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Application filed by United Microelectronics CorpfiledCriticalUnited Microelectronics Corp
Priority to TW94140568ApriorityCriticalpatent/TWI267931B/en
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Publication of TWI267931BpublicationCriticalpatent/TWI267931B/en
Publication of TW200721332ApublicationCriticalpatent/TW200721332A/en
Design And Manufacture Of Integrated Circuits
(AREA)
Semiconductor Integrated Circuits
(AREA)
Internal Circuitry In Semiconductor Integrated Circuit Devices
(AREA)
Abstract
A semiconductor structure is described. The semiconductor structure includes a substrate, a pad, a fuse structure and a protection layer. The substrate has a pad region and a fuse region. The pad is disposed in the substrate at the pad region. The fuse structure is disposed in the substrate at the fuse region. The protection layer is disposed on the substrate to cover the pad region and the fuse region. The pad can be oxidized because of the protection layer.
TW94140568A2005-11-182005-11-18Semiconductor structure and process method thereof
TWI267931B
(en)