TW200716506A - The low-temperature sintering of dielectric ceramic composition - Google Patents
The low-temperature sintering of dielectric ceramic compositionInfo
- Publication number
- TW200716506A TW200716506A TW094138098A TW94138098A TW200716506A TW 200716506 A TW200716506 A TW 200716506A TW 094138098 A TW094138098 A TW 094138098A TW 94138098 A TW94138098 A TW 94138098A TW 200716506 A TW200716506 A TW 200716506A
- Authority
- TW
- Taiwan
- Prior art keywords
- ceramic composition
- weight
- parts
- dielectric ceramic
- low
- Prior art date
Links
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Inorganic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094138098A TW200716506A (en) | 2005-10-31 | 2005-10-31 | The low-temperature sintering of dielectric ceramic composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094138098A TW200716506A (en) | 2005-10-31 | 2005-10-31 | The low-temperature sintering of dielectric ceramic composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200716506A true TW200716506A (en) | 2007-05-01 |
| TWI306845B TWI306845B (enExample) | 2009-03-01 |
Family
ID=45071480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094138098A TW200716506A (en) | 2005-10-31 | 2005-10-31 | The low-temperature sintering of dielectric ceramic composition |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200716506A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111943673A (zh) * | 2020-07-03 | 2020-11-17 | 成都宏科电子科技有限公司 | 一种低温烧结bnt微波介质材料及其制备方法 |
-
2005
- 2005-10-31 TW TW094138098A patent/TW200716506A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111943673A (zh) * | 2020-07-03 | 2020-11-17 | 成都宏科电子科技有限公司 | 一种低温烧结bnt微波介质材料及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI306845B (enExample) | 2009-03-01 |
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Legal Events
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