TW200711073A - Filmy adhesive for fixing semiconductor element, semeconductor device using the same and manufacturing method of semiconductor device - Google Patents
Filmy adhesive for fixing semiconductor element, semeconductor device using the same and manufacturing method of semiconductor deviceInfo
- Publication number
- TW200711073A TW200711073A TW095130217A TW95130217A TW200711073A TW 200711073 A TW200711073 A TW 200711073A TW 095130217 A TW095130217 A TW 095130217A TW 95130217 A TW95130217 A TW 95130217A TW 200711073 A TW200711073 A TW 200711073A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor element
- fixing
- adhesive
- filmy adhesive
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
Abstract
This invention provides a filmy adhesive for fixing semiconductor element by which the thickness thereof can be more than the electric components arranged on a substrate, and the occurrence of void is proventable in spite of being a filmy adhesive for fixing semiconductor element, the space generated between substrate and semiconductor element due to the thickness of the electric components arranged on the substrate can be fully embedded with the filmy adhesive for fixing semiconductor element, and the semiconductor element can be effectively and surely adhered on to the substrate with unevenness. The filmy adhesive for fixing semiconductor element is formed by laminating multi-layer films for adhesive composed of material with fusion viscosity at 140 DEG C being below 50Pa.s and thickness being 200μm~2000μm.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005248154A JP2007063333A (en) | 2005-08-29 | 2005-08-29 | Film adhesive for fixing semiconductor element, semiconductor device using the same and method for manufacturing the semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200711073A true TW200711073A (en) | 2007-03-16 |
TWI384592B TWI384592B (en) | 2013-02-01 |
Family
ID=37925899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095130217A TWI384592B (en) | 2005-08-29 | 2006-08-17 | Filmy adhesive for fixing semiconductor element, semeconductor device using the same and manufacturing method of semiconductor device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2007063333A (en) |
KR (1) | KR101253107B1 (en) |
TW (1) | TWI384592B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012116958A (en) * | 2010-12-01 | 2012-06-21 | Furukawa Electric Co Ltd:The | Adhesive film and wiring board |
JP2014216488A (en) * | 2013-04-25 | 2014-11-17 | 日東電工株式会社 | Adhesive film, dicing/die bonding film, method of manufacturing semiconductor device and semiconductor device |
JP5828881B2 (en) * | 2013-12-24 | 2015-12-09 | 日東電工株式会社 | Adhesive film, dicing die bond film, semiconductor device manufacturing method, and semiconductor device |
JP5901715B1 (en) * | 2014-09-05 | 2016-04-13 | 古河電気工業株式会社 | Film adhesive, semiconductor package using film adhesive, and manufacturing method thereof |
CN111819671A (en) * | 2018-03-06 | 2020-10-23 | 日立化成株式会社 | Semiconductor device and method for manufacturing the same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100273499B1 (en) * | 1995-05-22 | 2001-01-15 | 우찌가사끼 이사오 | Semiconductor device having a semiconductor chip electrically connected to a wiring substrate |
US6064111A (en) * | 1996-07-31 | 2000-05-16 | Hitachi Company, Ltd. | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package |
US5919329A (en) * | 1997-10-14 | 1999-07-06 | Gore Enterprise Holdings, Inc. | Method for assembling an integrated circuit chip package having at least one semiconductor device |
JP2000195584A (en) * | 1998-12-25 | 2000-07-14 | Sony Corp | Electrical connection device and electrical connection method |
JP4642173B2 (en) * | 1999-08-05 | 2011-03-02 | 新日鐵化学株式会社 | Composition for film adhesive |
US6710454B1 (en) * | 2000-02-16 | 2004-03-23 | Micron Technology, Inc. | Adhesive layer for an electronic apparatus having multiple semiconductor devices |
US6506671B1 (en) * | 2000-06-08 | 2003-01-14 | Micron Technology, Inc. | Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad |
KR100374629B1 (en) * | 2000-12-19 | 2003-03-04 | 페어차일드코리아반도체 주식회사 | A power semiconductor package for thin and small size |
US6897474B2 (en) * | 2002-04-12 | 2005-05-24 | Universal Display Corporation | Protected organic electronic devices and methods for making the same |
JP4562118B2 (en) * | 2003-12-19 | 2010-10-13 | 日東電工株式会社 | Manufacturing method of semiconductor device |
-
2005
- 2005-08-29 JP JP2005248154A patent/JP2007063333A/en not_active Withdrawn
-
2006
- 2006-08-17 TW TW095130217A patent/TWI384592B/en active
- 2006-08-28 KR KR1020060081632A patent/KR101253107B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR101253107B1 (en) | 2013-04-10 |
JP2007063333A (en) | 2007-03-15 |
TWI384592B (en) | 2013-02-01 |
KR20070026057A (en) | 2007-03-08 |
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