TW200716935A - Heat transfer apparatus and method for making the same - Google Patents
Heat transfer apparatus and method for making the sameInfo
- Publication number
- TW200716935A TW200716935A TW094137037A TW94137037A TW200716935A TW 200716935 A TW200716935 A TW 200716935A TW 094137037 A TW094137037 A TW 094137037A TW 94137037 A TW94137037 A TW 94137037A TW 200716935 A TW200716935 A TW 200716935A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat transfer
- transfer apparatus
- wick structure
- tube
- making
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
A heat transfer apparatus includes a closed tube, a wick structure formed at an inner periphery of the tube, and working fluid contained in the tube. The heat transfer apparatus has an evaporating section and a condensing section. The wick structure has a thickness gradually decreased from the evaporating section toward the condensing section. A manufacture of the heat transfer apparatus involves application of the centrifugation formation technology, which can avoid using a core rod in manufacturing the wick structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94137037A TWI273211B (en) | 2005-10-21 | 2005-10-21 | Heat transfer apparatus and method for making the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94137037A TWI273211B (en) | 2005-10-21 | 2005-10-21 | Heat transfer apparatus and method for making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI273211B TWI273211B (en) | 2007-02-11 |
TW200716935A true TW200716935A (en) | 2007-05-01 |
Family
ID=38621418
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94137037A TWI273211B (en) | 2005-10-21 | 2005-10-21 | Heat transfer apparatus and method for making the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI273211B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI456158B (en) * | 2008-11-18 | 2014-10-11 | Delta Electronics Inc | Capillary structure of vapor chamber and manufacturing method thereof |
CN111426226B (en) * | 2020-04-21 | 2021-11-02 | 福建永安市永清石墨烯研究院有限公司 | Graphene heat pipe and preparation method thereof |
TWI766681B (en) * | 2021-05-11 | 2022-06-01 | 大陸商深圳興奇宏科技有限公司 | Heat pipe structure |
CN115194158B (en) * | 2022-06-17 | 2023-04-25 | 长沙理工大学 | Manufacturing method of powder sintering stainless steel heat pipe by adopting slurry filling type and heat pipe |
-
2005
- 2005-10-21 TW TW94137037A patent/TWI273211B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI273211B (en) | 2007-02-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |