TW200715950A - Heat sink fastening system - Google Patents

Heat sink fastening system

Info

Publication number
TW200715950A
TW200715950A TW095130075A TW95130075A TW200715950A TW 200715950 A TW200715950 A TW 200715950A TW 095130075 A TW095130075 A TW 095130075A TW 95130075 A TW95130075 A TW 95130075A TW 200715950 A TW200715950 A TW 200715950A
Authority
TW
Taiwan
Prior art keywords
heat sink
retention clip
ramp
electronic component
fastening system
Prior art date
Application number
TW095130075A
Other languages
English (en)
Inventor
Craig Warren Hornung
Original Assignee
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Corp filed Critical Tyco Electronics Corp
Publication of TW200715950A publication Critical patent/TW200715950A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW095130075A 2005-08-16 2006-08-16 Heat sink fastening system TW200715950A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US70864005P 2005-08-16 2005-08-16
US11/247,018 US7362578B2 (en) 2005-08-16 2005-10-11 Heat sink fastening system

Publications (1)

Publication Number Publication Date
TW200715950A true TW200715950A (en) 2007-04-16

Family

ID=37738604

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130075A TW200715950A (en) 2005-08-16 2006-08-16 Heat sink fastening system

Country Status (3)

Country Link
US (1) US7362578B2 (zh)
CN (1) CN1917755A (zh)
TW (1) TW200715950A (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101231546A (zh) * 2007-01-24 2008-07-30 鸿富锦精密工业（深圳）有限公司 散热装置组合
US7589968B1 (en) * 2007-06-11 2009-09-15 Majr Products Corp. Heat-dissipating electromagnetic shield
US8988881B2 (en) * 2007-12-18 2015-03-24 Sandia Corporation Heat exchanger device and method for heat removal or transfer
US9207023B2 (en) 2007-12-18 2015-12-08 Sandia Corporation Heat exchanger device and method for heat removal or transfer
US8228675B2 (en) * 2007-12-18 2012-07-24 Sandia Corporation Heat exchanger device and method for heat removal or transfer
US9005417B1 (en) 2008-10-01 2015-04-14 Sandia Corporation Devices, systems, and methods for microscale isoelectric fractionation
BR112012021430A2 (pt) 2010-02-25 2020-07-14 Thomson Licensing estojo de resfriamento radiante radioativo multicamada miniatura com prendedores de liberação rápida ocultos
DE102010016503B4 (de) * 2010-04-19 2013-10-24 Rittal Gmbh & Co. Kg Luftführungseinheit
US8962346B2 (en) 2010-07-08 2015-02-24 Sandia Corporation Devices, systems, and methods for conducting assays with improved sensitivity using sedimentation
US8945914B1 (en) 2010-07-08 2015-02-03 Sandia Corporation Devices, systems, and methods for conducting sandwich assays using sedimentation
US9795961B1 (en) 2010-07-08 2017-10-24 National Technology & Engineering Solutions Of Sandia, Llc Devices, systems, and methods for detecting nucleic acids using sedimentation
US9261100B2 (en) 2010-08-13 2016-02-16 Sandia Corporation Axial flow heat exchanger devices and methods for heat transfer using axial flow devices
JP5981463B2 (ja) 2011-03-09 2016-08-31 トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ 電子装置
WO2013009982A1 (en) 2011-07-14 2013-01-17 Thomson Licensing Set top box having snap-in heat sink and smart card reader with a hold down for retaining the heat sink
CN102938997A (zh) * 2011-08-16 2013-02-20 鸿富锦精密工业（深圳）有限公司 散热装置
JP6130844B2 (ja) 2011-10-19 2017-05-17 トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ ブラインドナビゲーションのためのフィードバックによるリモートコントロール
US9244065B1 (en) 2012-03-16 2016-01-26 Sandia Corporation Systems, devices, and methods for agglutination assays using sedimentation
CN108281831B (zh) * 2018-01-23 2020-05-12 泰科电子(上海)有限公司 插座组件和传热组件
US10830251B2 (en) * 2018-05-17 2020-11-10 Delphi Technologies Ip Limited Fluid pump

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5397919A (en) * 1993-03-04 1995-03-14 Square Head, Inc. Heat sink assembly for solid state devices
US5353191A (en) * 1993-03-08 1994-10-04 The Whitaker Corporation Combination heat sink and housing for flexible electrical connector used in an electrical or electronic assembly
US5596485A (en) * 1995-03-16 1997-01-21 Amkor Electronics, Inc. Plastic packaged integrated circuit with heat spreader
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US5667870A (en) * 1995-07-24 1997-09-16 Chip Coolers, Inc. Plastic article with interrupted interior threads for securing a threaded heat sink to a heat generating member
US5708564A (en) * 1996-05-07 1998-01-13 Lin; Andy Heat sink mounting structure
US6075699A (en) 1999-01-29 2000-06-13 Chip Coolers, Inc. Heat sink assembly with snap-in legs
US6519150B1 (en) * 1999-12-23 2003-02-11 Hsin-Yi Chen Linkage-type fixing device for heat-radiator of central processor
US6293331B1 (en) 2000-08-11 2001-09-25 Tyco Electronics Logistics Ag Vibration and shock resistant heat sink assembly
US6343012B1 (en) * 2000-11-13 2002-01-29 Tyco Electronics Logistis Ag Heat dissipation device with threaded fan module
US6386274B1 (en) 2001-06-28 2002-05-14 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6452803B1 (en) * 2001-07-20 2002-09-17 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6681949B2 (en) 2002-05-21 2004-01-27 Kenneth R. Tibor Torquing-limiting apparatus
US6828673B2 (en) * 2003-02-18 2004-12-07 John Ficorilli Heat sink assembly

Also Published As

Publication number Publication date
US7362578B2 (en) 2008-04-22
US20070041158A1 (en) 2007-02-22
CN1917755A (zh) 2007-02-21

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