TW200719402A - Method for thinning wafer - Google Patents

Method for thinning wafer

Info

Publication number
TW200719402A
TW200719402A TW094138524A TW94138524A TW200719402A TW 200719402 A TW200719402 A TW 200719402A TW 094138524 A TW094138524 A TW 094138524A TW 94138524 A TW94138524 A TW 94138524A TW 200719402 A TW200719402 A TW 200719402A
Authority
TW
Taiwan
Prior art keywords
wafer
thinning
chips
transparent carrier
cutting
Prior art date
Application number
TW094138524A
Other languages
Chinese (zh)
Other versions
TWI293189B (en
Inventor
Chang-Yueh Chan
Chung-Lun Liu
Han-Lung Tsai
Cheng-Hsu Hsiao
Chien-Ping Huang
Original Assignee
Siliconware Precision Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siliconware Precision Industries Co Ltd filed Critical Siliconware Precision Industries Co Ltd
Priority to TW094138524A priority Critical patent/TWI293189B/en
Publication of TW200719402A publication Critical patent/TW200719402A/en
Application granted granted Critical
Publication of TWI293189B publication Critical patent/TWI293189B/en

Links

Abstract

A method for thinning a wafer is provided, wherein the method includes adhering a transparent carrier to an active surface of the wafer having a plurality of chips; along cutting lines between the chips cutting the transparent carrier and the wafer to a predetermined depth; and then thinning an inactive surface of the wafer to the predetermined depth cut in advance to separate the chips from each other. Thus, by firmly supporting the wafer with the transparent carrier and by cutting the transparent carrier and the wafer prior to performing a polishing thinning procedure, the wafer warping and cracking problems induced by a residual stress from thinning the wafer and resulted in subsequent difficulty in cutting and even cracking of the chips can therefore be prevented.
TW094138524A 2005-11-03 2005-11-03 Method for thinning wafer TWI293189B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094138524A TWI293189B (en) 2005-11-03 2005-11-03 Method for thinning wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094138524A TWI293189B (en) 2005-11-03 2005-11-03 Method for thinning wafer

Publications (2)

Publication Number Publication Date
TW200719402A true TW200719402A (en) 2007-05-16
TWI293189B TWI293189B (en) 2008-02-01

Family

ID=45067762

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138524A TWI293189B (en) 2005-11-03 2005-11-03 Method for thinning wafer

Country Status (1)

Country Link
TW (1) TWI293189B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI570797B (en) * 2011-05-27 2017-02-11 康寧公司 Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer
TWI690980B (en) * 2018-12-07 2020-04-11 台灣愛司帝科技股份有限公司 Method for transferring chip and chip transferring apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI570797B (en) * 2011-05-27 2017-02-11 康寧公司 Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer
US9573835B2 (en) 2011-05-27 2017-02-21 Corning Incorporated Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer
TWI690980B (en) * 2018-12-07 2020-04-11 台灣愛司帝科技股份有限公司 Method for transferring chip and chip transferring apparatus
CN111293066A (en) * 2018-12-07 2020-06-16 台湾爱司帝科技股份有限公司 Chip transfer method and chip transfer apparatus

Also Published As

Publication number Publication date
TWI293189B (en) 2008-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees