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Application filed by Flow Asia CorpfiledCriticalFlow Asia Corp
Priority to TW94138146ApriorityCriticalpatent/TWI280904B/en
Publication of TW200716310ApublicationCriticalpatent/TW200716310A/en
Application grantedgrantedCritical
Publication of TWI280904BpublicationCriticalpatent/TWI280904B/en
Perforating, Stamping-Out Or Severing By Means Other Than Cutting
(AREA)
Dicing
(AREA)
Abstract
The present invention relates to a water jet cutting system for cutting semi-conductor units, comprises a gantry type driving apparatus for providing a driving force on a x-y plane; a high-temperature generating apparatus for generating a high-pressure water flow; and a cutting apparatus coupled with the high-pressure generating apparatus and the gantry type driving apparatus; the high-pressure water flow is driven by the gantry type driving apparatus to cut the semi-conductor units.
TW94138146A2005-10-312005-10-31Waterjet cutting system
TWI280904B
(en)
Method for transmitting a wireless signal comprising: a) transmitting the wireless command signal from at least one blasting machine; b) receive at least one wireless command signal; c) process and reduce noise and d) actuate the command signal; and apparatus, associated blasting component.