TW200716303A - Polishing pad having a window with reduced surface roughness - Google Patents

Polishing pad having a window with reduced surface roughness

Info

Publication number
TW200716303A
TW200716303A TW095126169A TW95126169A TW200716303A TW 200716303 A TW200716303 A TW 200716303A TW 095126169 A TW095126169 A TW 095126169A TW 95126169 A TW95126169 A TW 95126169A TW 200716303 A TW200716303 A TW 200716303A
Authority
TW
Taiwan
Prior art keywords
polishing pad
window
surface roughness
reduced surface
present
Prior art date
Application number
TW095126169A
Other languages
Chinese (zh)
Other versions
TWI379734B (en
Inventor
Alan H Saikin
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200716303A publication Critical patent/TW200716303A/en
Application granted granted Critical
Publication of TWI379734B publication Critical patent/TWI379734B/en

Links

Abstract

The present invention provides a polishing pad for performing chemical mechanical planarization of semiconductor substrates. The polishing pad comprises a polishing pad body having an aperture formed therein and a window fixed in the aperture for performing in-situ optical measurements of the substrate. The window has a lower surface capable of transmitting light incident thereon. The lower surface has been treated by laser ablation to remove surface roughness present on the lower surface.
TW095126169A 2005-08-10 2006-07-18 Polishing pad having a window with reduced surface roughness TWI379734B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70697105P 2005-08-10 2005-08-10

Publications (2)

Publication Number Publication Date
TW200716303A true TW200716303A (en) 2007-05-01
TWI379734B TWI379734B (en) 2012-12-21

Family

ID=37851672

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126169A TWI379734B (en) 2005-08-10 2006-07-18 Polishing pad having a window with reduced surface roughness

Country Status (2)

Country Link
JP (1) JP2007049163A (en)
TW (1) TWI379734B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110617786A (en) * 2018-06-18 2019-12-27 凯斯科技股份有限公司 Pad monitoring device, pad monitoring system comprising same and pad monitoring method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4321608B2 (en) 2007-02-28 2009-08-26 ブラザー工業株式会社 Sheet conveying device and image reading device.
JP4931133B2 (en) * 2007-03-15 2012-05-16 東洋ゴム工業株式会社 Polishing pad
US7967661B2 (en) 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JPH10229061A (en) * 1997-02-13 1998-08-25 Nikon Corp Polishing amount measurement equipment
JP3001051B2 (en) * 1997-08-22 2000-01-17 日本電気株式会社 Semiconductor wafer polishing end point detector
JP3780758B2 (en) * 1999-07-21 2006-05-31 セイコーエプソン株式会社 Manufacturing method of plastic lens
JP2001332713A (en) * 2000-05-25 2001-11-30 Nikon Corp Method of manufacturing photoelectric transducer
JP4701487B2 (en) * 2000-09-22 2011-06-15 セイコーエプソン株式会社 Method for manufacturing substrate for electro-optical device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110617786A (en) * 2018-06-18 2019-12-27 凯斯科技股份有限公司 Pad monitoring device, pad monitoring system comprising same and pad monitoring method

Also Published As

Publication number Publication date
TWI379734B (en) 2012-12-21
JP2007049163A (en) 2007-02-22

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