TW200716303A - Polishing pad having a window with reduced surface roughness - Google Patents
Polishing pad having a window with reduced surface roughnessInfo
- Publication number
- TW200716303A TW200716303A TW095126169A TW95126169A TW200716303A TW 200716303 A TW200716303 A TW 200716303A TW 095126169 A TW095126169 A TW 095126169A TW 95126169 A TW95126169 A TW 95126169A TW 200716303 A TW200716303 A TW 200716303A
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- window
- surface roughness
- reduced surface
- present
- Prior art date
Links
Abstract
The present invention provides a polishing pad for performing chemical mechanical planarization of semiconductor substrates. The polishing pad comprises a polishing pad body having an aperture formed therein and a window fixed in the aperture for performing in-situ optical measurements of the substrate. The window has a lower surface capable of transmitting light incident thereon. The lower surface has been treated by laser ablation to remove surface roughness present on the lower surface.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US70697105P | 2005-08-10 | 2005-08-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200716303A true TW200716303A (en) | 2007-05-01 |
TWI379734B TWI379734B (en) | 2012-12-21 |
Family
ID=37851672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095126169A TWI379734B (en) | 2005-08-10 | 2006-07-18 | Polishing pad having a window with reduced surface roughness |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2007049163A (en) |
TW (1) | TWI379734B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110617786A (en) * | 2018-06-18 | 2019-12-27 | 凯斯科技股份有限公司 | Pad monitoring device, pad monitoring system comprising same and pad monitoring method |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4321608B2 (en) | 2007-02-28 | 2009-08-26 | ブラザー工業株式会社 | Sheet conveying device and image reading device. |
JP4931133B2 (en) * | 2007-03-15 | 2012-05-16 | 東洋ゴム工業株式会社 | Polishing pad |
US7967661B2 (en) | 2008-06-19 | 2011-06-28 | Micron Technology, Inc. | Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
JPH10229061A (en) * | 1997-02-13 | 1998-08-25 | Nikon Corp | Polishing amount measurement equipment |
JP3001051B2 (en) * | 1997-08-22 | 2000-01-17 | 日本電気株式会社 | Semiconductor wafer polishing end point detector |
JP3780758B2 (en) * | 1999-07-21 | 2006-05-31 | セイコーエプソン株式会社 | Manufacturing method of plastic lens |
JP2001332713A (en) * | 2000-05-25 | 2001-11-30 | Nikon Corp | Method of manufacturing photoelectric transducer |
JP4701487B2 (en) * | 2000-09-22 | 2011-06-15 | セイコーエプソン株式会社 | Method for manufacturing substrate for electro-optical device |
-
2006
- 2006-07-18 TW TW095126169A patent/TWI379734B/en active
- 2006-08-10 JP JP2006217687A patent/JP2007049163A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110617786A (en) * | 2018-06-18 | 2019-12-27 | 凯斯科技股份有限公司 | Pad monitoring device, pad monitoring system comprising same and pad monitoring method |
Also Published As
Publication number | Publication date |
---|---|
TWI379734B (en) | 2012-12-21 |
JP2007049163A (en) | 2007-02-22 |
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