TW200713419A - 3-dimensional hexagon micro structure and process of manufacturing the same - Google Patents
3-dimensional hexagon micro structure and process of manufacturing the sameInfo
- Publication number
- TW200713419A TW200713419A TW094133199A TW94133199A TW200713419A TW 200713419 A TW200713419 A TW 200713419A TW 094133199 A TW094133199 A TW 094133199A TW 94133199 A TW94133199 A TW 94133199A TW 200713419 A TW200713419 A TW 200713419A
- Authority
- TW
- Taiwan
- Prior art keywords
- micro structure
- dimensional hexagon
- dimensional
- etchant
- etched
- Prior art date
Links
Landscapes
- Micromachines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94133199A TWI271787B (en) | 2005-09-23 | 2005-09-23 | 3-dimensional hexagon micro structure and process of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94133199A TWI271787B (en) | 2005-09-23 | 2005-09-23 | 3-dimensional hexagon micro structure and process of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI271787B TWI271787B (en) | 2007-01-21 |
TW200713419A true TW200713419A (en) | 2007-04-01 |
Family
ID=38435320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94133199A TWI271787B (en) | 2005-09-23 | 2005-09-23 | 3-dimensional hexagon micro structure and process of manufacturing the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI271787B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI315715B (en) | 2007-03-22 | 2009-10-11 | Nat Univ Tsing Hua | Method of forming 3d high aspect ratio micro structures |
-
2005
- 2005-09-23 TW TW94133199A patent/TWI271787B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI271787B (en) | 2007-01-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |