CN1913588A - Housing for receiving solid-image photographing element, its manufacturing method and solid-image photographing device - Google Patents
Housing for receiving solid-image photographing element, its manufacturing method and solid-image photographing device Download PDFInfo
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- CN1913588A CN1913588A CNA200610110158XA CN200610110158A CN1913588A CN 1913588 A CN1913588 A CN 1913588A CN A200610110158X A CNA200610110158X A CN A200610110158XA CN 200610110158 A CN200610110158 A CN 200610110158A CN 1913588 A CN1913588 A CN 1913588A
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- resin
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- solid
- state imager
- cast gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Provided is a case for housing a solid-state image pickup device, its manufacturing method and a solid-state image pickup device equipped with it. The case is a resin-made hollow case consisting of a rectangular resin-made bottom plate and resin-made side walls nearly erected on the edge of the bottom plate, integrated together. Metal islands to which a metal-made lead and a solid-state image pickup device are fixed are arranged by insertion, and the opening can be closed with a transparent plate. The case is obtained by injection-molding a thermoplastic resin or its composition in an integrated form. A gate for injection molding is formed in one side wall part in the short direction of the case, and a recess formed with resin-flow-controlling protrusions for changing the flowing direction of a resin or its composition to be injected from gate is formed within the side wall part.
Description
Technical field
The solid camera head that the present invention relates to solid-state imager housing (package), its manufacture method and possess above-mentioned solid-state imager housing.
Background technology
In the prior art, at medium-term and long-term pottery (ceramic) the system housing that uses hollow of solid camera head, but, develop the resin system housing (opening flat 6-163950 communique) of hollow recently with reference to the spy in order to make fee of material cheap.
Make under the situation of above-mentioned resin system housing utilizing common ejection shaping mould, as depicted in figs. 1 and 2, penetrate the resin that flows into from cast gate (gate) (resin inlet) 28, with be positioned at cast gate 28 and (comprise gate part 28a and the 28b of cross gate portion, also can abbreviate " cast gate " or " cast gate 28 " as.) near island (island) (weld pad: die pad) 30 or lead terminal (lead terminal) 40 etc. to collide than strong pressure.Therefore, exist in the problem of the warpage that appearance is bigger on the island 30 or the problem that lead terminal 40 is out of shape according to different situations.
Summary of the invention
The problem that desire of the present invention solves is, solid-state imager housing, its manufacture method of a kind of novelty and the solid camera head that possesses this housing are provided, in the resin system hollow housing that utilizes injection molding to obtain, the such problem of the warpage on island or lead terminal distortion is few.
Solve above-mentioned problem by following means.
(1) solid-state imager housing of the present invention, it is a kind of resin system hollow housing, integrally formed by the resin system base plate of essentially rectangular and the roughly upright resin system sidewall of being located at its periphery, and be inserted with metallic lead terminal and the metallic island that fixedly installs solid-state imager, peristome can seal with transparent panel, it is characterized in that, this housing is by obtaining thermoplastic resin or its constituent one injection molding, injection molding is located at cast gate on the one-sided sidewall of short side direction of this housing, the recess that utilizes resin flow control projection (projection for controlling flow ofresin) to form is located in this one-sided sidewall, and described resin flow control projection is used to change from the resin of this cast gate ejaculation inflow or the flow direction of its constituent.
Resin flow control projection can utilize rectification pin (obstructive pin) to constitute.Moreover this recess is the vestige hole of extracting out from resin after resin flow is controlled projection.
Because the control of resin flow control projection is carried out ester moulding from the resin of cast gate ejaculation inflow or the flow direction of its constituent, so become the solid-state imager housing that the raising that utilizes this flowability suppresses the warpage of housing body.
(2) solid camera head of the present invention is characterized in that, possesses above-mentioned (1) described solid-state imager housing.Owing to suppress the warpage of solid-state imager housing, so utilize the distortion that is configured in the image that its inner solid-state imager makes a video recording to reduce.
(3) manufacture method of solid-state imager housing of the present invention, it is a kind of manufacture method of resin system hollow housing, described resin system hollow housing is integrally formed by the resin system base plate of essentially rectangular and the roughly upright resin system sidewall of being located at its periphery, and plug metallic lead terminal and the metallic island that fixedly installs solid-state imager, peristome can seal with transparent panel, it is characterized in that, in the following manner with thermoplastic resin or its constituent one injection molding, promptly, injection molding is located at cast gate on the one-sided sidewall of short side direction of this housing, the recess that utilizes resin flow control projection to form is formed in this one-sided sidewall, and described resin flow control projection is used to change from the resin of this cast gate ejaculation inflow or the flow direction of its constituent.
Because the control of resin flow control projection is penetrated the resin that flows into or the flow direction of its constituent carries out ester moulding from cast gate, so the warpage of the housing body when utilizing the raising of this flowability to suppress to make.
(4) solid-state imager housing of the present invention possesses: resin system housing body has solid-state imager configuration recess; Lead terminal extends to the housing body outside with the bottom surface of recess from the solid-state imager configuration; Resin flow control projection is inserted vestige, is located at an end of the long side direction of housing body; With the installation vestige of resin inlet, what be located at housing body controls the opposed position of inside bottom surface that projection is inserted vestige with resin flow.
Because it is mutually opposed that resin flow control projection is inserted the installation vestige of vestige and resin inlet, so change during fabrication from the direction of the resin flow of resin inlet injection, become the solid-state imager housing of the unexpected bending that suppresses lead frame or lead terminal, the warpage of housing etc.
(5) solid-state imager housing of the present invention possesses: resin system housing body has solid-state imager configuration recess; Lead terminal extends to the housing body outside with the bottom surface of recess from the solid-state imager configuration; Resin flow control projection is inserted vestige, is located at an end of the long side direction of housing body; With the installation vestige of resin inlet, what be located at housing body controls the opposed position of inner side surface that projection is inserted vestige with resin flow.
Because it is mutually opposed that resin flow control projection is inserted the installation vestige of vestige and resin inlet, so change the direction of the resin flow of injecting from the resin inlet during fabrication, become the solid-state imager housing that to make a kind of bending that suppresses lead terminal etc.
Description of drawings
Fig. 1 is the cutaway view of the solid-state imager housing of comparative example 1.
Fig. 2 is the cutaway view of the solid-state imager housing of comparative example 1.
Fig. 3 is the cutaway view of the solid-state imager housing of comparative example 2.
Fig. 4 is the cutaway view of the solid-state imager housing of comparative example 2.
Fig. 5 is the exploded perspective view of solid camera head.
Fig. 6 is the partial perspective view of solid camera head.
Fig. 7 is the longitudinal section of solid camera head.
Fig. 8 is the longitudinal section of solid camera head.
Fig. 9 is the vertical view of solid-state imager housing.
The vertical view (XY plane) of the periphery of the resin flow control projection PJ when Figure 10 is ester moulding.
Figure 11 is the longitudinal section (XZ section) of periphery.
Figure 12 is the longitudinal section of resin molding apparatus.
Figure 13 is the flow chart that is used to illustrate manufacturing process.
Figure 14 is the partial sectional view of the solid-state imager housing 20 of the 1st execution mode.
Figure 15 is the partial sectional view of the solid-state imager housing 20 of the 1st execution mode.
Figure 16 is the partial sectional view of the solid-state imager housing 20 of the 2nd execution mode.
Figure 17 is the partial sectional view of the solid-state imager housing 20 of the 2nd execution mode.
The longitudinal section (YZ section) of the periphery of the resin flow control projection PJ when Figure 18 is the ester moulding of the 2nd execution mode.
Figure 19 is the longitudinal section (XZ section) of periphery.
Embodiment
Following on one side with reference to suitable accompanying drawing, Yi Bian solid-state imager housing of the present invention and manufacture method thereof and the solid camera head that possesses above-mentioned solid-state imager housing are described.Same key element is used same mark, omits repeat specification.
At first, the comparative example that becomes prerequisite of the present invention is described.
(comparative example 1)
The solid-state imager housing possesses the solid-state imager configuration and uses recess DP, and its internal configurations has solid-state imager.With the face with the solid-state imager housing of a side opposition side that is formed with this recess DP is " bottom surface ".In comparative example 1, inject resin from the bottom surface of solid-state imager housing and form.
Fig. 1 and Fig. 2 are the schematic diagrames of an example of the injection molding method of expression comparative example 1.
Fig. 1 be schematically illustrate constituent RSN (below, also be designated as " resin (constituent) ", or simply be designated as " resin ".) be not particularly limited and at the part section vertical view of the free-pouring appearance of horizontal all directions, wherein constituent RSN penetrates from the little cast gate 28 of aperture area and flows in the mold cavities (cavity), mold cavity is inserted with lead frame (lead frame) 50.The flow direction of resin RSN when representing to be shaped by arrow DT1.Fig. 2 is the partial cut away side views of Fig. 1 correspondence, schematically illustrates resin (constituent) RSN that injects from cast gate, from being provided with the bottom surface of cast gate, and the appearance that also flows at above-below direction with being not particularly limited.The flow direction of resin RSN when representing to be shaped by arrow DT2.
(comparative example 2)
In comparative example 2, inject resin RSN from an end of the long side direction of solid-state imager housing and form.
Fig. 3 and Fig. 4 are the schematic diagrames of an example of the injection molding method of expression comparative example 2.
Fig. 3 schematically illustrates that resin RSN or its constituent are not particularly limited and at the part section vertical view of the free-pouring appearance of horizontal all directions, wherein resin RSN or its constituent penetrate to flow into from the little cast gate of aperture area (some cast gate (pinpoint gate)) 28 and (be also referred to as " injection ".) in the mold cavity (cavity), mold cavity is inserted with lead frame (lead frame) 50.The flow direction of resin RSN when representing to be shaped by arrow DT3.
Fig. 4 is the partial cut away side views corresponding with Fig. 3, schematically illustrates the resin (constituent) that injects from cast gate, from an end of the long side direction that is provided with cast gate, and the appearance that also flows at above-below direction with being not particularly limited.The flow direction of resin RSN when representing to be shaped by arrow DT4.
In the solid-state imager housing of above-mentioned comparative example, because bigger resin pressure acts on lead frame, thus cause the lead frame distortion, therefore, the gate body distortion.Next, the solid-state imager housing and the solid camera head of execution mode are described.
(the 1st execution mode)
Fig. 5 is the exploded perspective view of the solid-state imager housing 20 of the 1st execution mode.
With the long side direction of solid-state imager housing 20, Width, thickness direction respectively as X-axis, Y-axis, Z axle.X-axis, Y-axis, Z axle form right angle coordinate system.The Z axle is also consistent with the thickness direction of solid-state imager 12.In a plurality of sidewalls, with have with respect to the XZ plane θ degree with the plane at interior angle of inclination as major side wall, with comprise with respect to the YZ plane have the θ degree with the sidewall on the plane at interior angle of inclination as secondary sidewall, have the plane of θ degree to comprise, and to be positioned at solid-state imager configuration be base plate with the wall of the opposition side of recess DP with interior angle of inclination with respect to the XY plane.θ is 45 degree, and perhaps 30 degree are preferably 20 degree.
Comprise at sidewall under the situation of major side wall and secondary sidewall, sidewall made in brief note, comprising under the situation of base plate, is recited as sidewall (base plate) or simply is designated as base plate.In addition, so-called inner bottom surface is meant the surface of a side that is provided with sidewall or island, and so-called outer bottom is meant and is provided with the surface of the surface opposite side on island.
Solid-state imager housing 20, it is a kind of resin system hollow housing, resin system base plate 22 by essentially rectangular, and it is integrally formed roughly to found the resin system sidewall 24 of being located at its periphery, and be inserted with metallic lead terminal 40 and the metallic island 30 (following also simply be called " island ") that fixedly installs solid-state imager 12, enough transparent panel 60 closed peristomes of energy, housing 20 obtains by making thermoplastic resin or its constituent one injection molding, injection molding cast gate 28, be located in the sidewall (base plate) 22 (with reference to Fig. 6), the position of one end of the long side direction of housing 20, the recess (resin flow control projection is inserted vestige) 26 of controlling projection (PJ) (with reference to Fig. 6) formation by resin flow is located at an end of the long side direction of housing body 20A, and described resin flow control projection is used to change from the resin of cast gate 28 ejaculation inflows or the flow direction of its constituent.The opening of cast gate (resin inlet) 28, the installation vestige of formation cast gate.
Constitute major side wall (24b) and the secondary sidewall (24a) the 24th of housing body 20A, resin system has and outer circumferential area that sidewall (base plate) 22 is roughly the same, and relative base plate 22 generally perpendicularly is provided with.Moreover major side wall and secondary sidewall 24 are located on the base plate 22 corresponding to 4 limits of base plate 22, constitute framework.So-called " profile area " is meant the area that is surrounded by the periphery of major side wall and secondary sidewall 24.So-called " having the outer circumferential area roughly the same " with base plate 22, the meaning is that to comprise the profile area of the area of base plate 22 and major side wall and secondary sidewall 24 identical, perhaps, the area of base plate 22 is its situations of 1.0~2.5 times for the profile area of major side wall and secondary sidewall 24, preferably 1.0~1.5 times.Specifically, major side wall and secondary sidewall 24 preferably have the shape of four sidewalls that constitute cuboid, and the outer circumferential area of the framework that connects with base plate 22 is identical with base plate 22, or less than base plate 22.
Major side wall and secondary sidewall 24 generally perpendicularly are located on the base plate 22 of essentially rectangular, and the meaning is except the vertically disposed sidewall 24 closely, also comprises the resin system sidewall 24 of expanding setting towards peristome a little." expansion " a little be meant from vertical direction have 45 ° with interior, preferred 30 ° with interior inclination.
In addition, cast gate 28 shown in the 2nd execution mode, also can be located at the position of an end of the X-direction in the secondary sidewall 24.
Groove DG is the mold-mart that is provided with in order to improve resin flow when the ester moulding, utilizes mobile raising to suppress the warpage of housing body 20A.Moreover groove DG makes housing body 20A lighting, and improves the mechanical strength with respect to the stress of Z-direction.
Lead terminal 40, electric or mechanical connection solid-state imager 12 and external circuit.Moreover lead terminal 40 also has following effect: utilize the localized heat conduction to emit the heat that solid-state imager 12 produces outside housing.Lead terminal 40 can use metal known terminal.Lead terminal 40 as metal, can exemplify copper, copper alloy, ferroalloy, also can electroplate (be plated with) by gold, silver, nickel (Nickle) or scolder (solder) etc.The copper that wherein, preferably can use gold-plated or as 42 alloys of the alloy of iron 58%, nickel 42%.
Lead terminal 40, preferably use lead frame and when this housing molding and resin combination integrally formed, implement processing such as bending or cut-out then, make lead terminal.
As the position and the quantity that on housing 20, plug lead terminal 40, only otherwise breaking away from purport of the present invention gets final product, be not particularly limited.
Fig. 6 is near the partial perspective view in an end of amplifying expression solid camera head 10 shown in Figure 5.
The 40i of inside conductor portion of a plurality of lead terminals 40 constitutes the part of the solid-state imager configuration of housing body 20A with the bottom surface of recess DP, and lead terminal 40 by extending to the outside in the major side wall 24, constitutes the outer conductor 40o of portion in the outside of housing body 20A.The base plate 22 of housing body 20A has a pair of rib 22L that extends along X-direction.Rib 22L makes housing body 20A lighting, and suppresses the deflection of Z axle and Y direction.
The outer bottom of sidewall (base plate) 22 is parallel to the XY plane, moreover the solid-state imager configuration also is parallel to the XY plane with the openend of recess DP.Major side wall 24, with respect to the XZ plane inclination, the intersection on the outer surface of major side wall 24 and YZ plane and the angled θ of Z axle.Angle θ is greater than below 0 and 45 degree.Thus, in ester moulding, can easily from mould, extract the housing body 20A that has been shaped.
Extend along X-direction on island 30.The two ends of 30 Y direction on the island, contact has the protuberance 20A that extends along X-direction
1, move Y direction on restriction island 30.Protuberance 20A in housing body 20A
1With the zone of the 40i of inside conductor portion, form groove GRV, improve the mechanical strength of housing body 20A.Can between the leading section of the 40i of inside conductor portion and groove GRV, accompany resin.By accompanying resin, reduce when ester moulding, to act on the resin pressure of the 40i of inside conductor portion, can and then suppress inside conductor 40i of portion and the distortion of housing body 20A, the generation of burr.
The two ends of 30 Y direction from the island are extended along Y direction by the press section, island 34 that constitutes with the continuous electric conductor in island 30.Press section, island 34 is exposed to the outside of housing body 20A by the inside of major side wall 24.Housing body 20A possesses the 34A of assisted resin portion, is used for further fixedly press section, island 34.A pair of resin assisted parts 34A, outstanding along Z-direction with the bottom surface of recess DP from the solid-state imager configuration of housing body 20A, portion buries press section, island 34 underground within it.
Fig. 7 is the sectional skeleton diagram that has cut off solid camera head 10 at the formation portion place of press section, island 34.
Moreover Fig. 8 is the sectional skeleton diagram that has cut off solid camera head 10 at the connecting portion place of solid-state imager 12 and lead terminal 40.These figure schematically represent.
As shown in Figure 7 and Figure 8, in solid camera head 10, solid-state imager housing 20 is housings of the hollow structure that is made of resin or resin combination, and peristome is sealed by transparent panel 60 as mentioned above.Solid-state imager 12 is located on the metallic island 30 in this housing 20, accepts the exterior light by transparent panel 60 incidents.This solid-state imager 12 response incident lights and the electrical information that writes down can be fetched into outside the solid camera head by lead terminal 40, described lead terminal 40 uses closing lines 42 and solid-state imager 12 to be electrically connected.
Closing line 42 is the leads that are electrically connected solid-state imager 12 and lead terminal 40.Can be used in closing line of the present invention, metal fine preferably is that the alloy of main component is made more excellent by gold, aluminium (aluminum), copper with these.The method of attachment of closing line can be enumerated ball bonding (ball bonding) method and wedge bonding (wedge bonding) method etc. according to material of lead etc.In addition, also can replace lead terminal 40, on electronic pads (pad) metal protuberance is set, the wiring substrate by conductor wirings constitutes is electrically connected via above-mentioned metal gasket and insulating properties film (film).
Solid-state imager housing 20 can utilize the peristome on transparent panel 60 closure casing tops.After the setting of solid-state imager 12 and distribution finished, the solid-state imager housing was sealed by transparent panel 60.
At this, so-called transparent panel 60, be meant the incident light that shooting is used, general visible light (400~700nm) and near infrared region in, transmitance is more than 80%, preferred plate-shaped member more than 90%.Transparent panel 60 preferably in wavelength 400~800nm, has the transmitance more than 90%.
Especially, using under the situation of solid camera head 10 as barcode reader (bar-codereader), preferably in wavelength 650~660nm, has the transmitance more than 90%.
As the material of transparent panel 60, as long as satisfy purport of the present invention, do not limit especially, but preferably for example clear glass, transparent resin or light transparent ceramic etc.More specifically, as the material of transparent panel 60, can exemplify glass (glass), acrylic resin (acrylicresin), Merlon (polycarbonate), cyclenes (cycloolefin) unit and contain polymer (polymer).Moreover in order to obtain spotlight effect, transparent panel also can use lens (lens) etc.
As the joint method of transparent panel 60 and solid-state imager housing 20, can enumerate the bonding of carrying out, method such as chimeric based on binding agent etc.As binding agent, can use known binding agent, especially, the known heat-curing resin of preferred use, the moisture-curable resin, the visible light curable resin, uv curing resin, for example, can exemplify epoxy resin (epoxide resin), unsaturated polyester resin (unsaturated polyesterresin), phenolic resins (phenol resin), melamine-Lauxite (melamine-urea-formaldehyde (MUF) resin), polyurethane resin (polyurethane resin), silicones (silicone resin), polyimide resin (polyimide resin), acrylates resin (acrylate resin) etc.The resin-shaped that forms these curable resins becomes constituent, can be with respect to the monomer (monomer), oligomer (oligomer) and the polymer (polymer) that form this curable resin, as required, cooperate purposes and inorganic filling materials such as additive, silicon dioxide such as combination coincidence beginning agent aptly, crosslinking agent, reaction promoter etc.
Referring again to Fig. 6, resin flow control projection PJ, the part of the mould when being ester moulding in an end of the X-direction of housing body 20A, forms as the recess 26 of extracting the vestige behind the resin flow control projection PJ out.In addition, different with the state shown in this figure when ester moulding, with resin flow control projection PJ from the below towards vertical top and outstanding mode disposes mould.In addition.Also can control the outstanding in the horizontal direction mode of projection PJ and dispose mould with resin flow.
Fig. 9 is the vertical view of the solid-state imager housing 20 of execution mode.In the figure, the lead frame 50 before expression is cut off.
The length X 1=105mm of the X-direction of housing body 20A, the length X 2=100mm of the X-direction of the housing body 20A of removal rib 24L, beeline X3=2mm from the position of centre of gravity of cast gate 28 to secondary side 24, the X-direction length X 4=1.5mm of resin flow control projection PJ, resin flow control projection PJ is to the beeline X5=2.5mm of solid-state imager configuration with recess DP bottom surface, the beeline X6=1mm of resin flow control projection PJ and secondary sidewall 24, secondary sidewall 24 and the solid-state imager configuration X7=5mm of the bottom surface of recess DP.
The maximum of the width of the Y direction of the major side wall 24 of housing body 20A (width in the openend) Y1=2mm, the maximum Y2=9mm of the width of the Y direction of housing body 20A, the width Y3=2.5mm of the Y direction of resin flow control projection PJ.
In addition, be connected in the press section, a pair of island 34 on island 30, be positioned at the 2nd lead terminal group by near the position the housing body 20A central authorities, described the 2nd lead terminal group is positioned at the opposition side of X-direction upper recess 26.Press section, island 34 is embedded in the 34A of assisted resin portion.Moreover, on the island 30 that is adjacent to the zone that is formed with the 2nd lead terminal group, also form a pair of slit 32, between the end of these slits 32 and housing body 20A, form from the outstanding jut 34B in the bottom surface of recess DP.
The vertical view (XY plane) of the periphery of the resin flow control projection PJ when Figure 10 is ester moulding, Figure 11 is the longitudinal section (XZ section) of this periphery.
If in the space that the resin flow F that Z-direction flows injects between moulds via cast gate 28, then this resin flow F contact with the end face PJT of resin flow control projection PJ, is direction along end face PJT with going direction changing, and is mobile in the space between mould.With the position of centre of gravity of end face PJT as initial point O (0,0,0).End face PJT is parallel to the XY plane, but also can be with respect to the XY plane inclination.For example,, be set at position of centre of gravity towards housing body 20A by the projection of the normal that extends from the initial point O of end face PJT to the XY plane, can be easily with the center direction guiding of resin flow to housing body 20A.
(X, Y Z) are (X to the position of centre of gravity G of the opening of cast gate 28
0, Y
0, Z
0).X
0, Y
0, Z
0It is arbitrary value.If the opening of cast gate 28 is circle and radius is R, then the outer shaped position of opening satisfies X
2+ Y
2=R
2The opening of opening 28 is to the projection image on XY plane and the end face PJT area coincidence to the projection image on XY plane.Position of centre of gravity G is positioned at the zone of end face PJT to the projection image on XY plane to the projection image on XY plane.
The height Z of resin flow control projection PJ
PJ, the length X 4 of X-direction, the width Y3 of Y direction, consistent with the width of the length of the degree of depth of recess 26, X-direction, Y direction respectively.The ultimate range along the Z-direction in the XZ plane of the Central Line of X-direction that contains housing body 20A is Z
MAX, the distance along Z-direction of order from initial point O to position of centre of gravity G be Z
GATEThey have following relation.
-(1/2)×X4≤X
0≤(1/2)×X4
-(1/2)×Y3≤Y
0≤(1/2)×Y3
Z
PJ-Z
MAX=Z
0
In this case, resin flow control projection penetrates the resin of inflow or the flow direction of its constituent for control from cast gate, can obtain effect of sufficient.
PJ is under the situation of cuboid (cowling panel (obstructive plate)) in resin flow control projection, the width Y3 of the short side direction of the housing of resin flow control projection PJ, preferably 1/2~1/10 of the width Y2 (with reference to Fig. 7) of housing short side direction, 1/3~1/5 is more excellent.
·(1/10)×Y2≤Y3≤(1/2)×Y2
·(1/5)×Y2≤Y3≤(1/3)×Y2
Under Y3 was situation more than 1/10, the flow direction for control resin or its constituent can obtain effect of sufficient.Under Y3 is situation below 1/2,, can obtain effect of sufficient for the Resin Flow of guaranteeing to sidewall.
The thickness (X4 of Fig. 9) of the housing long side direction of resin flow control projection PJ, preferably 1/3~1/20 of the width of sidewall length edge direction (X7 of Fig. 9), 1/3~1/10 is more excellent.
Under the thickness X 4 of the housing long side direction of resin flow control projection PJ was situation 1/20 or more, resin flow control projection PJ had full intensity, and the flow direction for controlling resin or its constituent can obtain effect of sufficient.Under the thickness X 4 of the housing long side direction of resin flow control projection PJ is situation below 1/3,, can obtain effect of sufficient for the Resin Flow of guaranteeing to sidewall.
Moreover, cast gate 28 is being located under the situation of housing sidewall (base plate), as height (degree of depth of the recess 26) Z of resin flow control projection PJ
PJ, need be set between the outer bottom on the position (position of centre of gravity G) that is provided with cast gate 28 and island 30, when the vertical range of the Z-direction from cast gate 28 to the island outer bottom is M, preferably than the outer bottom position dark (1/2) on island 30 * below the M.
That is be Z, if make the distance between the root position (the openend position of recess 26) of the outer bottom position on island 30 and resin flow control projection PJ
30, then satisfy following relation.
Z
30≤Z
PJ≤Z
30+(1/2)×M
In this case, the Resin Flow for guaranteeing to flow from cast gate can obtain effect of sufficient.
Figure 12 is the longitudinal section of resin molding apparatus.Figure 13 is the flow chart that is used to illustrate manufacturing process.
On pedestal B3, carry base station B2, B1, they are fixed by bolt B L1.On the base station B1 on top, carry counterdie M4, patrix M3.In on patrix M3, form the resin supply passageway SL3 continuous with cast gate 28.Moreover, on bottom resin supply part (mould) M2 and upper resin supply part (mould) M1 that are configured on the patrix M3, form and continuous resin supply passageway SL2 and the resin supply passageway SL1 of resin supply passageway SL3 respectively.In addition, adjusting pin LCK1, LCP are the pins of adjusting the aperture of mould.
At first, lead frame is inserted between mould M3 and the M4 (S1).Then, whole mould M1~M4 seal (S2).Under this state, resin material injects in the space between patrix M3 and the counterdie M4 via resin supply passageway (sprue (spool) or cross gate (runner)) SL1, SL2, SL3 and cast gate 28.In the injection of resin, make propeller (screw) rotation that is located in the resin injection path, the metering resin material by penetrating pressure in the space between the resin of fusion injection mould, makes resin flows (S3).Then, carry out the cooling of resin, resin solidification (S4).
Next and the directing pin FT of slip usefulness together, mould M1 and mould M2 separate from mould M3, with continuous cured resin (sprue cross gate) SL of cast gate 28, cut off from housing body 20A.Directing pin FT connects mould M1, M2, M3, M4, base station B1, B2 at thickness direction.In the hole that directing pin FT connects, be provided with sleeve M22, M33, M44, be used to promote the slip of directing pin FT with respect to mould, directing pin FT can move at above-below direction in the inner surface slip of sleeve M22, M33, M44 on one side on one side.The upper end of directing pin FT is fixed on the mould M1.
Next, patrix M3 separates from counterdie M4, and the formed products that constitutes housing body 20A remains on the counterdie M4.
Then, mould M2 leaves from mould M1, pulls out sprue cross gate SL from mould M1, can remove sprue cross gate SL easily.Then, the protrudent pin PP by making injection molding machine is outstanding from the below of the patchhole that pedestal B3 vacates, and the front end of protrudent pin PP pushes the lower surface of liftout plate SB upward, and liftout plate SB slides and rises at the inner surface of base station B2.On liftout plate SB, be fixed with the answer pin RTP that extends upward.Reply in the through hole and the through hole of mould M4 of pin RTP by base station B1, arrive the lower surface of mould M3.If liftout plate SB is slided upward, on push back multiple pin RTP, then be linked to reply pin RTP and with this action interlock the thimble (not shown) of motion upward, make the formed products that constitutes housing body 20A outstanding upward, taking-up product (S5).
In addition, elastomer RB such as spring are set between mould M4 and liftout plate SB, elastomer RB surrounds the outer peripheral face of replying pin RTP.Therefore, the answer pin RTP that pushes away on once by elastomeric restoring force, and is pushed downwards.Under the situation of closed mould M1~M4, the front end of outstanding answer pin RTP, elastic force that produces by elastomer RB and the power of accepting from the lower surface of patrix M3 are pressed downwards, interlock therewith, thimble is back to original position.The front end of thimble, owing under the state that is contacted with patrix M3, do not pressed, so can suppress its surface deterioration.After, above-mentioned repeatedly operation.
In addition, above-mentioned resin molding apparatus also can be horizontal, makes the moving for horizontal direction of moving of above-below direction.
As mentioned above, the manufacture method of solid-state imager housing of the present invention, it is a kind of manufacture method of resin system hollow housing, described resin system hollow housing is by the resin system base plate 22 of essentially rectangular, and it is integrally formed roughly to found the resin system sidewall 24 of being located at its periphery, and be inserted with metallic lead terminal 40 and the metallic island 30 that fixedly installs solid-state imager 12, enough transparent panel 60 closed peristomes of energy, it is characterized in that, in the following manner with thermoplastic resin or its constituent one injection molding, promptly, be located at injection molding on the one-sided sidewall 24 that extends along the short side direction of housing 20 with cast gate 28, the recess 26 that forms by resin flow control projection PJ is formed in the one-sided sidewall 24, and described resin flow control projection is used to change from the resin of cast gate 28 ejaculation inflows or the flow direction of its constituent.
The emission forming machine that is used for the injection molding operation can use known injection molding machine.As emission forming machine, be not defined as inner screw formula (screw inline type), plunger type (plungertype), screw rod plunger type (screw plunger type) etc. especially, but consider from the aspects such as homogenization of temperature controlled complexity, fusion, preferably the inner screw formula.
In injection molding, resin or resin combination are supplied in the emission forming machine with Powdered, graininess etc., keep molten condition and utilize propeller (screw) to penetrate to mould in cylinder body (cylinder)., mould in make resin or resin combination cooling and curing, open mould, take out the injection molding product that obtain thereafter.
Can be used for ejection shaping mould of the present invention, possess resin flow control projection PJ as mentioned above and get final product near cast gate, material etc. can be used the known material of the manufacturing that is suitable for solid-state imager housing of the present invention.
And then above-mentioned resin and resin combination be described.
The solid-state imager housing has the hollow structure that is made of resin and/or resin combination, utilizes formation such as injection molding method, injection compression molding method, compression forming method, transmission shaping (transfermolding) method.As the resin that uses, can enumerate the heat-curing resin and the thermoplastic resin that can be shaped, preferably consider to select from the viewpoint of flame retardancy, electrical insulating property, strength rigid.From shortening forming period, can be lowered into the viewpoint that forms this and consider, preferably use thermoplastic resin, form this housing by the injection molding method.
As heat-curing resin, phenolic resins (phenol resin), urea resin (urea resin), melamine resin (melamine resin), diallyphthalate resin (diallyphthalate resin), epoxy resin (epoxy resin), polyurethane resin (polyurethane resin), polyimide resin (polyimide resin) and unsaturated polyester resin (unsaturated polyester resin) etc. be can exemplify, phenolic resins, epoxy resin preferably used.
Moreover, as thermoplastic resin, can exemplify polystyrene resin (polystyreneresin), acrylic resin (acrylic resin), polycarbonate resin (polycarbonate), mylar (polyester resin), polyamide (polyamide resin), aldehyde resin (polyacetal resin), polyhenylene ether resin (poly phenyleneether resin), fluororesin (fluorine resin), polyphenylene sulfide resin (poly phenylene sulfide resin), polysulfone resin (polysulphonresin), in many ways based compound resin (polyarylate resin), polyimide resin (polyetherimide resin), polyethersulfone resin (polyethersulfone resin), polyether ketone resin (Polyetherketone resin), liquid-crystalline polymer (liquidcrystalline polymer), polyamide-imide resin (polyamide-imideresin), polyimide resin (polyimide resin) etc., the preferred mylar that uses, polyamide, the polyphenylene sulfide resin, liquid-crystalline polymer, from flowability, thermal endurance, the viewpoint of excellent rigidity is considered, uses the liquid-crystalline polymer optimum.These resins can use separately also can use simultaneously a plurality of.
About the summary of above-mentioned resin, on the books in " macromolecule voluminous dictionary " (distribution of the kind Co., Ltd. of ball, put down on September 20th, 6) and the document wherein quoted etc.
Form the resin combination of solid-state imager housing, from intensity, rigidity, stable on heating raising, dimensional accuracy improve, the degradation purpose is considered under the coefficient of linear expansion, preferably fills various packing materials in above-mentioned resin.Filler as using can exemplify glass fibre (milled glass fiber (milled glass fiber), short glass fiber (chopped glass fiber) etc.), bead (glass beads), hollow glass ball, glass powder, mica (mica), talcum (talc), clay (clay), silica (silica), alumina (alumina), potassium titanate (potassium titanate), wollastonite (wollastonite), calcium carbonate (calciumcarbonate), magnesium carbonate (magnesium carbonate), sodium sulphate (sodiumsulfate), calcium sulfate (calcium sulfate), barium sulfate (barium sulfate), calcium sulfite (calcium sulfite), aluminium hydroxide (aluminum hydroxide), magnesium hydroxide (magnesium hydroxide), calcium hydroxide (calcium hydroxide), calcium silicates (calcium silicate), quartz sand (silica sand), quartzite (silicarock), quartzy (quartz), titanium oxide (titanic oxide), zinc oxide (zincoxide), iron oxide (ferric oxide), graphite (graphite), molybdenum (molybdenum), asbestos (asbestos), silica-alumina (silica-alumina) fiber, alumina (alumina) fiber, gypsum (calcium sulfate) fiber, carbon (carbon) fiber, carbon black (carbonblack), colloidal silica (white carbon), diatomite (diatom earth), bentonite (bentonite), sericite (sericite), white arenaceous sediment layer (white sandydeposit), blacklead inorganic fillers (filler) such as (black lead), potassium titanate (potassium titanate) brilliant pin (whisker), the brilliant pin of alumina (alumina), the brilliant pin of aluminium borate (aluminum borate), the brilliant pin of carborundum (silicon carbide), brilliant pin of metals such as the brilliant pin of silicon nitride (silicon nitride) or nonmetal brilliant pin class etc.The present invention preferably goes for utilizing the resin combination that cooperates fiber or brilliant pin and the resin system hollow housing that is shaped.
As mentioned above, solid-state imager housing 20 has the recess 26 that the resin flow utilized control projection PJ forms, and described resin flow control projection is used to change the flow direction of the resin (constituent) that injects from cast gate 28 and is located near the cast gate 28.When solid-state imager housing 20, the demoulding behind injection molding, under situation, has excision vestige with this excision with the configured ends that is connected in the little cast gate of aperture area 28.Recess 26 is formed in the residual short side direction sidewall of cast gate (excision) vestige.
Moreover recess 26 preferably utilizes resin flow control projection PJ to form, and described resin flow control projection PJ is provided with respect to the injection direction approximate vertical from the resin (constituent) of cast gate 28.
Figure 14 and Figure 15, it is the partial sectional view that is used to illustrate the solid-state imager housing 20 of injection molding method, schematically be illustrated in resin flow control projection is set in the ejection shaping mould chamber, restriction is from the appearance of the flow direction of the resin (constituent) of cast gate injection.
Figure 14 is near the partial sectional view the cast gate of the surface cut-out solid-state imager housing 20 that is parallel to resin system base plate 22, and described solid-state imager housing 20 inserts lead frame 50 and injection molding.Figure 15 is perpendicular to resin system base plate 22, and contains near the partial sectional view the cast gate that the surface of cast gate 29 cuts off.Resin flow direction when representing to be shaped with arrow DT5 and DT6.
Be used to form the resin flow control projection PJ (with reference to Fig. 6) of recess 26, be to inject and the flow direction of the resin (constituent) that directly advances near the outstanding parts of cast gate that are located in order to hinder from cast gate 28 in ejection shaping mould the chamber in.Resin flow control projection PJ is configured in and can hinders the position that keeps injection direction to flow from the resin (constituent) of cast gate 28 injections in mould, constitutes to have suitable size and shape.The end face of resin flow control projection PJ, preferably the injection direction Z with respect to resin (constituent) is set to approximate vertical.
By being set, resin flow controls projection PJ in the ejection shaping mould chamber, and injection molding, in resin system hollow housing, form the shape corresponding concave part 26 that resin flow is controlled projection PJ.Because the contraction of resin (constituent), tight some difference of shape sometimes, but the profile of resin flow control projection PJ and the cavity of recess 26, general shape is identical.Under resin flow control projection PJ is tabular situation, also can be called " cowling panel ".
Resin flow control projection PJ is configured near the cast gate 28 in the ejection shaping mould chamber.So-called " near ", be meant in the secondary sidewall (24a) that is provided with cast gate 28, can change the position of the resin flow direction of injection.Bury underground in the inside of secondary sidewall under the situation of metallic parts (resin of end, island is buried portion underground) etc., resin flow control projection PJ preferably is located between the end and cast gate 28 of these metallic parts.Resin flow control projection PJ, also can be well understood to from purport of the present invention, even in order to change flowing of the resin (constituent) in mould, inject, do not hinder original the flowing in the mold cavity yet, preferably between resin flow control projection PJ and cast gate 28, appropriate distance is set, and makes size and the shape of resin flow control projection PJ also suitable.
" the change flow direction " of the so-called resin (constituent) that injects from cast gate 28, the resin (constituent) that finger injects and directly advances from cast gate, change the flow direction of resin (constituent) halfway, so that directly do not arrive (burying underground) end of the metal parts be configured to the island nearest etc. apart from cast gate 28.That is, lead frame be not positioned at cast gate 28 opening the axle extended line on.
And then illustrate that above-mentioned injection molding is with cast gate 28.
In the solid-state imager housing 20, injection molding is located on the one-sided sidewall that extends along the short side direction of housing with cast gate.In one-sided sidewall sections, the injection molding cast gate is set on base plate 22, the operation of excising the configured ends that is connected in cast gate 28 is easy, and institute thinks preferred.Size and shape as cast gate 28 are not particularly limited, can be that benchmark is provided with known injection molding method, but, use the little cast gate of gate size according to side gate, recessed cast gate or some cast gate etc., more can bring into play effect of the present invention, institute thinks preferred.
At the one-sided sidewall of hollow housing, because residual excision is connected in the excision vestige of the configured ends of cast gate 28, so can judge the position of cast gate.Cast gate 28 if along the one-sided sidewall of the extension of short side direction, then do not limit its position especially, but preferably considers that the flow equilibrium of the resin (constituent) of this housing integral body is provided with.
Because the aperture area of cast gate 28 is smaller, so the injection pressure of the resin (constituent) that injects from cast gate 28 increases.If contact from the metal parts on the high-temperature resin (constituent) of cast gate 28 injections and the islands that directly plug etc., the worry of the distortion of producing then arranged.By resin flow control projection PJ is set near cast gate, the resin of injection (constituent) is by at first colliding with resin flow control projection, and its pressure obtains relaxing, and the pressure that is applied on the metal parts reduces.
Moreover, by cast gate 28 being located at along in the one-sided sidewall of short side direction extension, flow at housing long side direction resin (constituent) homogeneous, the linear expansivity of the long side direction sidewall of the housing that is shaped and the each several part of base plate becomes equalization, the warpage of the thermal deformation in the time of also can suppressing to follow the heating cooling takes place, and institute thinks preferred.
And then above-mentioned island is described.
The metallic island 30 of rectangle is formed on the inner bottom surface of solid-state imager housing 20, fixedly installs solid-state imager 12 on island 30.
Be fixedly installed on the solid-state imager 12 on the island 30, link to each other with the lead terminal 40 that transmits its signal charge to outside.Anchor at the solid-state imager 12 on the island 30, (bonding wire) links to each other with lead terminal 40 by closing line.
Moreover the shape of press section, island 34 if can suppress the warpage on island 30 then be not particularly limited, also can be the shape of crawling, but the band shape of constant amplitude preferably.
Press section, island 34,30 to form crosswise more excellent from the island, preferably the constant amplitude band shape.That is, be preferably formed and be cruciformity.
Press section, island 34 preferably is provided with more than 2 positions of island long side direction.By press section, island, many places 34 is set, can more effectively suppress the warpage on island 30, institute thinks preferred.
30 when having the length of 50~100mm on the island, and press section, island 34 preferably is provided with the intervals of 10~40mm, is provided with more excellent with the interval of 15~30mm.
Moreover island 30 also has the effect of emitting the heat of being sent by solid-state imager 12.If have press section, island 34, then area of dissipation increases, and can improve radiating efficiency, moreover solid camera head 10 can high speed motion, and can suppress the misoperation of the solid-state imager that heat causes, can improve picture quality, and institute thinks preferred.
Press section, island 34 preferably has the composition identical with island 30, and press section, island 34 and island 30 preferably are integrally formed as and are plugged in the hollow housing.
Moreover press section, island 34, island 30 and lead terminal 40 be also preferably as lead frame 50, is integrally formed as to be plugged in the hollow housing.Promptly, preferably the island is pushed and form the lead frame that part, island formation part and lead terminal formation part become one, insert in the mould, behind the injection molding (insertion is shaped (insert molding)), by not needing the excision of part, separated leads terminal 40 and island 30 and press section, island 34.
On the other hand, when inserting shaping, also can push the formation part to the island formation part and the island of separating with lead terminal 40 in advance, insert in the mould.
Moreover the leading section of press section, island 34 preferably is projected into the outside of solid-state imager housing, and is connected in thermal component and/or heat radiation circuit.In addition, so-called " connection " also comprises the following meaning: preferably be projected into the outside of solid-state imager housing 20 by the leading section of press section, island 34, himself forms thermal component.
Be exposed to outside by press section, island 34, be connected in thermal component and/or heat radiation circuit, can become the excellent especially solid camera head of thermal diffusivity, solid camera head can move more at high speed, and misoperation reduces, and mass property improves, and institute thinks preferred.
The both ends of island 30 long side directions preferably also are fixed on the housing body 20A.Preferably make the two ends broad on island 30, these both ends are inserted in solid-state imager housing 20, and its part is exposed to outside the hollow housing.Moreover, near the both ends of island long side direction, can be the form that is not fixed on this housing.
Solid camera head of the present invention preferably, possesses solid-state imager housing of the present invention, and the peristome of housing 20 is sealed by transparent panel 60, and the metallic island 30 of rectangle is set on the inner bottom surface of housing 20, set solid-state imager on island 30.
And then this solid-state imager 12 is described.
Solid-state imager has reading part, has to read the light of response by transparent panel incident in turn and produce the arrangement of pixel of signal charge and the function of the signal charge that pixel is arranged.Solid-state imager preferably has the semiconductor camera element that most pixels are arranged.
Solid-state imager is divided into substantially: the two-dimensional image sensor that one dimension imageing sensor (imagesensor) that the one dimension pixel is arranged and two-dimensional pixel are arranged, but can be used in solid-state imager of the present invention, preferably one dimension imageing sensor.The representative length of one dimension imageing sensor is 2~15cm, preferably 3~10cm.
In addition, use the solid camera head of one dimension imageing sensor, can be used for facsimile machine (facsimile), scanner (scanner), barcode reader (bar code reader) etc., use the solid camera head of two-dimensional image sensor, can be used for television camera etc.
Solid-state imager preferably utilizes binding agent, scolding tin (solder) etc. to fix, and is more excellent by the binding agent set.Solid-state imager is preferably fixed by the high binding agent of pyroconductivity.Specifically, pyroconductivity is preferably more than the 1W/mK, and is more excellent more than the 3W/mK.Moreover, preferably use the resin of insulating properties to fix.
In the above-described embodiment, resin (constituent) from the cast gate injection, collide with the resin flow control projection PJ with its injection direction approximate vertical setting, after the surface of resin flow control projection PJ temporarily changed its flow direction about 90 degree, the not filling part low towards pressure flowed.By changing the flow direction of the resin (constituent) that injects, produce 2 advantages substantially.An advantage is, by flowing of the resin (constituent) that injects from cast gate, temporarily contact with resin flow control projection PJ, and on its surface to dispersion everywhere, relax higher ejaculation pressure.
From Fig. 1 to comparative example 1,2 shown in Figure 4, the resin (constituent) that injects with higher ejaculation pressure directly contacts with island etc., distortion appears, but in execution mode, can eliminate this problem, the warpage on the island 30 in the solid-state imager housing that can prevent to be shaped and the distortion of lead terminal 40.
Another advantage is, temporarily contacts with resin flow control projection PJ by the resin (constituent) that penetrates from cast gate, can make the flowing velocity and the more homogenization of flow direction of resin (constituent).By utilizing resin flow control projection PJ restriction flow direction, resin (constituent) flows with the flow direction of unanimity and flowing velocity and is filled to the not filling part of base plate and sidewall length edge direction.
By flow direction and flowing velocity homogenization, resin (constituent) can high orientation, the cooling rate homogenization of this housing 20, and the also homogenization of contraction of the resin during cooling (constituent) is so the result is for suppressing the warpage or the distortion of housing 20.This tendency in the situation of using liquid-crystalline polymer to be shaped, or under the resin combination that has utilized by the fibre strengthening situation about being shaped, is brought significant especially effect.
The result that resin flow control projection PJ is set is, by above-mentioned two action effects, can suppress the warpage on island 30, can reduce the warpage and the distortion of solid-state imager 12.Therefore, easy solid camera head can be obtained to focus on, the picture quality that in solid-state imager, obtains can be improved.
(the 2nd execution mode)
The following describes the 2nd execution mode.In the 2nd execution mode, have only cast gate 28 to be located at the position this point of an end of the X-direction in the secondary sidewall 24, different with the 1st execution mode, other formation is identical with the 1st execution mode.
Figure 16 and Figure 17, it is the partial sectional view that schematically illustrates an example in the situation of injection molding of solid-state imager housing 20 of the 2nd execution mode, schematically illustrate resin flow control projection PJ (with reference to Fig. 6) is set in the ejection shaping mould chamber, restriction is from the appearance of the flow direction of the resin (constituent) of cast gate 28 injections.Figure 16 uses the face that is parallel to resin system base plate 22 and contains cast gate, cut off near the partial sectional view of cast gate of solid-state imager housing 20 of the present invention, described solid-state imager housing 20 of the present invention inserts lead frame 50 and carries out injection molding.Figure 17 is near the partial sectional view of using the cast gate that has cut off perpendicular to resin system base plate and the face that contains cast gate 28.Resin flow direction when representing to be shaped with arrow DT7 and DT8.
Height (degree of depth of recess 26) Z about resin flow control projection PJ
PJUnder the situation of the one-sided sidewall outer surface of the short side direction that cast gate 28 is located at hollow housing, resin flow control projection PJ need be configured between the outer surface of the position that is provided with cast gate 28 and base plate 22, when being L with vertical range from the opening of the boundary that is positioned at cast gate 28 and housing body 20A to base plate 22, height (degree of depth of the recess 26) Z of resin flow control projection PJ
PJ, preferably than dark (the 1/8) * L-(1/2) in the position of the Z-direction of cast gate 28 * L.This routine L is suitably 2mm.
That is be Z, if make the distance between the root position (the openend position of recess 26) of the outer bottom position on island 30 and resin flow control projection PJ
30, then satisfy following relation.
(1/8)×L≤Z
PJ-Z
30≤(1/2)×L
At Z
PJ-Z
30Be that the flow direction for control resin or its constituent can obtain effect of sufficient under the above situation of (1/8) * L.At Z
PJ-Z
30Be under the following situation of (1/2) * L,, can obtain effect of sufficient for guaranteeing the flowability of resin to base plate.
The longitudinal section (YZ plane) of the periphery of the resin flow control projection PJ when Figure 18 is the ester moulding of the 2nd execution mode, Figure 19 is the longitudinal section (XZ section) of this periphery.
If in the space that the resin flow F that X-direction flows injects between mould M3, M4 via cast gate 28, then this resin flow F contacts with the particular side PJS of resin flow control projection PJ, with going direction changing is direction along side PJS, flows in the space between mould.PJ is opposite to the face of cast gate 28 as particular side PJS with resin flow control projection.The intersection point on center line that extends with the center of the Y direction by particular side PJS and in Z-direction and the XY plane of containing island 30 is as initial point O (0,0,0).Particular side PJS is parallel to the YZ plane, but also can be with respect to the YZ plane inclination.For example,, be set at direction towards end face PJT by the projection of normal that the initial point 0 from particular side PJS is extended to the YZ plane, can be easily with the center direction guiding of resin flow to housing body 20A.
(X, Y Z) are (X to the position of centre of gravity G of the opening of cast gate 28
0, Y
0, Z
0).X
0, Y
0, Z
0It is arbitrary value.If the opening of cast gate 28 is circle and radius is R, then the outer shaped position of opening satisfies X
2+ Y
2=R
2The opening of opening 28 is to the projection image on YZ plane and the particular side PJS area coincidence to the projection image on YZ plane.Position of centre of gravity G is positioned at the zone of particular side PJS to the projection image on YZ plane to the projection image on YZ plane.
The height Z of resin flow control projection PJ
PJ, the length X 4 of X-direction, the width Y3 of Y direction, consistent with the width of the length of the degree of depth of recess 26, X-direction, Y direction respectively.The ultimate range Z that contains housing body 20A along the Z-direction in the XZ plane of the Central Line of X-direction
MAX, to make the distance along X-direction from initial point O to position of centre of gravity G be X6.They have following relation.
X
0=X6
-(1/2)×Y3≤Y
0≤(1/2)×Y3
Z
30-Z
PJ≤Z
0≤Z
30
In this case, resin flow control projection penetrates the resin of inflow or the flow direction of its constituent for control from cast gate, can obtain effect of sufficient.
As mentioned above, resin flow control projection PJ preferably is set to, and penetrates the resin (constituent) that flows into, and generally perpendicularly intersects with the surface of opposed projection PJ.So-called " approximate vertical ", the meaning be, except tight vertical situation, preferred also can have 30 ° with interior inclination from the direction perpendicular to the surface of projection PJ.Tabular cowling panel except cuboid, also can be six prisms that strengthen the central thickness of cuboid a little.
Resin flow is controlled projection PJ, is configured in the centre of the terminal part on cast gate 28 and island 30.Under the situation of the one-sided sidewall outer surface that cast gate is located at housing 20, resin flow control projection PJ preferably is set to give prominence in the peristome side direction mold cavity of housing 20.In contrast, resin flow control projection PJ also can be set to from the base plate 22 of housing 20 side-prominent.Moreover usually the mode that becomes the top with the base plate 22 of housing 20 disposes mould, but this also can dispose mould in the mode that base plate become the below, moreover the mode that also can become horizontal direction with the thickness direction of housing 20 disposes mould.
Shape and the size of resin flow control projection PJ as long as can reach purpose of the present invention, can freely be selected.That is, the formation of resin flow control projection PJ, as long as have full intensity when injection molding, the flow direction that can change resin or its constituent gets final product, and is not particularly limited.
Resin flow control projection PJ, preferred disposition is perpendicular to resin system base plate 22, preferably has certain thickness cuboid.
Solid-state imager housing 20 because resin flow control projection PJ control is penetrated the resin of inflow or the flow direction of its constituent from cast gate 28, carries out ester moulding, so can utilize the raising of this flowability to suppress the warpage of housing body 20A.Especially, solid-state imager housing 20, because it is mutually opposed that resin flow control projection is inserted the installation vestige (corresponding to cast gate 28) of vestige (corresponding to recess 26) and resin inlet, so the direction change of the resin flow of injecting from resin inlet (vestige of cast gate 28) during fabrication suppresses the warpage etc. of unexpected crooked, the housing 20 of lead frame and lead terminal.
Moreover, in above-mentioned manufacture method,, utilize the distortion of the image that is configured in its inner solid-state imager 12 shootings to reduce owing to suppress the warpage of solid-state imager housing 20.Because resin flow control projection PJ control is penetrated the resin that flows into or the flow direction of its constituent from cast gate 28, carries out ester moulding, so the warpage of the housing body can utilize the raising of this flowability to suppress to make the time.Especially, because it is mutually opposed that resin flow control projection is inserted the installation vestige (vestige of cast gate 28) of vestige (recess 26) and resin inlet, so can make following solid-state imager housing 20, promptly, the direction change of the resin flow of injecting from resin inlet (cast gate 28) suppresses the bending of lead terminal etc. during fabrication.
(embodiment 1)
Make the housing of Figure 14 and the 1st execution mode shown in Figure 15.In this hollow housing 20, utilize liquid-crystalline polymer (Sumitomo Chemical (strain) system, firmly change super (sumikasuper) E6008B) the upright sidewall of establishing on the periphery of rectangular base plate, and insert the copper lead terminal, at inner bottom surface Y direction width 2mm is set, the copper island 30 of X-direction length 90mm (250 microns of the thickness of Z-direction), and utilize the embedding forming process that hollow housing is integrally formed, described hollow housing is provided with the recess 26 (forming temperature: 350 ℃ that forms by resin flow control projection PJ near cast gate, issuing velocity: 100mm/sec, gate size: 1mm).
Being shaped as of hollow housing, housing outside dimension (length X 2=100mm * width Y2=9mm * height Z
MAX=3.2mm), the side wall portion thickness Y1=2mm of long side direction, short side direction side wall portion thickness X 7=5mm, base plate thickness M=1.5mm.
Moreover, recess 26, shape is the cuboid (limit X4=1.5mm * degree of depth Z of the length direction of the limit Y3=2.5mm of the Width vertical with the resin injection direction * vertical with the resin injection direction
PJ=2.2mm), the limit Y3 vertical with above-mentioned resin injection direction, it is the vertical limit of long limit X with housing, the limit X4 of the length direction vertical with above-mentioned resin injection direction, be the parallel limit of long limit X with housing, moreover recess 26 is made as, be positioned at order and equate the position of (distance Y 4=3.25mm) apart from the distance of the outer surface of two major side wall, and the distance X 6=1.0mm from the outer surface of secondary sidewall with cast gate 28 to the one side of cuboid.The diameter 2R of the opening of cast gate 28 is 1.0mm, and the distance X 3 from the center of gravity G of cast gate 28 to secondary sidewall 24 is 2.0mm.
The two ends insertion on island 30 also is fixed in hollow housing, on island 30, with the interval of 18mm be provided with 4 places from the island 30 press sections, island 34 that form criss-cross width 1mm, and then the central authorities on the island in the zone that accompanies in press section, two islands, the slit 32 of two rectangles of adjacency is set, and described slit 32 is from the opposition side setting on opposed long limit, island.
By binding agent (silicones of ultraviolet hardening) solid-state imager is fixed on the island 30, utilizes closing line to link to each other with lead terminal 40.And then, obtain to use the solid camera head of the peristome of ultra-violet solidified resin-blocked sidewall upper by the glass transparent panel.
(experimental result (embodiment 1))
The maximum amount of warpage on the island of the solid camera head of embodiment is 13 μ m.Moreover, do not see the distortion of the lead terminal of insertion.At this, the maximum amount of warpage on the island 30 of so-called solid camera head, being illustrated in the straight line that links the two ends, island is the maximum deformation quantity of the island long side direction central portion under the situation of benchmark.
(comparative example 1)
Except near the recess that is not provided with the cast gate based on resin flow control projection, similarly to Example 1, obtain solid camera head.
(experimental result (comparative example 1))
The maximum amount of warpage on the island of the solid camera head that obtains is 20 microns, moreover the pressure of the part of the lead terminal 40 of insertion during owing to injection molding is out of shape.
(embodiment 2)
Make the housing of Figure 16 and the 2nd execution mode shown in Figure 17.In this hollow housing 20, utilize liquid-crystalline polymer (Sumitomo Chemical (strain) system, firmly change super (sumikasuper) E6008B) the upright sidewall of establishing on the periphery of rectangular base plate, and insert the copper lead terminal, at inner bottom surface width 2mm is set, the copper island of length 90mm (250 microns of thickness), and utilize the embedding forming process that hollow housing is integrally formed, described hollow housing is provided with the recess 26 (forming temperature: 350 ℃ that forms by resin flow control projection PJ near cast gate, issuing velocity: 100mm/sec, gate size: 2mm (width) * 1mm (highly)).
Cast gate 2, cast gate center are positioned at resin sidewall outer surface equably about the short side direction of hollow housing, and the outer bottom of cast gate is provided with the part of leaving 2mm from the outer bottom of resin system base plate.
Moreover, recess 26, shape is that cuboid is (with the distance X 4=0.5mm * degree of depth Z on the limit of the X-direction of the distance Y 3=2.5mm on the limit of the vertical Y direction of resin injection direction * parallel with the resin injection direction
PJ=2.5mm), the limit of the Y direction vertical with above-mentioned resin injection direction, it is vertical limit, long limit (X-axis) with housing 20, the limit of the X-direction parallel with the resin injection direction, be the limit parallel with the long limit of housing, recess 26 is made as, and be positioned at order and equate the position of (distance Y 4=3.25mm) apart from the distance of the outer surface of two major side wall, and the distance X 6=2.0mm from the outer surface of secondary sidewall with cast gate 28 to the one side of cuboid.
The two ends insertion on island 30 also is fixed in hollow housing, on island 30, with the interval of 18mm be provided with 4 places from the island 30 press sections, island 34 that form criss-cross width 1mm, and then the central authorities on the island 30 in the zone that accompanies in press section, two islands 34, the slit 32 of two rectangles of adjacency is set, and described slit 32 is from the opposition side setting on opposed long limit, island.
By binding agent (silicones of ultraviolet hardening) solid-state imager 12 is fixed on the island 30, utilizes closing line to link to each other with lead terminal.And then, obtain to use the solid camera head of the peristome of ultra-violet solidified resin-blocked sidewall upper by the glass transparent panel.
(experimental result (embodiment 2))
The maximum amount of warpage on the island 30 of the solid camera head that obtains is 11 microns.Moreover, do not see the distortion of the lead terminal 40 of insertion.
(comparative example 2)
Except near the recess that is not provided with the cast gate based on resin flow control projection, similarly to Example 2, obtain solid camera head.
(experimental result (comparative example 2))
The maximum amount of warpage on the island of the solid camera head that obtains is 18 microns, moreover the pressure of the part of the lead terminal 40 of insertion during owing to injection molding is out of shape.
According to above experiment, can provide a kind of and embed metal parts (island, the lead terminal etc.) warpage of shaping or be out of shape few solid-state imager housing, its manufacture method and possess the solid camera head of this housing.
Claims (9)
1. solid-state imager housing, it is resin system hollow housing, integrally formed by the resin system base plate of essentially rectangular and the roughly upright resin system sidewall of being located at its periphery, and be inserted with metallic lead terminal and the metallic island that fixedly installs solid-state imager, peristome can seal with transparent panel
It is characterized in that this housing is by obtaining thermoplastic resin or its constituent one injection molding,
Injection molding is located at the one-sided sidewall of the short side direction of this housing with cast gate, the recess that utilizes resin flow control projection to form is located in this one-sided sidewall, and described resin flow control projection is used to change from the resin of this cast gate ejaculation inflow or the flow direction of its constituent.
2. solid-state imager housing as claimed in claim 1 is characterized in that, the width on the hollow housing short side direction of above-mentioned resin flow control projection, be this housing short side direction width 1/2~1/10.
3. solid-state imager housing as claimed in claim 1 is characterized in that, the thickness on the hollow housing long side direction of above-mentioned resin flow control projection, be this sidewall long side direction width 1/3~1/20.
4. solid-state imager housing as claimed in claim 1, it is characterized in that, injection molding is located on the one-sided sidewall outer surface of above-mentioned hollow housing short side direction with cast gate, when the vertical range from above-mentioned cast gate to above-mentioned base plate is made as L, the degree of depth of above-mentioned resin flow control projection is than dark (the 1/8) * L-(1/2) in the position of cast gate * L.
5. solid-state imager housing as claimed in claim 1, it is characterized in that, injection molding is located on the base plate with cast gate, this base plate is positioned at the one-sided lower sidewall of hollow housing short side direction, when the vertical range from cast gate to the island outer bottom is made as M, the degree of depth of above-mentioned resin flow control projection is than the outer bottom position dark (1/2) on island * below the M.
6. a solid camera head is characterized in that, possesses solid-state imager housing as claimed in claim 1.
7. the manufacture method of a solid-state imager housing, it is the manufacture method of resin system hollow housing, described resin system hollow housing is integrally formed by the resin system base plate of essentially rectangular and the roughly upright resin system sidewall of being located at its periphery, and insert the metallic island that is provided with the metallic lead terminal and fixedly installs solid-state imager, peristome can seal with transparent panel
It is characterized in that, in the following manner with thermoplastic resin or its constituent one injection molding, promptly, make injection molding be located at the one-sided sidewall of the short side direction of this housing with cast gate, the recess that utilizes resin flow control projection to form is formed in this one-sided sidewall, and described resin flow control projection is used to change from the resin of this cast gate ejaculation inflow or the flow direction of its constituent.
8. solid-state imager housing possesses:
Resin system housing body has solid-state imager configuration recess;
Lead terminal extends to above-mentioned housing body outside with the bottom surface of recess from above-mentioned solid-state imager configuration;
Resin flow control projection is inserted vestige, is located at an end of the long side direction of above-mentioned housing body;
With the installation vestige of resin inlet, what be located at above-mentioned housing body controls the opposed position of inside bottom surface that projection is inserted vestige with above-mentioned resin flow.
9. solid-state imager housing possesses:
Resin system housing body has solid-state imager configuration recess;
Lead terminal extends to above-mentioned housing body outside with the bottom surface of recess from above-mentioned solid-state imager configuration;
Resin flow control projection is inserted vestige, is located at an end of the long side direction of above-mentioned housing body;
With the installation vestige of resin inlet, what be located at above-mentioned housing body controls the opposed position of inner side surface that projection is inserted vestige with above-mentioned resin flow.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2005229696 | 2005-08-08 | ||
JP2005229696 | 2005-08-08 |
Publications (2)
Publication Number | Publication Date |
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CN1913588A true CN1913588A (en) | 2007-02-14 |
CN100550983C CN100550983C (en) | 2009-10-14 |
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Application Number | Title | Priority Date | Filing Date |
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CNB200610110158XA Expired - Fee Related CN100550983C (en) | 2005-08-08 | 2006-08-07 | Solid-state imager housing, its manufacture method and solid camera head |
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CN (1) | CN100550983C (en) |
TW (1) | TW200713525A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101939150A (en) * | 2008-02-06 | 2011-01-05 | 株式会社村田制作所 | Injection molded article and magnetic sensor |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5674996B2 (en) * | 2012-05-10 | 2015-02-25 | 三菱電機株式会社 | Image sensor |
-
2006
- 2006-08-07 CN CNB200610110158XA patent/CN100550983C/en not_active Expired - Fee Related
- 2006-08-07 TW TW095128873A patent/TW200713525A/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101939150A (en) * | 2008-02-06 | 2011-01-05 | 株式会社村田制作所 | Injection molded article and magnetic sensor |
CN101939150B (en) * | 2008-02-06 | 2014-05-28 | 株式会社村田制作所 | Injection molded article and magnetic sensor |
Also Published As
Publication number | Publication date |
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CN100550983C (en) | 2009-10-14 |
TW200713525A (en) | 2007-04-01 |
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