TW200718672A - Electrostatic chuck - Google Patents
Electrostatic chuckInfo
- Publication number
- TW200718672A TW200718672A TW094140126A TW94140126A TW200718672A TW 200718672 A TW200718672 A TW 200718672A TW 094140126 A TW094140126 A TW 094140126A TW 94140126 A TW94140126 A TW 94140126A TW 200718672 A TW200718672 A TW 200718672A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrostatic chuck
- article
- chuck
- alumna
- chucked
- Prior art date
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
To provide an electrostatic chuck in which a smooth surface can be sustained even after exposure to plasma and, as a result, particle smearing can be controlled for an article to be chucked, e.g. a silicon wafer, and excellent chuck/release characteristics of the article are ensured. The electrostatic chuck comprises a dielectric containing 99.4 wt% or more of alumna, and 0.2-0.6 wt% of titanium oxide, having average particle size of sintered body not larger than 2 μm, and volume resistively of 108-1011 Ω cm at room temperature, and it is uses at low temperatures not higher than 100 DEG C.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004224105A JP2006049356A (en) | 2004-07-30 | 2004-07-30 | Electrostatic chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200718672A true TW200718672A (en) | 2007-05-16 |
Family
ID=36027600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094140126A TW200718672A (en) | 2004-07-30 | 2005-11-15 | Electrostatic chuck |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2006049356A (en) |
| TW (1) | TW200718672A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4722463B2 (en) * | 2004-12-03 | 2011-07-13 | 黒崎播磨株式会社 | Dielectric ceramics for electrostatic chuck and manufacturing method thereof |
| JP4708153B2 (en) * | 2005-10-21 | 2011-06-22 | 株式会社ニッカトー | Conductive alumina sintered body |
| JP2008085129A (en) * | 2006-09-28 | 2008-04-10 | Taiheiyo Cement Corp | Substrate mounting apparatus |
| JP2009004752A (en) * | 2007-05-18 | 2009-01-08 | Toto Ltd | Electrostatic chuck |
| JP2008288428A (en) * | 2007-05-18 | 2008-11-27 | Toto Ltd | Electrostatic chuck |
| JP4786693B2 (en) | 2008-09-30 | 2011-10-05 | 三菱重工業株式会社 | Wafer bonding apparatus and wafer bonding method |
| JP6052976B2 (en) | 2012-10-15 | 2016-12-27 | 日本タングステン株式会社 | Electrostatic chuck dielectric layer and electrostatic chuck |
| US20220390829A1 (en) | 2019-12-13 | 2022-12-08 | Mitsui Chemicals, Inc. | Pellicle demounting method, and pellicle demounting device |
-
2004
- 2004-07-30 JP JP2004224105A patent/JP2006049356A/en not_active Withdrawn
-
2005
- 2005-11-15 TW TW094140126A patent/TW200718672A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2006049356A (en) | 2006-02-16 |
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