模組擷取該參考光柵與陰影 光栅共同形成之-陰影疊紋;將該參考光柵移動蚊= 後’利用相同方法擷取另外至少二陰影疊紋;計算該數個 陰影疊紋’以獲得—相位影像;及對該相位影像進行影像 處理,以獲得該待測封裝體之一表面翹曲值。 【實施方式】 為讓本發明之上述及其他目的、特徵、優點能更明 顯易懂,下文特舉本發明之較佳實施例,並配合所附圖式 ’作詳細說明如下: &gt; 清麥照第1及2圖所示,其揭示本發明較佳實施例 之封裝體表面翹曲值之快速檢測方法之第一步驟,其係將 參考光栅20設置於一待測封裝體6上方。如第2圖所 示,本發明之封裝體表面翹曲值之快速檢測構造係包含一 承載座1、一相移機構2、一光源3、一影像擷取模組4 及一谷料單元5。該承載座1係用以承載該待測封裝體6 ,且該承載座1可選自輸送帶等輸送裝置,或選自靜態之 承載平台。該相移機構2係結合設置該參考光栅2〇,以 π動該筝考光栅20相對該待測封裝體6移動。該參考光 桃20可根據所需之檢測精度選擇適當之條紋密度,例如 20 lines/mm〔條/毫米〕或4〇 lines/mm等。該光源3係用 C:\Linda\PK Pat\PK9772. doc 〇5/12/〇7/i〇;2〇 —7 — 1263801〇5/12/〇7/1〇: 2〇 AM —6 — -1263801. The method for quickly detecting a package warpage value according to the present invention comprises the steps of: setting a reference transmission to a top of a county body; and using a reference line to form a shadow grating on the surface of the county to be tested; Using an image capturing module to capture the shadow grating formed by the reference grating and the shadow grating; moving the reference grating to the mosquito = after 'using the same method to capture another at least two shadow overlays; calculating the plurality of shadows The moiré obtains a phase image; and performs image processing on the phase image to obtain a surface warpage value of the package to be tested. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; As shown in FIGS. 1 and 2, the first step of the method for rapidly detecting the warpage value of the surface of the package according to the preferred embodiment of the present invention is disclosed. The reference grating 20 is disposed above a package to be tested 6. As shown in FIG. 2, the rapid detection structure of the surface warpage value of the package of the present invention comprises a carrier 1, a phase shifting mechanism 2, a light source 3, an image capturing module 4 and a grain unit 5. . The carrier 1 is used to carry the package 6 to be tested, and the carrier 1 may be selected from a conveyor such as a conveyor belt or a static carrier platform. The phase shifting mechanism 2 is configured to combine the reference grating 2 to move the kite grating 20 relative to the package to be tested 6 . The reference peach 20 can select an appropriate stripe density according to the required detection accuracy, for example, 20 lines/mm [bars/mm] or 4 lines/mm. The light source 3 is used by C:\Linda\PK Pat\PK9772. doc 〇5/12/〇7/i〇;2〇-7 763801

以照射該參考光栅20,且該光源3可選自雷射光源、鹵 素光源等。該光源3較佳係選自一函素光源、數條光纖及 一遠心〔telecentric〕鏡頭之組合,該鹵素光源係經由該 光纖引導至該遠心鏡頭,以提供一類似平行光線,進而相 對降低設備成本。該影像擷取模組4較佳可選自感光耦合 元件型〔Charge Coupled Device,CCD〕影像擷取模組, 以供擷取該參考光栅2〇本身影像及參考光柵20在該待測 封裝體6上所形成之陰影的影像。該容料單元5設有一進 料部51、一良品部52及一不良品部53,該進料部51係 用以盛裝該待測封裝體6,該良品部52及不良品部53係 分別用以回收該待測封裝體6檢測後之良品及不良品。該 待測封裝體ό較佳適用於積體電路〔integrated drcuit,IC i&amp;ij完成封裝之膠體的檢測作業,例如球格陣列〔Ball Grid Array,BGA〕型封裝體之檢測作業。 請參照第1至7圖及附照la所示,其揭示本發明較 佳實施例之封裝體表面翹曲值之快速檢測方法之第二及第 三步驟,其係利用該光源3照射該參考光栅2〇,以便在 該待測封裝體6表面形成一陰影光栅;及利用一影像擷取 ,組4擷取該參考光柵2〇與陰影光栅共同形成之一陰影 «紋〔如附照la所示〕。藉此,當該光源3照射該參考光 柵20 %,位於該參考光栅2〇以下之該待測封裝體6表面 係形成該陰影光栅。同時,由於該待測封裝體6之表面並 非凡全平整,因而該陰影光栅之條紋間距及相對位置係不 同於該參考光栅6。此外,如第3圖所示,該光源3與影 C:\Linda\PK PBt\PK9772. doc 05/12/07/10:20 —8 — 1263801 像擷取模組&lt;5之間設定具有一央角㊀, 定為45。如第4圖所示,該光源3之乂佳可找 光栅2〇之透光處,並在該待測封農體 相過該夢考 三處折射後,再通過該參考光柵HA、C、E ,該a、c、E三處形成亮點;2;=: 6表面之B、D :處騎㈣軸參枝= 透光處遮控而形成暗點。如第5 可,測封裝體6之面外位移值一 plane〕的表不式〔公式1〕,如下··The reference grating 20 is illuminated, and the light source 3 can be selected from a laser source, a halogen source, and the like. The light source 3 is preferably selected from the group consisting of a light source, a plurality of optical fibers, and a telecentric lens. The halogen light source is guided to the telecentric lens via the optical fiber to provide a similar parallel light, thereby relatively reducing the device. cost. The image capturing module 4 is preferably selected from a photosensitive coupled device (CCD) image capturing module for capturing the reference grating 2 itself and the reference grating 20 in the package to be tested. The image of the shadow formed on 6. The loading unit 5 is provided with a feeding portion 51, a good product portion 52 and a defective product portion 53. The feeding portion 51 is for holding the package to be tested 6, and the good product portion 52 and the defective product portion 53 are respectively It is used for recovering the good products and defective products after the detection of the package 6 to be tested. The package to be tested is preferably applied to an integrated circuit (integrated drcuit, IC i&amp; ij completes the inspection of the colloid, such as the detection of a Ball Grid Array (BGA) type package. Referring to Figures 1 to 7 and the accompanying drawings la, which disclose the second and third steps of the method for rapidly detecting the warpage value of the package body according to the preferred embodiment of the present invention, the light source 3 is used to illuminate the reference a grating 2 〇 to form a shadow grating on the surface of the package 6 to be tested; and using an image capture, the group 4 captures the reference grating 2 〇 together with the shadow grating to form a shadow «pattern [such as the attached la Show]. Thereby, when the light source 3 illuminates the reference grating 20%, the shadow grating is formed on the surface of the package to be tested 6 below the reference grating 2〇. At the same time, since the surface of the package to be tested 6 is completely flat, the stripe pitch and relative position of the shadow grating are different from the reference grating 6. In addition, as shown in Fig. 3, the light source 3 and the shadow C:\Linda\PK PBt\PK9772. doc 05/12/07/10:20 - 8 - 1263801 are set between the capture module &lt;5 One of the central corners is set at 45. As shown in Fig. 4, the light source 3 can find the light-transmitting portion of the grating 2〇, and after the reflection of the agricultural body to be tested, the reference gratings HA, C, E, the a, c, E three points form a bright spot; 2; =: 6 surface B, D: riding (four) axis ginseng = light transmission at the point of control to form a dark spot. As shown in the fifth, the surface displacement value of the package 6 is measured as a plane [Formula 1], as follows:

Ng = Wtana +Wtanj3 其中: W:代表該待測縣體6之面外位移值。 3 代表條紋序號〔即第N個條紋〕,其係將該待測 、裝,6與參考光栅2〇之距離為〇處〔即a點〕定為條 、、文序,N - 〇,由於該待測封裝體6表面之e處係位於第 2條亮紋,其條紋序號N = 2。 g ·該參考光柵2〇之密度。 α :代表入射光束與參考光栅20法線之夾角。 召.代表該影像擷取模組4與參考光柵2〇法線之夾 角0 接著,將該公式1整理後可獲得公式2,如下: __Ns tana + tan C:\Linda\PK Pat\PK977Z docNg = Wtana + Wtanj3 where: W: represents the out-of-plane displacement value of the body 6 to be tested. 3 represents the stripe number (ie, the Nth stripe), which is the distance to be measured, installed, and the reference grating 2〇 is 〇 (ie, a point) is defined as a strip, and the text order, N - 〇, due to The e of the surface of the package to be tested 6 is located in the second bright line, and the stripe number is N=2. g · The density of the reference grating 2〇. α : represents the angle between the incident beam and the normal of the reference grating 20 . Called. Represents the angle between the image capture module 4 and the reference raster 2〇 normal. Then, after formulating the formula 1, the formula 2 can be obtained as follows: __Ns tana + tan C:\Linda\PK Pat\PK977Z doc

05/12/07/10:20 AM 〔2〕 I2638〇i 如第6圖所示,若該光源3及影像擷取模組4與待 剛封裝物6之間具有相同之距離L,且該光源3及影像擷 取模組4之間的距離為D,則可獲得公式3,如下: tana + tan^z=_A_ 〔3〕05/12/07/10:20 AM [2] I2638〇i as shown in Fig. 6, if the light source 3 and the image capturing module 4 have the same distance L from the package 6 to be packaged, and The distance between the light source 3 and the image capturing module 4 is D, and Equation 3 can be obtained as follows: tana + tan^z=_A_ [3]

L + W 其中,若W«L,則,藉此公式3可碎 化為公式4,如下: 9 L 接著,將公式4帶入公式1之後,可獲得公式5 ,如 tana + tan^ D 〔4〕 下: 〔5〕 %;&gt; 則公式 接著’若將本發明之檢測機構設計為D = L 可簡化為公式6,如下: ‘Λ ⑷ 皮接者,若將該光源3改為平行光,則可解決該條錢 〜uN與待_封裝體6不成比例之問題。 請參昭楚Ί 。 例之44# μ 及9圖所示,其揭示本發明較佳實施 將該來^表她曲值之快速檢測方法之第四步驟,其係 外2G移動特定相位後,彻姻方法擷取另 示,本;=紋〔如附照…所示〕。如第9圖所 、至少二^移機構2設有-支撐塊21、-光栅架U 疋件23及至少一彈性元件24。該支撐塊2ι C:\Linda\PK Pat\PK9772· docL + W where, if W « L, then Equation 3 can be broken down to Equation 4, as follows: 9 L Next, after taking Equation 4 into Equation 1, Equation 5 can be obtained, such as tana + tan^ D 〔 4] Next: [5] %;&gt; Then the formula follows: 'If the design of the detection mechanism of the present invention is D = L, it can be simplified to Formula 6, as follows: 'Λ (4) Leather, if the light source 3 is changed to parallel Light, it can solve the problem that the money ~uN is not proportional to the package_6. Please refer to the show. For example, the 44# μ and 9 diagrams show a fourth step of the method for quickly detecting the curvature of the present invention, and after the external phase 2G moves a specific phase, the method of marriage is used to capture another Show, this; = pattern [as shown in the attached picture]. As shown in Fig. 9, at least the second shifting mechanism 2 is provided with a support block 21, a grating holder U member 23 and at least one elastic member 24. The support block 2ι C:\Linda\PK Pat\PK9772· doc

05/12/07/10:20 AM —10 — 1263801 係用以支撐該光被a。該光姉a制以結合該參考 光栅20,且該光栅架22係藉由該壓電元件23及彈性元 ^ 4、、’α σ °又置於該支撐塊21。因此,藉由控制該壓電元 =3之,即可控制該光栅架22之升降高度。藉此, 该影像擷取模組4可擷取數個不同相位之該陰影疊紋,以 供後續相㈣建之計算’進而姉提升檢聰度。此外, 該相移機構2每次移動之相位較佳係;Γ/2。 A心&amp;第1圖及附照le所示,其揭示本發明較佳實 封裝體表面_值之快速檢測方法之第五步驟,盆 係,鼻該數個陰影疊紋〔如附照la至ld所 得 之條紋05/12/07/10:20 AM —10 — 1263801 is used to support the light by a. The aperture a is formed to incorporate the reference grating 20, and the grating frame 22 is placed on the support block 21 by the piezoelectric element 23 and the elastic element ^4, 'α σ °. Therefore, by controlling the piezoelectric element = 3, the lifting height of the grating frame 22 can be controlled. In this way, the image capturing module 4 can capture the shadow overlays of several different phases for the subsequent phase (4) calculations to further improve the detection. In addition, the phase of the phase shifting mechanism 2 is preferably Γ/2. A heart &amp; 1 and the accompanying le, which discloses the fifth step of the method for quickly detecting the surface value of the preferred package of the present invention, the basin system, the nose and the number of shadow overlays [such as the attached la Stripe to ld

