TW200705103A - Curing accelerator, thermosetting resin composition, photo-sensitive composition and photo-sensitive film, permanent pattern and process for forming the same - Google Patents

Curing accelerator, thermosetting resin composition, photo-sensitive composition and photo-sensitive film, permanent pattern and process for forming the same

Info

Publication number
TW200705103A
TW200705103A TW095120895A TW95120895A TW200705103A TW 200705103 A TW200705103 A TW 200705103A TW 095120895 A TW095120895 A TW 095120895A TW 95120895 A TW95120895 A TW 95120895A TW 200705103 A TW200705103 A TW 200705103A
Authority
TW
Taiwan
Prior art keywords
photo
curing
curing accelerator
sensitive
composition
Prior art date
Application number
TW095120895A
Other languages
Chinese (zh)
Inventor
Takashi Tamura
Toshiaki Hayashi
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200705103A publication Critical patent/TW200705103A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The invention provides a curing accelerator having excellent storage stability without causing a reaction during storage at normal temperature, of which the curing-accelerating efficiency and the heat cross-linking efficiency by means of heating could be found and good film hardness of a curing film could be obtained by initialing a reaction among epoxy resin compounds and the like and curing them; a thermosetting resin composition obtained by using the said curing accelerator, which is possibly cured by heating and can found excellent storage stability and excellent chemicals-resistance, hardness, dielectric characteristics, electrical insulating property and so on after curing; a photo-sensitive composition obtained by using the aforesaid curing accelerator, which is possibly forming an image by UV exposing, tack property of surface is small, laminating property and treating quality are good, excellent storage stability, high sensitivity, excellent developing property and can found excellent chemicals-resistance, surface hardness, heat resistance, dielectric characteristics, electrical insulating property and so on after curing; a photo-sensitive film using the composition, as well as provides a permanent pattern with high fineness and a process for efficiently forming thereof. A curing accelerator is characterized in it is a structure that produces an amine by external stimulation and has a ratio of 1:1 of carboxyl group to amide group in the molecule. Further, a thermosetting resin composition at least comprises a epoxy resin compound and the aforesaid curing accelerator of the invention. Furthermore, a photo-sensitive composition at least comprises a polymer having 1 or more carboxyl groups and any of ester group in 1 molecule, a polymerizable compound, a photo polymerization initiator, a heat cross-linking agent and the aforesaid curing accelerator of the invention; as well as a permanent pattern with high fineness and a process for efficiently forming thereof.
TW095120895A 2005-06-14 2006-06-13 Curing accelerator, thermosetting resin composition, photo-sensitive composition and photo-sensitive film, permanent pattern and process for forming the same TW200705103A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005174323 2005-06-14
JP2005329063A JP2007023254A (en) 2005-06-14 2005-11-14 Curing promoter, thermosetting resin composition, photosensitive composition and photosensitive film, and permanent pattern and method for forming the same

Publications (1)

Publication Number Publication Date
TW200705103A true TW200705103A (en) 2007-02-01

Family

ID=37532209

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095120895A TW200705103A (en) 2005-06-14 2006-06-13 Curing accelerator, thermosetting resin composition, photo-sensitive composition and photo-sensitive film, permanent pattern and process for forming the same

Country Status (3)

Country Link
JP (1) JP2007023254A (en)
TW (1) TW200705103A (en)
WO (1) WO2006134846A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103324029A (en) * 2012-03-23 2013-09-25 太阳油墨（苏州）有限公司 Photosensitive resin composition and cured product thereof, and printed circuit board

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007106886A (en) * 2005-10-13 2007-04-26 Fujifilm Corp Curing accelerator, thermosetting resin composition, photosensitive composition, photosensitive film, permanent pattern and method for forming it
JP4790460B2 (en) * 2006-03-24 2011-10-12 富士フイルム株式会社 Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method, and printed circuit board
JP5361371B2 (en) * 2008-12-26 2013-12-04 株式会社日本触媒 Photosensitive resin composition
JP5471851B2 (en) * 2010-06-03 2014-04-16 Ｊｓｒ株式会社 Radiation-sensitive resin composition, cured film, method for forming cured film, and display element
JP5771944B2 (en) * 2010-10-18 2015-09-02 Jsr株式会社 Manufacturing method of color filter

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6475555A (en) * 1987-09-17 1989-03-22 Ajinomoto Kk Epoxy resin composition
DE4136573A1 (en) * 1991-11-07 1993-07-08 Witco Gmbh N-AMINOALKYLIMIDAZOLE COMPOUNDS CONTAINING AMID AND CARBOXYL GROUPS AND THE USE THEREOF AS A CURING AGENT FOR EPOXY RESINS
JPH09133983A (en) * 1995-06-12 1997-05-20 Fuji Photo Film Co Ltd Silver halide photographic sensitive material and hydroxamic acid compound used therefor
JP3649497B2 (en) * 1996-01-23 2005-05-18 旭電化工業株式会社 Curing agent composition for epoxy resin
WO1997040825A1 (en) * 1996-05-02 1997-11-06 Merck & Co., Inc. Hiv protease inhibitors useful for the treatment of aids
JP3496790B2 (en) * 1996-06-19 2004-02-16 富士写真フイルム株式会社 Silver halide photographic material
JP2003165827A (en) * 2001-11-29 2003-06-10 Mitsubishi Gas Chem Co Inc Photosensitive thermosetting resin composition
JP3895220B2 (en) * 2002-06-25 2007-03-22 太陽インキ製造株式会社 Thermosetting resin composition and printed wiring board produced using the same
JP2004333672A (en) * 2003-05-02 2004-11-25 Kanegafuchi Chem Ind Co Ltd Photosensitive resin composition and photosensitive dry film resist with favorable storage stability, and use method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103324029A (en) * 2012-03-23 2013-09-25 太阳油墨（苏州）有限公司 Photosensitive resin composition and cured product thereof, and printed circuit board
CN103324029B (en) * 2012-03-23 2016-01-13 太阳油墨（苏州）有限公司 Photosensitive polymer combination and solidfied material thereof and printed circuit board (PCB)

Also Published As

Publication number Publication date
WO2006134846A1 (en) 2006-12-21
JP2007023254A (en) 2007-02-01

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