TW200713525A - Solid image-taking element package, its production method and solid image-taking device - Google Patents

Solid image-taking element package, its production method and solid image-taking device

Info

Publication number
TW200713525A
TW200713525A TW095128873A TW95128873A TW200713525A TW 200713525 A TW200713525 A TW 200713525A TW 095128873 A TW095128873 A TW 095128873A TW 95128873 A TW95128873 A TW 95128873A TW 200713525 A TW200713525 A TW 200713525A
Authority
TW
Taiwan
Prior art keywords
solid image
resin
taking
package
taking element
Prior art date
Application number
TW095128873A
Other languages
Chinese (zh)
Inventor
Tomohiro Sato
Mitsuo Maeda
Shigehide Yoshida
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200713525A publication Critical patent/TW200713525A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

The present invention provides a solid image-taking element package, its production method and solid image-taking device containing the package. The solid image-taking element package is a hollow box made of resin, which forms into a unified piece by the bottom board made of the roughly rectangular resin and the side walls made of the roughly vertical resin installed in the circumferential edges, and is inserted by the metal-made island-shape portion installed with the metal-made lead terminal and the fixing-disposed solid image-taking element having the opening portion closed by the transparent board. The character is in that the package box is obtained by passing it through the thermoplastic resin or its composition to be injection-molded into a piece. The gate used for the injection molding is disposed on the single sidewall of the short-side direction; and the resin flow is used to control so that the protruding-formed concave is installed into the single side-wall, which is utilized to change the flow direction of the resin or its composition injecting out and flowing into the gate.
TW095128873A 2005-08-08 2006-08-07 Solid image-taking element package, its production method and solid image-taking device TW200713525A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005229696 2005-08-08

Publications (1)

Publication Number Publication Date
TW200713525A true TW200713525A (en) 2007-04-01

Family

ID=37722347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128873A TW200713525A (en) 2005-08-08 2006-08-07 Solid image-taking element package, its production method and solid image-taking device

Country Status (2)

Country Link
CN (1) CN100550983C (en)
TW (1) TW200713525A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101939150B (en) * 2008-02-06 2014-05-28 株式会社村田制作所 Injection molded article and magnetic sensor
WO2013168537A1 (en) * 2012-05-10 2013-11-14 三菱電機株式会社 Image sensor

Also Published As

Publication number Publication date
CN100550983C (en) 2009-10-14
CN1913588A (en) 2007-02-14

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