Kx,y) = I〇(x,y)*{i+ r (x5y)cos[ φ { 其中: (γ):代表該相位影像中每—像素之座標值。 度。代表該相位影像中位於狀座標值之影像強 景強t,y):代_位影像巾位於特_值之影像背 7(x,y):代表光強度的振幅。 :二代表該相位影像中每—像素之相位值。 得每一像素之相位值作,y),知數,若要獲 疊紋,且本發明較佳可擷取至少:广二個該陰影 個該陰影疊紋,以減少 C:\Linda\PK Pat\PK9772. docKx, y) = I 〇 (x, y) * {i + r (x5y) cos [ φ { where: (γ): represents the coordinate value of each pixel in the phase image. degree. Represents the image intensity at the coordinate value of the phase image, t, y): the image of the image is located at the back of the image of the special value 7 (x, y): represents the amplitude of the light intensity. : Two represents the phase value of each pixel in the phase image. The phase value of each pixel is made, y), and the number is obtained. If the pattern is to be folded, and the present invention preferably captures at least: the shadow of the shadow is reduced to reduce C:\Linda\PK. Pat\PK9772. doc

05/12/07/10:20 AM ~ 11〜 Ϊ263801 素的相位值表示 誤差。藉此,可獲得該相位影像之每一像 式〔公式7〕,如下:05/12/07/10:20 AM ~ 11~ Ϊ263801 The phase value of the prime indicates the error. Thereby, each image of the phase image [Equation 7] can be obtained as follows:

〔8〕 此外 -刻Γ 辦光柵2G每次移動μ 相位,共移動至少三次,以分職取至少四 \此法可簡稱為四步法〕。接著,將該四個陰影疊紋f 公式7,即可獲得該相位影像。 請參照第!圖及附所示,其揭示本發明較 圭實施例之封裝體表面龜曲值之快速檢測方法之第六步驟 怒輪g f係2相位影像〔如附照1e所示〕進行影像處理〔 、即相位重建處理〕,以獲得該待測縣體6之—表面龜曲 值。此時,該影像處理包含步驟·· ⑴、影㈣隔:錢將該池f彡像巾欲處理之區 域預先區隔出來,以減少運算資料量及運算時間。本發明 ,影像區隔係使用感興趣區域法〔regk)n ⑽ 〕,亦即將該待測封裝體6預妓位,以針對欲處理之重 點區域進行計算。 〔2〕、影像前處理:當對目位影像之特徵過少〔例 相位不連績處呈一粗線〕或過多〔例如雜訊〕時,盆 2對該她影像選擇㈣進行影像祕理。本發明之影 p處理較佳可選擇包含二值法〔即灰階值分割法〕、細 、、、去該—值法係在該相位影像之灰階值〔即ϋ至255 C:\Linda\PK Pat\PK977^ doc[8] In addition - engraved 光栅 2G grating 2G each time moving the μ phase, a total of at least three movements, to take at least four to divide the job \ this method can be referred to as the four-step method]. Then, the four shadows are overlaid by the formula 7, and the phase image is obtained. Please refer to the first! And the accompanying drawings, which disclose the sixth step of the method for detecting the surface tortuosity value of the package body of the present invention, which is a sixth step image of the anger wheel gf system (as shown in the attached 1e) for image processing (ie, Phase reconstruction processing] to obtain the surface tortuosity value of the county body 6 to be tested. At this time, the image processing includes steps (1) and shadow (four): the money is pre-separated from the area to be processed by the pool to reduce the amount of data and the operation time. In the present invention, the image segmentation system uses the region of interest method [regk]n (10)], that is, the package to be tested 6 is pre-clamped to calculate for the region of the weight to be processed. [2], image pre-processing: When there are too few features on the target image (such as a thick line at the phase of the performance) or too much (such as noise), the basin 2 selects (4) for her image selection. Preferably, the shadow p process of the present invention may include a binary method (ie, a grayscale value segmentation method), a thin, and a grayscale value of the phase image in the phase image (ie, 255 C:\Linda) \PK Pat\PK977^ doc

05/12/07/10:20 AM —12 — 1263801 =間〕中設定一闕值;若該相位影像特定部位之灰階值大 、这闕值’則定義為亮點〔即灰階值255〕;若灰階值 7闕值’則定義為暗點〔即灰階值0〕。該細線化法係 用Μ獲得該相位影像之骨架〔如附照lf所示〕。 ⑴、圖像物體辨識:其係將經過該二值法及細線 2 該影斜咖域成長法〔R_n G_ing〕加 辨識’該區域成長法包含步驟:〔a〕、奴成長核心、〔 判據及U〕、演算推進。其中,㈤、確定 ^核心.如附照ig所*,由於所有姆彡像係呈同心圓 2Ϊ=,因此第一區生長核心可設定於該影像之中心 :置。⑴、給定同值判據··如附照lg所示,由於傻 丄僅具有暗點〔即灰階值G〕與亮點〔即灰階值255〕 位不連續處。藉此,同值判據係由成長核心開始 演曾施有之暗點设為同—區’直至遇到白點為止。〔c〕、 二·如第lh所示,其符合同值判據之條件者,皆 :及二Ξ。2一區尋找完成且要尋找所有第二區之點 Ϊ由成長核心開始,並忽略第一區之 “、、、。接著,再遇到之暗點即屬於第二區之點 ,並以此類推求出其餘各區。 … 影像〔如附照π&quot;所η 寺裝體6相位展開 疊紋〔如5 + ’實驗的财巾發現該陰影 2二動:所示〕在相移時〔本發明係由〇至 〕知紋係由低處往高處移動。藉此,可得知該相 C:\Linda\PK Pat\PK9772 doc —13 ~ 05/12/07/10.-20 Α« 1263801 ,=像中之相對高度。接著,再根據各區相差27Γ之關係 。即y精確獲得各點的相位值,進而獲得該相位展開影像 之接著j尋找該相位展開影像之最高相位值及最低相位值 . ’將二值相減,即可由上述各公式求出該待測封裝體 • 的表面_值,而獲得三維立體影像〔如附照π所示〕 〇 、…如上所述’相較於制縣财聽曲值之檢測方 • 係利用光探針法、顯微干涉術或疊紋法,因而造成設備 縣高及量測_長轉點,第1圖之本創作储由操取 該參考光柵在數個特定相位之陰影疊紋,以計算獲得該相 位影像,及對該相位影像進行特定影像處理,其碟實可相 對提升檢測效率及檢測精確性。 I 雖然本發明6彻上述難實施姻示,然其並非 〜用以限定本發明,任何熟習此技藝者,在不脫離本發明之 精神t範圍之内’當可作各種更動與修改’因此本發明之 • 保護範圍當視後附之申請專利範圍所界定者為準。 C:\Lind8\PK PatvPK977i doc —14 —05/12/07/10:20 AM —12 — 1263801=Interval] Set a value; if the gray level value of a specific part of the phase image is large, the value of this value is defined as a bright point (ie gray level value 255) If the grayscale value is 7阙, it is defined as a dark point (ie, the grayscale value is 0). The thinning method is used to obtain the skeleton of the phase image (as shown by the attached lf). (1) Image object recognition: It will be identified by the binary method and the thin line 2 [R_n G_ing]. The growth method of the region includes steps: [a], slave growth core, [criteria And U], calculation progress. Among them, (5), determine ^ core. As attached ig*, since all the scorpions are concentric 2Ϊ, the growth core of the first zone can be set at the center of the image: set. (1) Given the same-valued criterion·· As shown in the attached picture lg, since the stupidity has only dark points (ie, gray-scale value G) and bright points (ie, gray-scale value 255), the bits are not continuous. In this way, the same-valued criterion is set by the growth core to be the same as the dark spot until the white point is encountered. [c], II. As indicated in point lh, those who meet the conditions of the same-valued criteria are: and two. 2 The search for a district and the search for all the second districts begins with the growth core and ignores the “,,,,,,,,,,,,,,,,,,,,,,,,,, Analogy to find the rest of the area. ... Image [such as attached π&quot; η Temple body 6 phase unfolding overlay [such as 5 + 'experimental financial towel found the shadow 2 two movements: shown] in the phase shift [this The invention moves from the lower to the higher, and the phase is C:\Linda\PK Pat\PK9772 doc —13 ~ 05/12/07/10.-20 Α« 1263801, = the relative height of the image. Then, according to the relationship between the regions, the relationship between the two is 27 y. That is, y accurately obtains the phase value of each point, and then obtains the phase-expanded image, and then finds the highest phase value and the lowest value of the phase-expanded image. Phase value. 'To subtract the two values, the surface value of the package to be tested can be obtained from the above formulas to obtain a three-dimensional image (as shown by the attached π) 〇, ... as described above The detection method of the county’s financial auditory value is based on the use of optical probe method, microscopic interferometry or embossing method. The county high and the measurement _ long turn point, the first picture of the creation of the storage by the reference grating in a number of specific phase shadow overlay, to calculate the phase image, and the specific image processing of the phase image The disc can improve the detection efficiency and the detection accuracy relatively. I Although the present invention is not difficult to implement the present invention, it is not intended to limit the present invention, and anyone skilled in the art can avoid the spirit of the present invention. Within the scope of 'there are various changes and modifications', the scope of protection of the present invention is subject to the definition of the scope of the patent application. C:\Lind8\PK PatvPK977i doc —14 —

05/12/07/10:20 AM 1263801 【圖式簡單說明】 第1圖··本發明封裝 流程方塊圖。 &amp;衣面趣曲值之快速檢測方法之 第2圖··本發明封裝 立體圖。 表面翹曲值之快速檢測構造之 第: 前視圖 圖 X月封裝體表面翹曲值之快速檢測構造之 第4圖··本發明封裝 行檢測作業之讀、圖。 值之快速檢測方法進 第5圖:本發明第4 锋〔η . 局部放大圖。 弟6圖··本發明封裝 ϋ 行檢測作業之示意圖。4_曲值之快速檢測方法進 弟7圖:本發明封裝 用平行光騎檢測作業d㈣值之快速檢測方法採 、 不思圖。 苐8圖:本發明封穿 相移時之侧視®。、體表_曲值讀速檢測構造在 知,地目本發月封裝體表面龜曲值之快速檢測構造之 相移機構之前視圖。 見把刿稱&amp;二 附照la至Id:本發明封裝 法所擷取之陰影疊紋f彡像。 〈时私利万 v附Γ、Γ *發明封|體表面㈣值之快速檢測方法所 计鼻出之相位影像。 附照If:本發_㈣表面翹曲值之快速檢測方法利 用細線化法所計算出之相位影像之骨架。 ::\Linda\PK Pat\Pi977Z doc05/12/07/10:20 AM 1263801 [Simple description of the drawing] Fig. 1 · The package diagram of the present invention. &amp; Quick detection method for the value of the clothing surface. Fig. 2 · The package of the present invention. The rapid detection structure of the surface warpage value: Front view Fig. 4 The rapid detection structure of the surface warpage value of the X-month package. Fig. 4························ The rapid detection method of the value is shown in Fig. 5: the fourth front [η. Brother 6 Figure · The schematic diagram of the package inspection operation of the present invention. 4_Quick value detection method into the younger brother 7: The package of the invention uses the parallel light riding detection operation d (four) value of the rapid detection method mining, not thinking. Figure 8: Side view of the present invention when the phase shift is applied. The front view of the phase shift mechanism of the rapid detection structure of the surface of the package on the surface of the moon. See nickname &amp; 2 attached la to Id: a shadow overlay image captured by the encapsulation method of the present invention. <Time private profit v Γ Γ, Γ * Invention seal | body surface (four) value of the rapid detection method to calculate the phase image of the nose. Attached: The rapid detection method of the surface warpage value of the hair _ (4) uses the skeleton of the phase image calculated by the thin line method. ::\Linda\PK Pat\Pi977Z doc

05/12/07/10:20 AM 15 1263801 附照lg:本發明封裝體表面翹曲值之快速檢測方法所 計算出之區域分割示意影像。 附照lh:本發明封裝體表面翹曲值之快速檢測方法所 計算出之區域分割示意影像。 附照li:本發明封裝體表面翹曲值之快速檢測方法所 計算出之相位展開影像。 附照lj:本發明封裝體表面翹曲值之快速檢測方法所 產生之三維立體影像。 【主要元件符號說明】 2 相移機構 21 支撐塊 23 壓電元件 3 光源 5 容料單元 52 良品部 6 待測封裝體 1 承載座 〜 20 參考光柵 趣J 22 光柵架 24 彈性元件 4 影像擷取模組 51 進料部 ) 53 不良品部05/12/07/10:20 AM 15 1263801 Attached lg: The method for quickly detecting the warpage value of the surface of the package of the present invention. Attachment lh: The area segmentation schematic image calculated by the rapid detection method of the surface warpage value of the package of the present invention. Attached Li: The phase unwrapped image calculated by the rapid detection method of the surface warpage value of the package of the present invention. Attachment lj: A three-dimensional image produced by the rapid detection method of the surface warpage value of the package of the present invention. [Main component symbol description] 2 Phase shifting mechanism 21 Support block 23 Piezoelectric element 3 Light source 5 Container unit 52 Good part 6 Package to be tested 1 Carrier seat ~ 20 Reference grating Fun J 22 Grating stand 24 Elastic component 4 Image capture Module 51 feeding section) 53 defective parts

Claims (1)

1263801 十、申請專利範圍: 、-種封賴表_㈣之快速檢測方法, 將-參考光栅設置於一待測封裝體上方, · 利用一光源之光線通過該參考光栅,, 裝體表面形成一陰影光柵,·1263801 X. Patent application scope: The rapid detection method of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Shadow raster, 其包含步, 以便在該待測封 影光栅共同 利用-影像擷取模組摘取該參考光拇與陰 形成之一陰影疊紋; κ =參考ί栅移動特定相位後,利用相同方法擷取另 外至少二陰影疊紋; 力 計算該數赠影纽,卩娜—她The method includes a step of extracting a shadow shadow of the reference light and the shadow formed by the image capturing module in the image capturing module to be tested; κ=refer to the λ gate to move a specific phase, and using the same method to capture In addition, at least two shadow overlays; force calculation of the number of gift shadows, Dina - she 對該相位雜騎影理,轉_待’騎裝體之 一表面翹曲值。 、依申請專魏圍第丨項所述之縣體表面翹曲值之快 速檢測構造,其係包含一承载座、一相移機構、一光 源及-影像擷取模組,該承载座係用以承載一待測封 裝體,該相移機構係用移動該參考光栅,該光源係用 、”、、射該參考光柵,該影像擷取模組係用以擷取該參 考光栅及其陰影之影像。 3、 依申」f專·圍第丨項所述之縣絲她曲值之快 速檢測構造’其係另包含-容料單元,該容料單元設 有—進料部、一良品部及一不良品部。 4、 依申^專利範㈣2項所述之封裝體表面㈣值之快 速檢測方法,其中該相移機構設有一支撐瑰、一光柵 C:\Linda\PK Pat\PK9TT2. doc 05/12/07/10:20 AM —17 — 1263801 =至少-壓電元件及至少一彈性元件,該光柵架係 ^由該壓電7〇件及彈性元件結合於該支撐塊 ,且該壓 電兀件係用以控制該光栅架之移動。 5依t叫專利圍第i項所述之封裝體表面麵曲值之快 速才欢測方去,其中該光源可選自雷射光源、i素光源 〇 6依專利範圍第1項所述之封裝體表面魅曲值之快For the phase of the ride, the surface warpage value of the rider is changed. According to the application for the rapid detection structure of the surface warpage value of the county body described in the article Wei Wei, the system includes a carrier, a phase shifting mechanism, a light source and an image capturing module. To carry a package to be tested, the phase shifting mechanism moves the reference grating, and the light source uses, and emits the reference grating, and the image capturing module is configured to capture the reference grating and its shadow. 3. The rapid detection structure of the county wire whose value is described in the section of the “Fei·Feng·Wei 丨 丨 ' 其 其 其 其 其 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容 容And a defective product department. 4. The method for quickly detecting the surface (four) value of the package body according to the application of the patent (4), wherein the phase shifting mechanism is provided with a support grating and a grating C:\Linda\PK Pat\PK9TT2. doc 05/12/07 /10:20 AM —17 — 1263801 = at least a piezoelectric element and at least one elastic element, the grating frame is coupled to the support block by the piezoelectric element and the elastic element, and the piezoelectric element is used To control the movement of the grating. 5 According to the patent, the surface curvature value of the package described in item i is fast, and the light source can be selected from the laser source and the light source 〇6 according to the first item of the patent scope. The surface of the package is fast 速1方法,其中該光源具有-¾素光源、數條光纖 及一遠心鏡頭,該光纖係將該自素光源之光線引導至 該遠心鏡頭。 7、 依t請專利範圍第1項所述之封裝體表曲值之快 速檢測方法,其中該光源及影像擷取單元之間具有一 夾角。 8、 依申請專鄕圍第7項所述之封裝齡面翹曲值之快 速檢測方法,其中該夾角係45。。 依申咕專利乾圍第1項所述之封裝體表面魏曲值之快 速檢測方法,其中該光源至影像擷取模組之距離係實 質等於該光源及影像擷取模組至該參考光柵之垂直距 離。 10、依申请專利範圍第1項所述之封裝體表面翹曲值之快 速檢測方法,其中該參考光柵每次移動之栢位係7Γ/2 11、依申請專利範圍第1項所述之封裝體表面翹曲值之快 速檢測方法,其中該影像處理選自影像區隔、影像前 C:\Linda\PK Pftt\PI977Z doc —18 — 05/12/07/10:20 AM 1263801 處理、圖像物體辨識、決策反應。 12、 依申請專利範圍第11項所述之封裝體表面翹曲值之快 速檢測方法,其中該影像區隔係選自重點區域法。 13、 依申請專利範圍第11項所述之封裝體表面翹曲值之快 速檢測方法,其中該影像前處理選自二值法、細線化 法。 14、 依申請專利範圍第11項所述之封裝體表面翹曲值之快 速檢測方法,其中該圖像物體辨識係選自區域成長法The speed 1 method, wherein the light source has a -3⁄4 source, a plurality of fibers, and a telecentric lens, the fiber guiding the light from the source to the telecentric lens. 7. The rapid detection method of the package curvature value according to the first aspect of the patent scope, wherein the light source and the image capturing unit have an angle between them. 8. According to the application, the rapid detection method of the package age warping value described in Item 7 is applied, wherein the angle is 45. . The method for rapidly detecting the surface warpage value of the package body according to the first aspect of the patent application, wherein the distance from the light source to the image capturing module is substantially equal to the light source and the image capturing module to the reference grating vertical distance. 10. A rapid detection method for the surface warpage value of the package according to item 1 of the patent application scope, wherein the reference grating is moved at a position of 7Γ/2 11 for each movement, and the package according to the first item of the patent application scope A rapid detection method for the surface warpage value, wherein the image processing is selected from the image segmentation, before the image C:\Linda\PK Pftt\PI977Z doc —18 — 05/12/07/10:20 AM 1263801 Processing, image Object identification, decision response. 12. The rapid detection method of the surface warpage value of the package according to claim 11 of the patent application scope, wherein the image segment is selected from the key area method. 13. The rapid detection method of the surface warpage value of the package according to Item 11 of the patent application scope, wherein the image pretreatment is selected from the group consisting of a binary method and a thin line method. 14. The rapid detection method for the surface warpage value of the package according to claim 11 of the patent application scope, wherein the image object identification system is selected from the group growth method 15、依申請專利範圍第14項所述之封裝體表面翹曲值之快 速檢測方法’其中該區域成長法包含步驟:確定成長 核心;給定同值判定;及演算推進。15. The rapid detection method for the surface warpage value of the package according to item 14 of the patent application scope wherein the growth method of the region comprises the steps of: determining the growth core; determining the same value; and calculating the advancement. C:\Iinda\PK Pat\PK977Z doc —19 — 05/12/07/10:20 AMC:\Iinda\PK Pat\PK977Z doc —19 — 05/12/07/10:20 AM
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