TW200712429A - Alignment mark and measuring method by using alignment mark - Google Patents
Alignment mark and measuring method by using alignment markInfo
- Publication number
- TW200712429A TW200712429A TW094133682A TW94133682A TW200712429A TW 200712429 A TW200712429 A TW 200712429A TW 094133682 A TW094133682 A TW 094133682A TW 94133682 A TW94133682 A TW 94133682A TW 200712429 A TW200712429 A TW 200712429A
- Authority
- TW
- Taiwan
- Prior art keywords
- alignment mark
- test
- measuring method
- pattern
- dimension
- Prior art date
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
An alignment mark includes a recognition pattern and a test-key pattern is described. The alignment mark is disposed on a semiconductor wafer, the semiconductor wafer has a device feature with a device dimension. The test-key pattern is disposed in the recognition pattern, and the recognition pattern and the test-key pattern are composed of the test features. The test features have a test dimension similar to the device dimension.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94133682A TWI276774B (en) | 2005-09-28 | 2005-09-28 | Alignment mark and measuring method by using alignment mark |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94133682A TWI276774B (en) | 2005-09-28 | 2005-09-28 | Alignment mark and measuring method by using alignment mark |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI276774B TWI276774B (en) | 2007-03-21 |
TW200712429A true TW200712429A (en) | 2007-04-01 |
Family
ID=38646349
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94133682A TWI276774B (en) | 2005-09-28 | 2005-09-28 | Alignment mark and measuring method by using alignment mark |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI276774B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113611650A (en) * | 2021-03-19 | 2021-11-05 | 联芯集成电路制造(厦门)有限公司 | Method for aligning wafer pattern |
CN115628685A (en) * | 2022-08-15 | 2023-01-20 | 魅杰光电科技(上海)有限公司 | Method and equipment for measuring critical dimension and method for positioning critical dimension in grading manner |
TWI809828B (en) * | 2022-02-16 | 2023-07-21 | 南亞科技股份有限公司 | Overlay metrology mark |
-
2005
- 2005-09-28 TW TW94133682A patent/TWI276774B/en not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113611650A (en) * | 2021-03-19 | 2021-11-05 | 联芯集成电路制造(厦门)有限公司 | Method for aligning wafer pattern |
US11692946B2 (en) | 2021-03-19 | 2023-07-04 | United Semiconductor (Xiamen) Co., Ltd. | Method for aligning to a pattern on a wafer |
CN113611650B (en) * | 2021-03-19 | 2024-02-27 | 联芯集成电路制造(厦门)有限公司 | Method for aligning wafer pattern |
TWI809828B (en) * | 2022-02-16 | 2023-07-21 | 南亞科技股份有限公司 | Overlay metrology mark |
CN115628685A (en) * | 2022-08-15 | 2023-01-20 | 魅杰光电科技(上海)有限公司 | Method and equipment for measuring critical dimension and method for positioning critical dimension in grading manner |
CN115628685B (en) * | 2022-08-15 | 2024-03-26 | 魅杰光电科技(上海)有限公司 | Method and equipment for measuring critical dimension and method for classifying and positioning critical dimension |
Also Published As
Publication number | Publication date |
---|---|
TWI276774B (en) | 2007-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |