TW200709288A - Method for dicing a wafer - Google Patents
Method for dicing a waferInfo
- Publication number
- TW200709288A TW200709288A TW094128813A TW94128813A TW200709288A TW 200709288 A TW200709288 A TW 200709288A TW 094128813 A TW094128813 A TW 094128813A TW 94128813 A TW94128813 A TW 94128813A TW 200709288 A TW200709288 A TW 200709288A
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- device area
- adhensive
- film
- reference point
- Prior art date
Links
Landscapes
- Dicing (AREA)
Abstract
A method for dicing a wafer is disclosed. In the method, a wafer containing a first surface and a second surface opposite the first surface is supplied firstly, herein the first surface contains a device area, a margin around the device area, a plurality of scribe lines used for defining dies on the wafer and a plurality of semiconductor devices formed on the device area. A non-adhensive film is subsequently supplied to cover the device area. Next, an adhensive film is supplied to adhere to the non-adhensive film and the margin. The wafer is then vertically diced from the second surface to a reference point opposite the plurality of scribe lines on the first surface, herein the reference point is at a predetermined distance form the first surface. A singulation step is performed from the reference point to cut the wafer to form a plurality of dies.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94128813A TWI378501B (en) | 2005-08-23 | 2005-08-23 | Method for dicing a wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94128813A TWI378501B (en) | 2005-08-23 | 2005-08-23 | Method for dicing a wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200709288A true TW200709288A (en) | 2007-03-01 |
TWI378501B TWI378501B (en) | 2012-12-01 |
Family
ID=48087849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94128813A TWI378501B (en) | 2005-08-23 | 2005-08-23 | Method for dicing a wafer |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI378501B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111180322A (en) * | 2018-11-13 | 2020-05-19 | 华邦电子股份有限公司 | Method for cutting wafer |
TWI790591B (en) * | 2021-04-12 | 2023-01-21 | 環球晶圓股份有限公司 | Wafer processing system and rework method thereof |
-
2005
- 2005-08-23 TW TW94128813A patent/TWI378501B/en active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111180322A (en) * | 2018-11-13 | 2020-05-19 | 华邦电子股份有限公司 | Method for cutting wafer |
CN111180322B (en) * | 2018-11-13 | 2022-05-31 | 华邦电子股份有限公司 | Method for cutting wafer |
TWI790591B (en) * | 2021-04-12 | 2023-01-21 | 環球晶圓股份有限公司 | Wafer processing system and rework method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI378501B (en) | 2012-12-01 |
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