TW200720311A - Thermosetting composition, antihalation film for solid-state imaging device and process for producing the same, and solid-state imaging device - Google Patents

Thermosetting composition, antihalation film for solid-state imaging device and process for producing the same, and solid-state imaging device

Info

Publication number
TW200720311A
TW200720311A TW095136954A TW95136954A TW200720311A TW 200720311 A TW200720311 A TW 200720311A TW 095136954 A TW095136954 A TW 095136954A TW 95136954 A TW95136954 A TW 95136954A TW 200720311 A TW200720311 A TW 200720311A
Authority
TW
Taiwan
Prior art keywords
solid
imaging device
state imaging
thermosetting composition
producing
Prior art date
Application number
TW095136954A
Other languages
Chinese (zh)
Inventor
Junji Yoshizawa
Yoshifumi Kato
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200720311A publication Critical patent/TW200720311A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04—Homopolymers or copolymers of esters
    • C09D133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Optical Filters (AREA)
  • Epoxy Resins (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)

Abstract

A thermosetting composition which comprises a copolymer of a polymerizable unsaturated compound having an oxiranyl or oxetanyl group with other polymerizable unsaturated compound and a radiation absorber such as 2,4,2',4'-tetrahydroxybenzophenone. This thermosetting composition can effectively inhibit irregular light reflection from an underlying substrate in an exposure step for forming a color filter or microlens in producing a solid-state imaging device. It can form an antihalation film which has a high degree of heat resistance and does not come to have a rough surface even upon dry etching.
TW095136954A 2005-10-05 2006-10-04 Thermosetting composition, antihalation film for solid-state imaging device and process for producing the same, and solid-state imaging device TW200720311A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005292702A JP2007099943A (en) 2005-10-05 2005-10-05 Thermosetting composition, antihalation film for solid-state imaging device, method for forming the same and solid-state imaging device

Publications (1)

Publication Number Publication Date
TW200720311A true TW200720311A (en) 2007-06-01

Family

ID=37942692

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136954A TW200720311A (en) 2005-10-05 2006-10-04 Thermosetting composition, antihalation film for solid-state imaging device and process for producing the same, and solid-state imaging device

Country Status (3)

Country Link
JP (1) JP2007099943A (en)
TW (1) TW200720311A (en)
WO (1) WO2007043449A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110582728A (en) * 2017-05-02 2019-12-17 日产化学株式会社 Composition for forming protective film resistant to aqueous hydrogen peroxide solution
TWI757477B (en) * 2017-05-02 2022-03-11 日商日產化學工業股份有限公司 Resist underlayer film-forming composition

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007332200A (en) * 2006-06-13 2007-12-27 Jsr Corp Thermosetting resin composition, forming method of antihalation film of solid imaging element, antihalation film of solid imaging element, and solid imaging element
KR101290057B1 (en) * 2010-07-19 2013-07-26 주식회사 엘지화학 Thermally curable resin composition with good coating and recoating property
JP5745458B2 (en) * 2011-05-18 2015-07-08 富士フイルム株式会社 Dispersion composition, curable composition using the same, transparent film, microlens, and solid-state imaging device, transparent film manufacturing method, microlens manufacturing method, and solid-state imaging device manufacturing method
CN109952631B (en) 2016-09-16 2023-07-25 日产化学株式会社 Composition for forming protective film

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05202228A (en) * 1991-07-16 1993-08-10 Tosoh Corp Leveling material and leveling method
JP3683285B2 (en) * 1993-03-31 2005-08-17 Ｊｓｒ株式会社 Composition for antihalation film of solid-state imaging device and antihalation film of solid-state imaging device formed therefrom
JP3192548B2 (en) * 1994-04-22 2001-07-30 東京応化工業株式会社 Positive photoresist composition
JP2002040651A (en) * 2000-07-25 2002-02-06 Fujifilm Arch Co Ltd Positive photosensitive resin composition
JP3951302B2 (en) * 2002-11-29 2007-08-01 Ｊｓｒ株式会社 Thermosetting composition, antihalation film for solid-state imaging device and method for forming the same, and solid-state imaging device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110582728A (en) * 2017-05-02 2019-12-17 日产化学株式会社 Composition for forming protective film resistant to aqueous hydrogen peroxide solution
TWI757477B (en) * 2017-05-02 2022-03-11 日商日產化學工業股份有限公司 Resist underlayer film-forming composition
TWI783812B (en) * 2017-05-02 2022-11-11 日商日產化學工業股份有限公司 Resist underlayer film-forming composition
CN110582728B (en) * 2017-05-02 2023-11-17 日产化学株式会社 Composition for forming protective film resistant to aqueous hydrogen peroxide solution

Also Published As

Publication number Publication date
WO2007043449A1 (en) 2007-04-19
JP2007099943A (en) 2007-04-19

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