WO2009061704A3 - Atomic layer deposition encapsulation - Google Patents
Atomic layer deposition encapsulation Download PDFInfo
- Publication number
- WO2009061704A3 WO2009061704A3 PCT/US2008/082295 US2008082295W WO2009061704A3 WO 2009061704 A3 WO2009061704 A3 WO 2009061704A3 US 2008082295 W US2008082295 W US 2008082295W WO 2009061704 A3 WO2009061704 A3 WO 2009061704A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer deposition
- atomic layer
- deposition encapsulation
- encapsulation
- ald
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The invention provides devices that are conformally encapsulated using ALD and methods for producing the same.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US98593607P | 2007-11-06 | 2007-11-06 | |
US60/985,936 | 2007-11-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009061704A2 WO2009061704A2 (en) | 2009-05-14 |
WO2009061704A3 true WO2009061704A3 (en) | 2009-08-20 |
Family
ID=40626410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2008/082295 WO2009061704A2 (en) | 2007-11-06 | 2008-11-03 | Atomic layer deposition encapsulation |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2009061704A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009058796A1 (en) | 2009-12-18 | 2011-06-22 | OSRAM Opto Semiconductors GmbH, 93055 | Optoelectronic component and method for producing an optoelectronic component |
DE102011016302A1 (en) * | 2011-04-07 | 2012-10-11 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip |
DE102011016935A1 (en) * | 2011-04-13 | 2012-10-18 | Osram Opto Semiconductors Gmbh | A method of manufacturing a semiconductor light emitting device and light emitting semiconductor device |
DE102011114641B4 (en) | 2011-09-30 | 2021-08-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelectronic semiconductor component and method for producing an optoelectronic semiconductor component |
JP6307707B2 (en) * | 2012-08-13 | 2018-04-11 | 株式会社昭和真空 | Light emitting device manufacturing system |
DE102013100818B4 (en) * | 2013-01-28 | 2023-07-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip |
DE102013103079A1 (en) * | 2013-03-26 | 2014-10-02 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip |
FI20135967L (en) * | 2013-09-27 | 2015-03-28 | Lumichip Oy | MULTIFUNCTIONAL ENCAPSULATING LAYER FOR ASSEMBLIES AND PROCEDURE FOR MANUFACTURE THEREOF |
WO2017188947A1 (en) * | 2016-04-27 | 2017-11-02 | Applied Materials, Inc. | System for atomic layer deposition on flexible substrates and method for the same |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060270081A1 (en) * | 2005-05-27 | 2006-11-30 | Chua Janet B Y | Light emitting device having a layer of photonic crystals and a region of diffusing material and method for fabricating the device |
US20070004080A1 (en) * | 2005-06-30 | 2007-01-04 | Ouyang Mike X | Hermetic seals for micro-electromechanical system devices |
US20070085092A1 (en) * | 2005-10-14 | 2007-04-19 | Hon Hai Precision Industry Co., Ltd. | Light-emitting device, planar light source and direct type backlight module |
US20070164376A1 (en) * | 1999-10-25 | 2007-07-19 | Burrows Paul E | Method for edge sealing barrier films |
-
2008
- 2008-11-03 WO PCT/US2008/082295 patent/WO2009061704A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070164376A1 (en) * | 1999-10-25 | 2007-07-19 | Burrows Paul E | Method for edge sealing barrier films |
US20060270081A1 (en) * | 2005-05-27 | 2006-11-30 | Chua Janet B Y | Light emitting device having a layer of photonic crystals and a region of diffusing material and method for fabricating the device |
US20070004080A1 (en) * | 2005-06-30 | 2007-01-04 | Ouyang Mike X | Hermetic seals for micro-electromechanical system devices |
US20070085092A1 (en) * | 2005-10-14 | 2007-04-19 | Hon Hai Precision Industry Co., Ltd. | Light-emitting device, planar light source and direct type backlight module |
Also Published As
Publication number | Publication date |
---|---|
WO2009061704A2 (en) | 2009-05-14 |
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