TW200721295A - Composition for etching metal layer and method of forming metal pattern using the same - Google Patents

Composition for etching metal layer and method of forming metal pattern using the same

Info

Publication number
TW200721295A
TW200721295A TW094140471A TW94140471A TW200721295A TW 200721295 A TW200721295 A TW 200721295A TW 094140471 A TW094140471 A TW 094140471A TW 94140471 A TW94140471 A TW 94140471A TW 200721295 A TW200721295 A TW 200721295A
Authority
TW
Taiwan
Prior art keywords
composition
weight
same
metal layer
etching
Prior art date
Application number
TW094140471A
Other languages
Chinese (zh)
Other versions
TWI292932B (en
Inventor
Jong-Il Kim
Kyoung-Mook Lee
Kte-Chan Song
Sam-Young Cho
Hyun-Cheol Shin
Kim Nam-Seo
Lee Ki-Beom
Original Assignee
Lg Philips Lcd Co Ltd
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Philips Lcd Co Ltd, Dongjin Semichem Co Ltd filed Critical Lg Philips Lcd Co Ltd
Priority to TW94140471A priority Critical patent/TWI292932B/en
Publication of TW200721295A publication Critical patent/TW200721295A/en
Application granted granted Critical
Publication of TWI292932B publication Critical patent/TWI292932B/en

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Landscapes

  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

A composition for etching a metal layer includes: about 55% to about 80% by weight of a phosphoric acid; about 3% to about 15% by weight of a nitric acid; about 5% to about 20% by weight of an acetic acid; about 0.5 % to about 10 % by weight of a phosphate; about 0.1% to about 5% by weight of a chloric compound; about 0.01% to about 4% by weight of an azolic compound; and a water.
TW94140471A 2005-11-17 2005-11-17 Composition for etching metal layer and method of forming metal pattern using the same TWI292932B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94140471A TWI292932B (en) 2005-11-17 2005-11-17 Composition for etching metal layer and method of forming metal pattern using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94140471A TWI292932B (en) 2005-11-17 2005-11-17 Composition for etching metal layer and method of forming metal pattern using the same

Publications (2)

Publication Number Publication Date
TW200721295A true TW200721295A (en) 2007-06-01
TWI292932B TWI292932B (en) 2008-01-21

Family

ID=45067672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94140471A TWI292932B (en) 2005-11-17 2005-11-17 Composition for etching metal layer and method of forming metal pattern using the same

Country Status (1)

Country Link
TW (1) TWI292932B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110647255A (en) * 2019-08-15 2020-01-03 信利光电股份有限公司 Manufacturing method of touch screen metal wire
US11180826B2 (en) 2014-06-25 2021-11-23 Uwin Nanotech Co., Ltd. Tin stripping method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11180826B2 (en) 2014-06-25 2021-11-23 Uwin Nanotech Co., Ltd. Tin stripping method
CN110647255A (en) * 2019-08-15 2020-01-03 信利光电股份有限公司 Manufacturing method of touch screen metal wire

Also Published As

Publication number Publication date
TWI292932B (en) 2008-01-21

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees