TW200719402A - Method for thinning wafer - Google Patents
Method for thinning waferInfo
- Publication number
- TW200719402A TW200719402A TW094138524A TW94138524A TW200719402A TW 200719402 A TW200719402 A TW 200719402A TW 094138524 A TW094138524 A TW 094138524A TW 94138524 A TW94138524 A TW 94138524A TW 200719402 A TW200719402 A TW 200719402A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- thinning
- chips
- transparent carrier
- cutting
- Prior art date
Links
Abstract
A method for thinning a wafer is provided, wherein the method includes adhering a transparent carrier to an active surface of the wafer having a plurality of chips; along cutting lines between the chips cutting the transparent carrier and the wafer to a predetermined depth; and then thinning an inactive surface of the wafer to the predetermined depth cut in advance to separate the chips from each other. Thus, by firmly supporting the wafer with the transparent carrier and by cutting the transparent carrier and the wafer prior to performing a polishing thinning procedure, the wafer warping and cracking problems induced by a residual stress from thinning the wafer and resulted in subsequent difficulty in cutting and even cracking of the chips can therefore be prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094138524A TWI293189B (en) | 2005-11-03 | 2005-11-03 | Method for thinning wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094138524A TWI293189B (en) | 2005-11-03 | 2005-11-03 | Method for thinning wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200719402A true TW200719402A (en) | 2007-05-16 |
TWI293189B TWI293189B (en) | 2008-02-01 |
Family
ID=45067762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094138524A TWI293189B (en) | 2005-11-03 | 2005-11-03 | Method for thinning wafer |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI293189B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI570797B (en) * | 2011-05-27 | 2017-02-11 | 康寧公司 | Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer |
TWI690980B (en) * | 2018-12-07 | 2020-04-11 | 台灣愛司帝科技股份有限公司 | Method for transferring chip and chip transferring apparatus |
-
2005
- 2005-11-03 TW TW094138524A patent/TWI293189B/en not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI570797B (en) * | 2011-05-27 | 2017-02-11 | 康寧公司 | Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer |
US9573835B2 (en) | 2011-05-27 | 2017-02-21 | Corning Incorporated | Non-polished glass wafer, thinning system and method for using the non-polished glass wafer to thin a semiconductor wafer |
TWI690980B (en) * | 2018-12-07 | 2020-04-11 | 台灣愛司帝科技股份有限公司 | Method for transferring chip and chip transferring apparatus |
CN111293066A (en) * | 2018-12-07 | 2020-06-16 | 台湾爱司帝科技股份有限公司 | Chip transfer method and chip transfer apparatus |
Also Published As
Publication number | Publication date |
---|---|
TWI293189B (en) | 2008-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |