TW200705684A - Flip chip package with reduced thermal stress - Google Patents
Flip chip package with reduced thermal stressInfo
- Publication number
- TW200705684A TW200705684A TW094125295A TW94125295A TW200705684A TW 200705684 A TW200705684 A TW 200705684A TW 094125295 A TW094125295 A TW 094125295A TW 94125295 A TW94125295 A TW 94125295A TW 200705684 A TW200705684 A TW 200705684A
- Authority
- TW
- Taiwan
- Prior art keywords
- thermal stress
- integrated circuit
- packaging substrate
- chip package
- die
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
A flip-chip package includes a packaging substrate; an integrated circuit die affixed to the packaging substrate, wherein the integrated circuit die includes an active integrated circuit surrounded by a peripheral die seal ring therein; and a thermal stress releasing pad disposed in a stress-releasing area that is at a comer of the integrated circuit die outside the die seal ring, wherein the thermal stress releasing pad is connected to the packaging substrate by using a solder bump, which, in turn, is connected to a dummy heat-spreading metal plate embedded in the packaging substrate so as to form a heat shunting path for reducing thermal stress during temperature cycling test.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94125295A TWI260792B (en) | 2005-07-26 | 2005-07-26 | Flip chip package with reduced thermal stress |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94125295A TWI260792B (en) | 2005-07-26 | 2005-07-26 | Flip chip package with reduced thermal stress |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI260792B TWI260792B (en) | 2006-08-21 |
TW200705684A true TW200705684A (en) | 2007-02-01 |
Family
ID=37874852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94125295A TWI260792B (en) | 2005-07-26 | 2005-07-26 | Flip chip package with reduced thermal stress |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI260792B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI451596B (en) * | 2010-07-20 | 2014-09-01 | Epistar Corp | An array-type led device |
TWI450349B (en) * | 2010-08-31 | 2014-08-21 | Global Unichip Corp | Method for detecting the under-fill void in flip chip bga |
-
2005
- 2005-07-26 TW TW94125295A patent/TWI260792B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI260792B (en) | 2006-08-21 |
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