TW200713506A - Cutting machine and aligning method - Google Patents

Cutting machine and aligning method

Info

Publication number
TW200713506A
TW200713506A TW095130469A TW95130469A TW200713506A TW 200713506 A TW200713506 A TW 200713506A TW 095130469 A TW095130469 A TW 095130469A TW 95130469 A TW95130469 A TW 95130469A TW 200713506 A TW200713506 A TW 200713506A
Authority
TW
Taiwan
Prior art keywords
bench
chuck
predetermined line
moving direction
wafer
Prior art date
Application number
TW095130469A
Other languages
Chinese (zh)
Other versions
TWI408776B (en
Inventor
Katsuharu Negishi
Satoshi Sawaki
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW200713506A publication Critical patent/TW200713506A/en
Application granted granted Critical
Publication of TWI408776B publication Critical patent/TWI408776B/en

Links

Abstract

When the processing of wafer separation predetermined line, which is formed on the wafer held on the chuck bench, is performed to cut into the individual device, the moving direction of the separation predetermined line and the chuck bench is effectively carried out to enhance the productivity. Not only will the linear coordinate 334 used to recognize and examine the position information of the aligning means 8 of separation predetermined line be disposed, but also the moving direction of the chuck bench 2 is matched to dispose the linear coordinate 224 used to recognize the position information of the chuck bench 2 such that reading values of the two linear gauges 334 and 224 can be used to make the moving direction of the separation predetermined line and the chuck bench 2 become unanimous way to correct the direction of wafer.
TW95130469A 2005-09-20 2006-08-18 Cutting machine and aligning method TWI408776B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005271972A JP2007088028A (en) 2005-09-20 2005-09-20 Wafer separation equipment and alignment method of wafer

Publications (2)

Publication Number Publication Date
TW200713506A true TW200713506A (en) 2007-04-01
TWI408776B TWI408776B (en) 2013-09-11

Family

ID=37953301

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95130469A TWI408776B (en) 2005-09-20 2006-08-18 Cutting machine and aligning method

Country Status (3)

Country Link
JP (1) JP2007088028A (en)
CN (1) CN1935480B (en)
TW (1) TWI408776B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5011003B2 (en) * 2007-06-28 2012-08-29 株式会社ディスコ Alignment method
JP5457131B2 (en) * 2009-10-07 2014-04-02 株式会社ディスコ Blade changer
JP5508133B2 (en) * 2010-05-19 2014-05-28 株式会社ディスコ Plate-shaped material dividing device
JP5846768B2 (en) * 2011-06-07 2016-01-20 株式会社ディスコ Processing equipment
JP6218511B2 (en) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 Cutting apparatus and cutting method
TWI534937B (en) * 2013-09-09 2016-05-21 政美應用股份有限公司 Assembly and method for algining wafers
US9263352B2 (en) * 2014-01-03 2016-02-16 Asm Technology Singapore Pte Ltd Singulation apparatus comprising an imaging device
JP6808267B2 (en) * 2016-06-22 2021-01-06 株式会社ディスコ Cutting method and cutting equipment
JP7022624B2 (en) * 2018-03-13 2022-02-18 株式会社ディスコ Positioning method
JP7088771B2 (en) 2018-07-26 2022-06-21 株式会社ディスコ Alignment method
JP7208732B2 (en) 2018-07-26 2023-01-19 株式会社ディスコ Alignment method
CN113690162A (en) * 2021-08-09 2021-11-23 深圳市华星光电半导体显示技术有限公司 Grabbing method of alignment mark and alignment method of substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617870B2 (en) * 1993-10-04 1997-06-04 株式会社ディスコ Alignment method
JP3455102B2 (en) * 1998-02-06 2003-10-14 三菱電機株式会社 Semiconductor wafer chip separation method
JP4447074B2 (en) * 1999-06-21 2010-04-07 株式会社ディスコ Cutting equipment
JP2002237472A (en) * 2001-02-07 2002-08-23 Disco Abrasive Syst Ltd Method of cutting object to be processed
JP4696321B2 (en) * 2001-03-21 2011-06-08 株式会社東京精密 Dicing machine
JP2002359211A (en) * 2001-05-30 2002-12-13 Disco Abrasive Syst Ltd Cutting machine
JP4405719B2 (en) * 2002-10-17 2010-01-27 株式会社ルネサステクノロジ Semiconductor wafer
JP4342807B2 (en) * 2003-02-07 2009-10-14 株式会社ディスコ Alignment method and alignment apparatus
TWI222173B (en) * 2003-08-20 2004-10-11 Advanced Semiconductor Eng Method of making a package structure by dicing a wafer from the backside surface thereof

Also Published As

Publication number Publication date
TWI408776B (en) 2013-09-11
JP2007088028A (en) 2007-04-05
CN1935480B (en) 2011-06-15
CN1935480A (en) 2007-03-28

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