TW200704316A - Method to mount solid solder on printed-ciruit board - Google Patents

Method to mount solid solder on printed-ciruit board

Info

Publication number
TW200704316A
TW200704316A TW094123252A TW94123252A TW200704316A TW 200704316 A TW200704316 A TW 200704316A TW 094123252 A TW094123252 A TW 094123252A TW 94123252 A TW94123252 A TW 94123252A TW 200704316 A TW200704316 A TW 200704316A
Authority
TW
Taiwan
Prior art keywords
circuit board
several
printed circuit
printed
adapting base
Prior art date
Application number
TW094123252A
Other languages
English (en)
Chinese (zh)
Other versions
TWI299643B (https=
Inventor
Ming-Jin Ji
Original Assignee
Ming-Jin Ji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ming-Jin Ji filed Critical Ming-Jin Ji
Priority to TW094123252A priority Critical patent/TW200704316A/zh
Publication of TW200704316A publication Critical patent/TW200704316A/zh
Application granted granted Critical
Publication of TWI299643B publication Critical patent/TWI299643B/zh

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW094123252A 2005-07-08 2005-07-08 Method to mount solid solder on printed-ciruit board TW200704316A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094123252A TW200704316A (en) 2005-07-08 2005-07-08 Method to mount solid solder on printed-ciruit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094123252A TW200704316A (en) 2005-07-08 2005-07-08 Method to mount solid solder on printed-ciruit board

Publications (2)

Publication Number Publication Date
TW200704316A true TW200704316A (en) 2007-01-16
TWI299643B TWI299643B (https=) 2008-08-01

Family

ID=45069749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123252A TW200704316A (en) 2005-07-08 2005-07-08 Method to mount solid solder on printed-ciruit board

Country Status (1)

Country Link
TW (1) TW200704316A (https=)

Also Published As

Publication number Publication date
TWI299643B (https=) 2008-08-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees