TW200716935A - Heat transfer apparatus and method for making the same - Google Patents

Heat transfer apparatus and method for making the same

Info

Publication number
TW200716935A
TW200716935A TW094137037A TW94137037A TW200716935A TW 200716935 A TW200716935 A TW 200716935A TW 094137037 A TW094137037 A TW 094137037A TW 94137037 A TW94137037 A TW 94137037A TW 200716935 A TW200716935 A TW 200716935A
Authority
TW
Taiwan
Prior art keywords
heat transfer
transfer apparatus
wick structure
tube
making
Prior art date
Application number
TW094137037A
Other languages
Chinese (zh)
Other versions
TWI273211B (en
Inventor
Chuen-Shu Hou
Chao-Nien Tung
Tay-Jian Liu
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW94137037A priority Critical patent/TWI273211B/en
Application granted granted Critical
Publication of TWI273211B publication Critical patent/TWI273211B/en
Publication of TW200716935A publication Critical patent/TW200716935A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

A heat transfer apparatus includes a closed tube, a wick structure formed at an inner periphery of the tube, and working fluid contained in the tube. The heat transfer apparatus has an evaporating section and a condensing section. The wick structure has a thickness gradually decreased from the evaporating section toward the condensing section. A manufacture of the heat transfer apparatus involves application of the centrifugation formation technology, which can avoid using a core rod in manufacturing the wick structure.
TW94137037A 2005-10-21 2005-10-21 Heat transfer apparatus and method for making the same TWI273211B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94137037A TWI273211B (en) 2005-10-21 2005-10-21 Heat transfer apparatus and method for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94137037A TWI273211B (en) 2005-10-21 2005-10-21 Heat transfer apparatus and method for making the same

Publications (2)

Publication Number Publication Date
TWI273211B TWI273211B (en) 2007-02-11
TW200716935A true TW200716935A (en) 2007-05-01

Family

ID=38621418

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94137037A TWI273211B (en) 2005-10-21 2005-10-21 Heat transfer apparatus and method for making the same

Country Status (1)

Country Link
TW (1) TWI273211B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI456158B (en) * 2008-11-18 2014-10-11 Delta Electronics Inc Capillary structure of vapor chamber and manufacturing method thereof
CN111426226B (en) * 2020-04-21 2021-11-02 福建永安市永清石墨烯研究院有限公司 Graphene heat pipe and preparation method thereof
TWI766681B (en) * 2021-05-11 2022-06-01 大陸商深圳興奇宏科技有限公司 Heat pipe structure
CN115194158B (en) * 2022-06-17 2023-04-25 长沙理工大学 Manufacturing method of powder sintering stainless steel heat pipe by adopting slurry filling type and heat pipe

Also Published As

Publication number Publication date
TWI273211B (en) 2007-02-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees