TW200705618A - Case for containing solid-state imaging device and solid-state imaging apparatus - Google Patents

Case for containing solid-state imaging device and solid-state imaging apparatus

Info

Publication number
TW200705618A
TW200705618A TW095110401A TW95110401A TW200705618A TW 200705618 A TW200705618 A TW 200705618A TW 095110401 A TW095110401 A TW 095110401A TW 95110401 A TW95110401 A TW 95110401A TW 200705618 A TW200705618 A TW 200705618A
Authority
TW
Taiwan
Prior art keywords
case
state imaging
solid
imaging device
imaging apparatus
Prior art date
Application number
TW095110401A
Other languages
Chinese (zh)
Other versions
TWI371088B (en
Inventor
Tomohiro Sato
Mitsuo Maeda
Shigehide Yoshida
Masayoshi Konishi
Yasuo Matsumi
Original Assignee
Sumitomo Chemical Co
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co, Toshiba Kk filed Critical Sumitomo Chemical Co
Publication of TW200705618A publication Critical patent/TW200705618A/en
Application granted granted Critical
Publication of TWI371088B publication Critical patent/TWI371088B/zh

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B1/00—Border constructions of openings in walls, floors, or ceilings; Frames to be rigidly mounted in such openings
    • E06B1/04—Frames for doors, windows, or the like to be fixed in openings
    • E06B1/26—Frames of plastics
    • E06B1/30—Frames of plastics composed of several parts with respect to the cross-section of the frame itself
    • E—FIXED CONSTRUCTIONS
    • E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
    • E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
    • E06B1/00—Border constructions of openings in walls, floors, or ceilings; Frames to be rigidly mounted in such openings
    • E06B1/04—Frames for doors, windows, or the like to be fixed in openings
    • E06B1/34—Coverings, e.g. protecting against weather, for decorative purposes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

To provide a case for containing a solid-state imaging device in which occurrence of warp can be suppressed during molding operation and poor characteristics due to deformation of the solid-state imaging device caused by deformation of the case by heat applied to the case during packaging operation can be prevented, and to provide a solid-state imaging apparatus. In the hollow resin case molded integrally from a substantially rectangular resin bottom plate and a resin sidewall standing substantially vertically from its circumferential edge and having an insert metal terminal exposing the distal end into the case where the opening can be closed with a transparent plate, the height (c) from the bottom face of the insert metal terminal exposed into the case to a surface for bonding the transparent plate is 0.7-1.8 times of the height (a) from the outer bottom face of the case to the bottom face of the insert metal terminal exposed into the case. The invention includes a solid-state imaging apparatus employing that case.
TW095110401A 2005-03-25 2006-03-24 Case for containing solid-state imaging device and solid-state imaging apparatus TW200705618A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005087439 2005-03-25

Publications (2)

Publication Number Publication Date
TW200705618A true TW200705618A (en) 2007-02-01
TWI371088B TWI371088B (en) 2012-08-21

Family

ID=37015720

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110401A TW200705618A (en) 2005-03-25 2006-03-24 Case for containing solid-state imaging device and solid-state imaging apparatus

Country Status (3)

Country Link
KR (1) KR20060103246A (en)
CN (1) CN1838403B (en)
TW (1) TW200705618A (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3782405B2 (en) * 2003-07-01 2006-06-07 松下電器産業株式会社 Solid-state imaging device and manufacturing method thereof

Also Published As

Publication number Publication date
CN1838403A (en) 2006-09-27
TWI371088B (en) 2012-08-21
CN1838403B (en) 2010-06-16
KR20060103246A (en) 2006-09-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees