TW200705684A - Flip chip package with reduced thermal stress - Google Patents

Flip chip package with reduced thermal stress

Info

Publication number
TW200705684A
TW200705684A TW094125295A TW94125295A TW200705684A TW 200705684 A TW200705684 A TW 200705684A TW 094125295 A TW094125295 A TW 094125295A TW 94125295 A TW94125295 A TW 94125295A TW 200705684 A TW200705684 A TW 200705684A
Authority
TW
Taiwan
Prior art keywords
thermal stress
integrated circuit
packaging substrate
chip package
die
Prior art date
Application number
TW094125295A
Other languages
Chinese (zh)
Other versions
TWI260792B (en
Inventor
Jui-Meng Jao
Chien-Li Kuo
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW94125295A priority Critical patent/TWI260792B/en
Application granted granted Critical
Publication of TWI260792B publication Critical patent/TWI260792B/en
Publication of TW200705684A publication Critical patent/TW200705684A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

A flip-chip package includes a packaging substrate; an integrated circuit die affixed to the packaging substrate, wherein the integrated circuit die includes an active integrated circuit surrounded by a peripheral die seal ring therein; and a thermal stress releasing pad disposed in a stress-releasing area that is at a comer of the integrated circuit die outside the die seal ring, wherein the thermal stress releasing pad is connected to the packaging substrate by using a solder bump, which, in turn, is connected to a dummy heat-spreading metal plate embedded in the packaging substrate so as to form a heat shunting path for reducing thermal stress during temperature cycling test.
TW94125295A 2005-07-26 2005-07-26 Flip chip package with reduced thermal stress TWI260792B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94125295A TWI260792B (en) 2005-07-26 2005-07-26 Flip chip package with reduced thermal stress

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94125295A TWI260792B (en) 2005-07-26 2005-07-26 Flip chip package with reduced thermal stress

Publications (2)

Publication Number Publication Date
TWI260792B TWI260792B (en) 2006-08-21
TW200705684A true TW200705684A (en) 2007-02-01

Family

ID=37874852

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94125295A TWI260792B (en) 2005-07-26 2005-07-26 Flip chip package with reduced thermal stress

Country Status (1)

Country Link
TW (1) TWI260792B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451596B (en) * 2010-07-20 2014-09-01 Epistar Corp An array-type led device
TWI450349B (en) * 2010-08-31 2014-08-21 Global Unichip Corp Method for detecting the under-fill void in flip chip bga

Also Published As

Publication number Publication date
TWI260792B (en) 2006-08-21

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