TW200721257A - Photoresist feeder - Google Patents

Photoresist feeder

Info

Publication number
TW200721257A
TW200721257A TW095136746A TW95136746A TW200721257A TW 200721257 A TW200721257 A TW 200721257A TW 095136746 A TW095136746 A TW 095136746A TW 95136746 A TW95136746 A TW 95136746A TW 200721257 A TW200721257 A TW 200721257A
Authority
TW
Taiwan
Prior art keywords
containers
photoresist
feeder
delivery lines
liquid delivery
Prior art date
Application number
TW095136746A
Other languages
Chinese (zh)
Other versions
TWI390597B (en
Inventor
Haruyuki Matsuoka
Norihiro Takasaki
Original Assignee
Mitsubishi Chem Eng Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chem Eng Corp filed Critical Mitsubishi Chem Eng Corp
Publication of TW200721257A publication Critical patent/TW200721257A/en
Application granted granted Critical
Publication of TWI390597B publication Critical patent/TWI390597B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)
  • Jet Pumps And Other Pumps (AREA)

Abstract

To provide a photoresist feeder for reducing the consumption of inert gas such as nitrogen, and for stably and continuously supplying a photoresist from which air bubbles are completely removed. A photoresist feeder is configured to continuously supply the photoresists carried in by portable containers (1a) and (1b) to a processing process by a pump (4). The feeder is provided with liquid delivery lines (L1), (L2) and so on from the portable containers (1a) and (1b) to the pump (4), and the respective liquid delivery lines (L1) and (L2) are provided with intermediate containers (2a) and (2b), respectively, for temporarily storing the photoresists extracted from the portable containers (1a) and (1b). The intermediate containers (2a) and (2b) are configured as vapor liquid separators for exhausting separated gas, and the plurality of systems of liquid delivery lines (L1) and (L2) are configured so as to be switched according to quantities of liquids of the intermediate containers (2a) and (2b).
TW095136746A 2005-11-21 2006-10-03 Photoresist supply device TWI390597B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005335872A JP5142464B2 (en) 2005-11-21 2005-11-21 Photoresist supply device

Publications (2)

Publication Number Publication Date
TW200721257A true TW200721257A (en) 2007-06-01
TWI390597B TWI390597B (en) 2013-03-21

Family

ID=38204752

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136746A TWI390597B (en) 2005-11-21 2006-10-03 Photoresist supply device

Country Status (3)

Country Link
JP (1) JP5142464B2 (en)
KR (1) KR101266886B1 (en)
TW (1) TWI390597B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5231028B2 (en) * 2008-01-21 2013-07-10 東京エレクトロン株式会社 Coating liquid supply device
JP5471281B2 (en) * 2009-10-19 2014-04-16 大日本印刷株式会社 Liquid supply system, liquid supply method, and coating apparatus

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3545559B2 (en) * 1996-12-25 2004-07-21 東京エレクトロン株式会社 Processing liquid supply device
JP3680907B2 (en) * 1998-06-02 2005-08-10 大日本スクリーン製造株式会社 Substrate processing equipment
JP3461725B2 (en) * 1998-06-26 2003-10-27 東京エレクトロン株式会社 Treatment liquid supply device and treatment liquid supply method
JP2000173902A (en) * 1998-12-08 2000-06-23 Dainippon Screen Mfg Co Ltd Substrate treatment system
JP3782281B2 (en) * 1999-04-19 2006-06-07 東京エレクトロン株式会社 Coating film forming method and coating apparatus
JP2001126975A (en) * 1999-10-26 2001-05-11 Dainippon Screen Mfg Co Ltd Substrate applicator
JP2001137766A (en) * 1999-11-16 2001-05-22 Tokyo Electron Ltd Treatment liquid supply method and treatment liquid supply apparatus
JP2001230191A (en) * 2000-02-18 2001-08-24 Tokyo Electron Ltd Method and apparatus for supplying treatment liquid
JP4335470B2 (en) * 2000-03-31 2009-09-30 東京エレクトロン株式会社 Coating device and mixing device
US7078355B2 (en) * 2003-12-29 2006-07-18 Asml Holding N.V. Method and system of coating polymer solution on surface of a substrate

Also Published As

Publication number Publication date
JP5142464B2 (en) 2013-02-13
KR20070053606A (en) 2007-05-25
KR101266886B1 (en) 2013-05-24
TWI390597B (en) 2013-03-21
JP2007142264A (en) 2007-06-07

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