TW200703689A - Dispensing liquid-state resin package method - Google Patents

Dispensing liquid-state resin package method

Info

Publication number
TW200703689A
TW200703689A TW094123551A TW94123551A TW200703689A TW 200703689 A TW200703689 A TW 200703689A TW 094123551 A TW094123551 A TW 094123551A TW 94123551 A TW94123551 A TW 94123551A TW 200703689 A TW200703689 A TW 200703689A
Authority
TW
Taiwan
Prior art keywords
resin
liquid
package
state
substrate
Prior art date
Application number
TW094123551A
Other languages
English (en)
Other versions
TWI296856B (zh
Inventor
zhi-shan Peng
Original Assignee
zhi-shan Peng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by zhi-shan Peng filed Critical zhi-shan Peng
Priority to TW094123551A priority Critical patent/TW200703689A/zh
Publication of TW200703689A publication Critical patent/TW200703689A/zh
Application granted granted Critical
Publication of TWI296856B publication Critical patent/TWI296856B/zh

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW094123551A 2005-07-12 2005-07-12 Dispensing liquid-state resin package method TW200703689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094123551A TW200703689A (en) 2005-07-12 2005-07-12 Dispensing liquid-state resin package method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094123551A TW200703689A (en) 2005-07-12 2005-07-12 Dispensing liquid-state resin package method

Publications (2)

Publication Number Publication Date
TW200703689A true TW200703689A (en) 2007-01-16
TWI296856B TWI296856B (zh) 2008-05-11

Family

ID=45068895

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094123551A TW200703689A (en) 2005-07-12 2005-07-12 Dispensing liquid-state resin package method

Country Status (1)

Country Link
TW (1) TW200703689A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102751355A (zh) * 2012-07-20 2012-10-24 中利腾晖光伏科技有限公司 一种防溢出式晶体硅太阳能组件

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102751355A (zh) * 2012-07-20 2012-10-24 中利腾晖光伏科技有限公司 一种防溢出式晶体硅太阳能组件

Also Published As

Publication number Publication date
TWI296856B (zh) 2008-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees