TW200716940A - The forming method of a heat dissipation module and its positioning structure - Google Patents

The forming method of a heat dissipation module and its positioning structure

Info

Publication number
TW200716940A
TW200716940A TW094137282A TW94137282A TW200716940A TW 200716940 A TW200716940 A TW 200716940A TW 094137282 A TW094137282 A TW 094137282A TW 94137282 A TW94137282 A TW 94137282A TW 200716940 A TW200716940 A TW 200716940A
Authority
TW
Taiwan
Prior art keywords
heat dissipation
fins
dissipation module
positioning structure
stacked
Prior art date
Application number
TW094137282A
Other languages
English (en)
Chinese (zh)
Other versions
TWI322258B (enrdf_load_stackoverflow
Inventor
guo-xing Chen
xuan-zhi Lin
Original Assignee
Hoff Thermal Industry
guo-xing Chen
xuan-zhi Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoff Thermal Industry, guo-xing Chen, xuan-zhi Lin filed Critical Hoff Thermal Industry
Priority to TW094137282A priority Critical patent/TW200716940A/zh
Publication of TW200716940A publication Critical patent/TW200716940A/zh
Application granted granted Critical
Publication of TWI322258B publication Critical patent/TWI322258B/zh

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW094137282A 2005-10-25 2005-10-25 The forming method of a heat dissipation module and its positioning structure TW200716940A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094137282A TW200716940A (en) 2005-10-25 2005-10-25 The forming method of a heat dissipation module and its positioning structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094137282A TW200716940A (en) 2005-10-25 2005-10-25 The forming method of a heat dissipation module and its positioning structure

Publications (2)

Publication Number Publication Date
TW200716940A true TW200716940A (en) 2007-05-01
TWI322258B TWI322258B (enrdf_load_stackoverflow) 2010-03-21

Family

ID=45073925

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137282A TW200716940A (en) 2005-10-25 2005-10-25 The forming method of a heat dissipation module and its positioning structure

Country Status (1)

Country Link
TW (1) TW200716940A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI824132B (zh) * 2020-03-27 2023-12-01 奇鋐科技股份有限公司 散熱裝置
US11817372B2 (en) 2020-04-15 2023-11-14 Asia Vital Components Co., Ltd. Heat sink device

Also Published As

Publication number Publication date
TWI322258B (enrdf_load_stackoverflow) 2010-03-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees