TW200709288A - Method for dicing a wafer - Google Patents

Method for dicing a wafer

Info

Publication number
TW200709288A
TW200709288A TW094128813A TW94128813A TW200709288A TW 200709288 A TW200709288 A TW 200709288A TW 094128813 A TW094128813 A TW 094128813A TW 94128813 A TW94128813 A TW 94128813A TW 200709288 A TW200709288 A TW 200709288A
Authority
TW
Taiwan
Prior art keywords
wafer
device area
adhensive
film
reference point
Prior art date
Application number
TW094128813A
Other languages
Chinese (zh)
Other versions
TWI378501B (en
Inventor
Yi-Tsai Lu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94128813A priority Critical patent/TWI378501B/en
Publication of TW200709288A publication Critical patent/TW200709288A/en
Application granted granted Critical
Publication of TWI378501B publication Critical patent/TWI378501B/en

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  • Dicing (AREA)

Abstract

A method for dicing a wafer is disclosed. In the method, a wafer containing a first surface and a second surface opposite the first surface is supplied firstly, herein the first surface contains a device area, a margin around the device area, a plurality of scribe lines used for defining dies on the wafer and a plurality of semiconductor devices formed on the device area. A non-adhensive film is subsequently supplied to cover the device area. Next, an adhensive film is supplied to adhere to the non-adhensive film and the margin. The wafer is then vertically diced from the second surface to a reference point opposite the plurality of scribe lines on the first surface, herein the reference point is at a predetermined distance form the first surface. A singulation step is performed from the reference point to cut the wafer to form a plurality of dies.
TW94128813A 2005-08-23 2005-08-23 Method for dicing a wafer TWI378501B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94128813A TWI378501B (en) 2005-08-23 2005-08-23 Method for dicing a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94128813A TWI378501B (en) 2005-08-23 2005-08-23 Method for dicing a wafer

Publications (2)

Publication Number Publication Date
TW200709288A true TW200709288A (en) 2007-03-01
TWI378501B TWI378501B (en) 2012-12-01

Family

ID=48087849

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94128813A TWI378501B (en) 2005-08-23 2005-08-23 Method for dicing a wafer

Country Status (1)

Country Link
TW (1) TWI378501B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111180322A (en) * 2018-11-13 2020-05-19 华邦电子股份有限公司 Method for cutting wafer
TWI790591B (en) * 2021-04-12 2023-01-21 環球晶圓股份有限公司 Wafer processing system and rework method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111180322A (en) * 2018-11-13 2020-05-19 华邦电子股份有限公司 Method for cutting wafer
CN111180322B (en) * 2018-11-13 2022-05-31 华邦电子股份有限公司 Method for cutting wafer
TWI790591B (en) * 2021-04-12 2023-01-21 環球晶圓股份有限公司 Wafer processing system and rework method thereof

Also Published As

Publication number Publication date
TWI378501B (en) 2012-12-01

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