TW200710235A - Module for a coating system and associated technology - Google Patents

Module for a coating system and associated technology

Info

Publication number
TW200710235A
TW200710235A TW095117522A TW95117522A TW200710235A TW 200710235 A TW200710235 A TW 200710235A TW 095117522 A TW095117522 A TW 095117522A TW 95117522 A TW95117522 A TW 95117522A TW 200710235 A TW200710235 A TW 200710235A
Authority
TW
Taiwan
Prior art keywords
module
compartment
sputtering
pump
sufficient
Prior art date
Application number
TW095117522A
Other languages
English (en)
Inventor
Philip M Petrach
Original Assignee
Applied Films Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Films Corp filed Critical Applied Films Corp
Publication of TW200710235A publication Critical patent/TW200710235A/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568Transferring the substrates through a series of coating stations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411Constructional aspects of the reactor
    • H01J37/3444Associated circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497Temperature of target
TW095117522A 2005-05-20 2006-05-17 Module for a coating system and associated technology TW200710235A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US68298505P 2005-05-20 2005-05-20
US11/382,240 US20060260938A1 (en) 2005-05-20 2006-05-08 Module for Coating System and Associated Technology

Publications (1)

Publication Number Publication Date
TW200710235A true TW200710235A (en) 2007-03-16

Family

ID=37447330

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095117522A TW200710235A (en) 2005-05-20 2006-05-17 Module for a coating system and associated technology

Country Status (7)

Country Link
US (1) US20060260938A1 (zh)
EP (1) EP1882051A4 (zh)
JP (1) JP2008540848A (zh)
KR (1) KR20080042040A (zh)
RU (1) RU2007147465A (zh)
TW (1) TW200710235A (zh)
WO (1) WO2006127267A2 (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070256934A1 (en) * 2006-05-08 2007-11-08 Perata Michael R Apparatus and Method for Coating Substrates With Approximate Process Isolation
US20080011599A1 (en) 2006-07-12 2008-01-17 Brabender Dennis M Sputtering apparatus including novel target mounting and/or control
JP5104334B2 (ja) * 2008-01-22 2012-12-19 株式会社島津製作所 真空ポンプ
US9812299B2 (en) * 2008-04-28 2017-11-07 Cemecon Ag Apparatus and method for pretreating and coating bodies
JP5283475B2 (ja) * 2008-10-21 2013-09-04 Sppテクノロジーズ株式会社 プラズマ制御用電源装置
US8040068B2 (en) * 2009-02-05 2011-10-18 Mks Instruments, Inc. Radio frequency power control system
DE102010030006A1 (de) * 2010-06-11 2011-12-15 Von Ardenne Anlagentechnik Gmbh Vakuumbeschichtungsanlage in modularer Bauweise
TWI554630B (zh) * 2010-07-02 2016-10-21 應用材料股份有限公司 減少沉積不對稱性的沉積設備及方法
CN103608893B (zh) * 2011-04-20 2016-08-31 欧瑞康表面解决方案股份公司,普费菲孔 用于提供顺序功率脉冲的方法
DE102011106196A1 (de) * 2011-06-07 2012-12-13 Oerlikon Trading Ag, Trübbach Lackieranlage
BE1022682B1 (nl) * 2015-01-11 2016-07-14 Soleras Advanced Coatings Bvba Een deksel met een sensorsysteem voor een configureerbaar meetsysteem voor een configureerbaar sputtersysteem
US20180108519A1 (en) * 2016-10-17 2018-04-19 Applied Materials, Inc. POWER DELIVERY FOR HIGH POWER IMPULSE MAGNETRON SPUTTERING (HiPIMS)
EP3541762B1 (en) 2016-11-17 2022-03-02 Cardinal CG Company Static-dissipative coating technology

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US3395089A (en) * 1964-12-14 1968-07-30 Bell Telephone Labor Inc Method of depositing films of controlled specific resistivity and temperature coefficient of resistance using cathode sputtering
US3679571A (en) * 1970-10-12 1972-07-25 Bendix Corp R-f sputtering apparatus
US4166018A (en) * 1974-01-31 1979-08-28 Airco, Inc. Sputtering process and apparatus
US4278528A (en) * 1979-10-09 1981-07-14 Coulter Systems Corporation Rectilinear sputtering apparatus and method
USRE34806E (en) * 1980-11-25 1994-12-13 Celestech, Inc. Magnetoplasmadynamic processor, applications thereof and methods
US4682564A (en) * 1980-11-25 1987-07-28 Cann Gordon L Magnetoplasmadynamic processor, applications thereof and methods
US4445997A (en) * 1983-08-17 1984-05-01 Shatterproof Glass Corporation Rotatable sputtering apparatus
US5016562A (en) * 1988-04-27 1991-05-21 Glasstech Solar, Inc. Modular continuous vapor deposition system
JPH01309965A (ja) * 1988-06-08 1989-12-14 Matsushita Electric Ind Co Ltd マグネトロンスパッタ装置
US5021777A (en) * 1988-10-14 1991-06-04 Transition Technology, Inc. Mode-selectable communications system
US5023768A (en) * 1989-11-24 1991-06-11 Varian Associates, Inc. High voltage high power DC power supply
EP0439360A3 (en) * 1990-01-26 1992-01-15 Varian Associates, Inc. Rotating sputtering apparatus for selected erosion
US5241152A (en) * 1990-03-23 1993-08-31 Anderson Glen L Circuit for detecting and diverting an electrical arc in a glow discharge apparatus
US5284521A (en) * 1990-09-21 1994-02-08 Anelva Corporation Vacuum film forming apparatus
US5236509A (en) * 1992-02-06 1993-08-17 Spire Corporation Modular ibad apparatus for continuous coating
DE4207525C2 (de) * 1992-03-10 1999-12-16 Leybold Ag Hochvakuum-Beschichtungsanlage
DE4313353C2 (de) * 1993-04-23 1997-08-28 Leybold Ag Vakuum-Beschichtungsanlage
US5527439A (en) * 1995-01-23 1996-06-18 The Boc Group, Inc. Cylindrical magnetron shield structure
WO1996034124A1 (en) * 1995-04-25 1996-10-31 The Boc Group, Inc. Sputtering system using cylindrical rotating magnetron electrically powered using alternating current
US5703281A (en) * 1996-05-08 1997-12-30 Southeastern Univ. Research Assn. Ultra high vacuum pumping system and high sensitivity helium leak detector
JP2002529600A (ja) * 1998-11-06 2002-09-10 シヴァク 高レート・コーティング用のスパッタリング装置および方法
US6488824B1 (en) * 1998-11-06 2002-12-03 Raycom Technologies, Inc. Sputtering apparatus and process for high rate coatings
JP2002203883A (ja) * 2000-12-27 2002-07-19 Shibaura Mechatronics Corp 多層膜の形成装置
US6589657B2 (en) * 2001-08-31 2003-07-08 Von Ardenne Anlagentechnik Gmbh Anti-reflection coatings and associated methods
US6736948B2 (en) * 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
US6837975B2 (en) * 2002-08-01 2005-01-04 Applied Materials, Inc. Asymmetric rotating sidewall magnet ring for magnetron sputtering
US6878207B2 (en) * 2003-02-19 2005-04-12 Energy Conversion Devices, Inc. Gas gate for isolating regions of differing gaseous pressure
DE102004006419A1 (de) * 2004-02-09 2005-09-08 Applied Films Gmbh & Co. Kg Energie- und Medienanschluss für eine aus mehreren Kammern bestehende Beschichtungsanlage
EP1698715A1 (de) * 2005-03-03 2006-09-06 Applied Films GmbH & Co. KG Anlage zum Beschichten eines Substrats und Einschubelement
EP1713110B1 (de) * 2005-04-08 2016-03-09 Applied Materials GmbH & Co. KG Anlage zum Beschichten eines Substrats und Modul
US20060278164A1 (en) * 2005-06-10 2006-12-14 Petrach Philip M Dual gate isolating maintenance slit valve chamber with pumping option
US20070256934A1 (en) * 2006-05-08 2007-11-08 Perata Michael R Apparatus and Method for Coating Substrates With Approximate Process Isolation

Also Published As

Publication number Publication date
JP2008540848A (ja) 2008-11-20
WO2006127267A2 (en) 2006-11-30
EP1882051A4 (en) 2012-01-04
RU2007147465A (ru) 2009-06-27
EP1882051A2 (en) 2008-01-30
WO2006127267A3 (en) 2007-10-04
US20060260938A1 (en) 2006-11-23
KR20080042040A (ko) 2008-05-14

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