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Publication date
Application filed by Foxconn Tech Co LtdfiledCriticalFoxconn Tech Co Ltd
Priority to TW094136953ApriorityCriticalpatent/TW200718333A/en
Publication of TW200718333ApublicationCriticalpatent/TW200718333A/en
Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices
(AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices
(AREA)
Abstract
A heat dissipation device includes a heat sink, a fan, and an air cooling member. Airflow produced by the fan is led to the heat sink after passing through the air cooling member.