TW200712429A - Alignment mark and measuring method by using alignment mark - Google Patents

Alignment mark and measuring method by using alignment mark

Info

Publication number
TW200712429A
TW200712429A TW094133682A TW94133682A TW200712429A TW 200712429 A TW200712429 A TW 200712429A TW 094133682 A TW094133682 A TW 094133682A TW 94133682 A TW94133682 A TW 94133682A TW 200712429 A TW200712429 A TW 200712429A
Authority
TW
Taiwan
Prior art keywords
alignment mark
test
measuring method
pattern
dimension
Prior art date
Application number
TW094133682A
Other languages
Chinese (zh)
Other versions
TWI276774B (en
Inventor
Jia-Rui Hu
Ru-Mei Chien
Original Assignee
Promos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Promos Technologies Inc filed Critical Promos Technologies Inc
Priority to TW94133682A priority Critical patent/TWI276774B/en
Application granted granted Critical
Publication of TWI276774B publication Critical patent/TWI276774B/en
Publication of TW200712429A publication Critical patent/TW200712429A/en

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

An alignment mark includes a recognition pattern and a test-key pattern is described. The alignment mark is disposed on a semiconductor wafer, the semiconductor wafer has a device feature with a device dimension. The test-key pattern is disposed in the recognition pattern, and the recognition pattern and the test-key pattern are composed of the test features. The test features have a test dimension similar to the device dimension.
TW94133682A 2005-09-28 2005-09-28 Alignment mark and measuring method by using alignment mark TWI276774B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94133682A TWI276774B (en) 2005-09-28 2005-09-28 Alignment mark and measuring method by using alignment mark

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94133682A TWI276774B (en) 2005-09-28 2005-09-28 Alignment mark and measuring method by using alignment mark

Publications (2)

Publication Number Publication Date
TWI276774B TWI276774B (en) 2007-03-21
TW200712429A true TW200712429A (en) 2007-04-01

Family

ID=38646349

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94133682A TWI276774B (en) 2005-09-28 2005-09-28 Alignment mark and measuring method by using alignment mark

Country Status (1)

Country Link
TW (1) TWI276774B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113611650A (en) * 2021-03-19 2021-11-05 联芯集成电路制造(厦门)有限公司 Method for aligning wafer pattern
CN115628685A (en) * 2022-08-15 2023-01-20 魅杰光电科技(上海)有限公司 Method and equipment for measuring critical dimension and method for positioning critical dimension in grading manner
TWI809828B (en) * 2022-02-16 2023-07-21 南亞科技股份有限公司 Overlay metrology mark

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113611650A (en) * 2021-03-19 2021-11-05 联芯集成电路制造(厦门)有限公司 Method for aligning wafer pattern
US11692946B2 (en) 2021-03-19 2023-07-04 United Semiconductor (Xiamen) Co., Ltd. Method for aligning to a pattern on a wafer
CN113611650B (en) * 2021-03-19 2024-02-27 联芯集成电路制造(厦门)有限公司 Method for aligning wafer pattern
TWI809828B (en) * 2022-02-16 2023-07-21 南亞科技股份有限公司 Overlay metrology mark
CN115628685A (en) * 2022-08-15 2023-01-20 魅杰光电科技(上海)有限公司 Method and equipment for measuring critical dimension and method for positioning critical dimension in grading manner
CN115628685B (en) * 2022-08-15 2024-03-26 魅杰光电科技(上海)有限公司 Method and equipment for measuring critical dimension and method for classifying and positioning critical dimension

Also Published As

Publication number Publication date
TWI276774B (en) 2007-03-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees