TW200711153A - Wafer-level vacuum packaging method - Google Patents

Wafer-level vacuum packaging method

Info

Publication number
TW200711153A
TW200711153A TW094130169A TW94130169A TW200711153A TW 200711153 A TW200711153 A TW 200711153A TW 094130169 A TW094130169 A TW 094130169A TW 94130169 A TW94130169 A TW 94130169A TW 200711153 A TW200711153 A TW 200711153A
Authority
TW
Taiwan
Prior art keywords
packaging
wafer
substrate
cover
space
Prior art date
Application number
TW094130169A
Other languages
Chinese (zh)
Other versions
TWI255048B (en
Inventor
qing-fu Zou
hong-zhong Li
Original Assignee
qing-fu Zou
hong-zhong Li
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by qing-fu Zou, hong-zhong Li filed Critical qing-fu Zou
Priority to TW94130169A priority Critical patent/TWI255048B/en
Application granted granted Critical
Publication of TWI255048B publication Critical patent/TWI255048B/en
Publication of TW200711153A publication Critical patent/TW200711153A/en

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  • Micromachines (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

The present invention relates to a wafer-level vacuum packaging method, comprising: fixing a plurality of microstructure elements on a substrate; connecting the internal connection of the microstructure elements to the bottom of the substrate by internal connection; fixing a cover onto the substrate and creating a space between each microstructure element and the cover with the substrate respectively; perforating at least one penetrating aperture at the position in the space corresponding to the cover for the connection of the space and completing the packaging structure; disposing the packaging structure into a vacuum environment to coat with packing material; achieving a vacuum condition in the packaging structure with the penetrating aperture through the use of the vacuum environment; uniformly coating a layer of packaging material on the cover; filling each penetrating aperture with packaging material to enclose each penetrating aperture so that the microstructure elements in each space are under a vacuum condition; and curing the packaging material and cutting the wafer into a plurality of single packaging dies.
TW94130169A 2005-09-02 2005-09-02 Wafer-level vacuum packaging method TWI255048B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94130169A TWI255048B (en) 2005-09-02 2005-09-02 Wafer-level vacuum packaging method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94130169A TWI255048B (en) 2005-09-02 2005-09-02 Wafer-level vacuum packaging method

Publications (2)

Publication Number Publication Date
TWI255048B TWI255048B (en) 2006-05-11
TW200711153A true TW200711153A (en) 2007-03-16

Family

ID=37607581

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94130169A TWI255048B (en) 2005-09-02 2005-09-02 Wafer-level vacuum packaging method

Country Status (1)

Country Link
TW (1) TWI255048B (en)

Also Published As

Publication number Publication date
TWI255048B (en) 2006-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees