TW200716945A - Apparatus for and method of measuring image - Google Patents

Apparatus for and method of measuring image

Info

Publication number
TW200716945A
TW200716945A TW095137726A TW95137726A TW200716945A TW 200716945 A TW200716945 A TW 200716945A TW 095137726 A TW095137726 A TW 095137726A TW 95137726 A TW95137726 A TW 95137726A TW 200716945 A TW200716945 A TW 200716945A
Authority
TW
Taiwan
Prior art keywords
image
projection grating
ccd camera
capturing
captured
Prior art date
Application number
TW095137726A
Other languages
English (en)
Other versions
TWI293110B (en
Inventor
Sang-Yoon Lee
Ee-Bae Choi
Min-Gu Kang
Ssang-Gun Lim
Original Assignee
Intekplus Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intekplus Co Ltd filed Critical Intekplus Co Ltd
Publication of TW200716945A publication Critical patent/TW200716945A/zh
Application granted granted Critical
Publication of TWI293110B publication Critical patent/TWI293110B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/204—Image signal generators using stereoscopic image cameras
    • H04N13/207—Image signal generators using stereoscopic image cameras using a single 2D image sensor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N13/00—Stereoscopic video systems; Multi-view video systems; Details thereof
    • H04N13/20—Image signal generators
    • H04N13/204—Image signal generators using stereoscopic image cameras
    • H04N13/254—Image signal generators using stereoscopic image cameras in combination with electromagnetic radiation sources for illuminating objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW095137726A 2005-10-19 2006-10-13 Apparatus for and method of measuring image TWI293110B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050098851A KR100752758B1 (ko) 2005-10-19 2005-10-19 영상 측정 장치 및 그 방법

Publications (2)

Publication Number Publication Date
TW200716945A true TW200716945A (en) 2007-05-01
TWI293110B TWI293110B (en) 2008-02-01

Family

ID=37962672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137726A TWI293110B (en) 2005-10-19 2006-10-13 Apparatus for and method of measuring image

Country Status (6)

Country Link
US (1) US20080266391A1 (zh)
EP (1) EP1946376B1 (zh)
KR (1) KR100752758B1 (zh)
CN (1) CN101292359B (zh)
TW (1) TWI293110B (zh)
WO (1) WO2007046601A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407075B (zh) * 2010-03-16 2013-09-01 Test Research Inc 量測立體物件之系統

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JP5074896B2 (ja) * 2007-11-16 2012-11-14 株式会社キーエンス 検査支援システム及び画像処理コントローラ
CN101451826B (zh) * 2008-12-17 2010-06-09 中国科学院上海光学精密机械研究所 物体三维轮廓测量装置及测量方法
JP5095644B2 (ja) * 2009-01-23 2012-12-12 株式会社キーエンス 画像計測装置及びコンピュータプログラム
KR101028661B1 (ko) * 2009-05-27 2011-04-12 주식회사 고영테크놀러지 3차원형상 측정장치 및 측정방법
TWI402479B (zh) 2009-12-15 2013-07-21 Ind Tech Res Inst 深度感測方法及應用其之系統
JP5930531B2 (ja) * 2012-05-24 2016-06-08 三菱電機エンジニアリング株式会社 撮像装置および撮像方法
KR101302340B1 (ko) * 2012-07-17 2013-10-15 주식회사 디오에프연구소 머신 비젼 카메라 트리거 발생장치와 이를 이용한 광학측정장치
WO2017162778A1 (de) 2016-03-22 2017-09-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung zur 3-dimensionalen vermessung eines objekts, verfahren und computerprogramm mit bildbasierter auslösung
KR101856073B1 (ko) * 2016-10-04 2018-05-10 온스캔스주식회사 3차원 스캐닝 방법 및 그 장치
KR102044355B1 (ko) * 2018-03-20 2019-11-13 (주) 인텍플러스 다채널 조명을 이용한 영상 획득장치 및 영상 획득방법
CN112740666A (zh) 2018-07-19 2021-04-30 艾科缇弗外科公司 自动手术机器人视觉系统中多模态感测深度的系统和方法
KR20220021920A (ko) 2019-04-08 2022-02-22 액티브 서지컬, 인크. 의료 이미징을 위한 시스템 및 방법
WO2021035094A1 (en) 2019-08-21 2021-02-25 Activ Surgical, Inc. Systems and methods for medical imaging

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JP2741463B2 (ja) * 1992-08-19 1998-04-15 いわき電子株式会社 半田付け外観検査方法
US6028672A (en) * 1996-09-30 2000-02-22 Zheng J. Geng High speed three dimensional imaging method
JPH0961132A (ja) * 1995-08-28 1997-03-07 Olympus Optical Co Ltd ３次元形状計測装置
JP3914638B2 (ja) * 1997-09-09 2007-05-16 シーケーディ株式会社 形状計測装置
US6438272B1 (en) * 1997-12-31 2002-08-20 The Research Foundation Of State University Of Ny Method and apparatus for three dimensional surface contouring using a digital video projection system
US6636255B1 (en) * 1998-01-29 2003-10-21 Fuji Photo Optical Co., Ltd. Three-dimensional image scanner and heat-insulating device for optical apparatus
JP4154025B2 (ja) * 1998-03-11 2008-09-24 キヤノン株式会社 撮像装置
US6763133B1 (en) * 1999-05-29 2004-07-13 Sun Moon University Moire image capturing apparatus and method therefor
JP3494964B2 (ja) * 2000-07-28 2004-02-09 株式会社山武 表面形状測定装置
KR100389017B1 (ko) * 2000-11-22 2003-06-25 (주) 인텍플러스 모아레무늬 발생기를 적용한 위상천이 영사식 모아레방법및 장치
JP3747471B2 (ja) * 2002-03-07 2006-02-22 株式会社高岳製作所 偏光方位検出型２次元受光タイミング検出装置およびそれを用いた表面形状計測装置
JP3731073B2 (ja) * 2002-09-17 2006-01-05 独立行政法人理化学研究所 顕微鏡装置
KR100495120B1 (ko) * 2002-09-26 2005-06-14 (주) 인텍플러스 촬상 영상 고속 포획장치 및 그 방법
TW580556B (en) * 2002-11-22 2004-03-21 Ind Tech Res Inst Method and system for measuring the three-dimensional appearance of an object surface
KR20060052699A (ko) * 2003-06-11 2006-05-19 솔비젼 인코포레이티드 감도 및 다이내믹 레인지가 증가된 3ｄ 및 2ｄ 측정장치 및방법
KR100558325B1 (ko) * 2003-09-29 2006-03-10 (주) 인텍플러스 스테레오비전과 모아레를 이용한 3차원 검사 방법 및 장치
KR100540192B1 (ko) * 2003-11-11 2005-12-29 박승한 3차원 형상 측정 장치 및 측정 방법
US8044996B2 (en) * 2005-05-11 2011-10-25 Xenogen Corporation Surface construction using combined photographic and structured light information

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407075B (zh) * 2010-03-16 2013-09-01 Test Research Inc 量測立體物件之系統

Also Published As

Publication number Publication date
EP1946376A4 (en) 2013-05-01
US20080266391A1 (en) 2008-10-30
KR20070042840A (ko) 2007-04-24
CN101292359B (zh) 2012-07-04
EP1946376A1 (en) 2008-07-23
EP1946376B1 (en) 2018-03-07
WO2007046601A1 (en) 2007-04-26
CN101292359A (zh) 2008-10-22
TWI293110B (en) 2008-02-01
KR100752758B1 (ko) 2007-08-29

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