TW200712248A - Method and apparatus for preventing ALD reactants from damaging vacuum pumps - Google Patents

Method and apparatus for preventing ALD reactants from damaging vacuum pumps

Info

Publication number
TW200712248A
TW200712248A TW095117455A TW95117455A TW200712248A TW 200712248 A TW200712248 A TW 200712248A TW 095117455 A TW095117455 A TW 095117455A TW 95117455 A TW95117455 A TW 95117455A TW 200712248 A TW200712248 A TW 200712248A
Authority
TW
Taiwan
Prior art keywords
preventing
vacuum pumps
ald reactants
damaging vacuum
reactants
Prior art date
Application number
TW095117455A
Other languages
English (en)
Other versions
TWI330670B (en
Inventor
You-Fan Gu
David Neumeister
Original Assignee
Mks Instr Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mks Instr Inc filed Critical Mks Instr Inc
Publication of TW200712248A publication Critical patent/TW200712248A/zh
Application granted granted Critical
Publication of TWI330670B publication Critical patent/TWI330670B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523Pulsed gas flow or change of composition over time
    • C23C16/45525Atomic layer deposition [ALD]
    • C23C16/45544Atomic layer deposition [ALD] characterized by the apparatus
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
TW095117455A 2005-05-23 2006-05-17 Method and apparatus for preventing ald reactants from damaging vacuum pumps TWI330670B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/136,610 US8679287B2 (en) 2005-05-23 2005-05-23 Method and apparatus for preventing ALD reactants from damaging vacuum pumps

Publications (2)

Publication Number Publication Date
TW200712248A true TW200712248A (en) 2007-04-01
TWI330670B TWI330670B (en) 2010-09-21

Family

ID=37074651

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117455A TWI330670B (en) 2005-05-23 2006-05-17 Method and apparatus for preventing ald reactants from damaging vacuum pumps

Country Status (6)

Country Link
US (1) US8679287B2 (zh)
JP (1) JP2008542532A (zh)
DE (1) DE112006001323T5 (zh)
GB (1) GB2441672A (zh)
TW (1) TWI330670B (zh)
WO (1) WO2006127693A2 (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7202535B2 (en) * 2005-07-14 2007-04-10 Infineon Technologies Ag Manufacturing method for an integrated semiconductor structure and corresponding integrated semiconductor structure
GB0605048D0 (en) * 2006-03-14 2006-04-26 Boc Group Plc Apparatus for treating a gas stream
GB0724717D0 (en) * 2007-12-19 2008-01-30 Edwards Ltd Method of treating a gas stream
CN101981653B (zh) * 2008-03-25 2012-09-05 应用材料公司 节省电子器件制造资源的方法与装置
US20100075037A1 (en) * 2008-09-22 2010-03-25 Marsh Eugene P Deposition Systems, ALD Systems, CVD Systems, Deposition Methods, ALD Methods and CVD Methods
US9328417B2 (en) * 2008-11-01 2016-05-03 Ultratech, Inc. System and method for thin film deposition
DE102009055638A1 (de) * 2009-11-25 2011-05-26 Oerlikon Leybold Vacuum Gmbh Heißfallenanordnung
GB0922564D0 (en) 2009-12-24 2010-02-10 Edwards Ltd Pump
JP5750281B2 (ja) * 2011-03-07 2015-07-15 株式会社アルバック 真空一貫基板処理装置及び成膜方法
US9057388B2 (en) * 2012-03-21 2015-06-16 International Business Machines Corporation Vacuum trap
TWI588286B (zh) 2013-11-26 2017-06-21 烏翠泰克股份有限公司 經改良的電漿強化原子層沉積方法、周期及裝置
US20170241019A1 (en) * 2016-02-22 2017-08-24 Ultratech, Inc. Pe-ald methods with reduced quartz-based contamination
WO2019120358A1 (de) * 2017-12-21 2019-06-27 centrotherm international AG Verfahren zum betrieb einer abscheideanlage
US11578405B2 (en) * 2019-04-23 2023-02-14 King Fahd University Of Petroleum And Minerals Apparatus for monitoring carbon nanotube growth
KR102228180B1 (ko) * 2021-01-21 2021-03-16 주식회사 미래보 유기막 증착 공정 시 발생하는 반응 부산물 포집 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS601827A (ja) * 1983-06-20 1985-01-08 Nec Corp Cvd装置
EP0382984A1 (en) 1989-02-13 1990-08-22 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Thermal decomposition trap
JP3246708B2 (ja) * 1995-05-02 2002-01-15 東京エレクトロン株式会社 トラップ装置及びこれを用いた未反応処理ガス排気機構
US6099649A (en) 1997-12-23 2000-08-08 Applied Materials, Inc. Chemical vapor deposition hot-trap for unreacted precursor conversion and effluent removal
US6383300B1 (en) 1998-11-27 2002-05-07 Tokyo Electron Ltd. Heat treatment apparatus and cleaning method of the same
FI110311B (fi) * 1999-07-20 2002-12-31 Asm Microchemistry Oy Menetelmä ja laitteisto aineiden poistamiseksi kaasuista
US20050148199A1 (en) * 2003-12-31 2005-07-07 Frank Jansen Apparatus for atomic layer deposition

Also Published As

Publication number Publication date
DE112006001323T5 (de) 2008-04-17
WO2006127693A2 (en) 2006-11-30
GB2441672A (en) 2008-03-12
WO2006127693A3 (en) 2007-04-12
TWI330670B (en) 2010-09-21
US20060264045A1 (en) 2006-11-23
JP2008542532A (ja) 2008-11-27
GB0722391D0 (en) 2007-12-27
US8679287B2 (en) 2014-03-25

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